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CN-121984470-A - Elastic wave device and electronic product

CN121984470ACN 121984470 ACN121984470 ACN 121984470ACN-121984470-A

Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to an elastic wave device and an electronic product. The piezoelectric substrate is provided with a plurality of wall structures, a plurality of IDT electrodes are arranged on the piezoelectric substrate and positioned in the cavities, a cover layer is arranged on the wall structures, the cover layer is provided with slits exposing the wall structures, and a wiring layer is arranged on the cover layer and connected with the wall structures through the slits. By the arrangement, the heat dissipation performance of the device can be effectively improved.

Inventors

  • Lian Jingri

Assignees

  • 三安日本科技株式会社

Dates

Publication Date
20260505
Application Date
20251226

Claims (12)

  1. 1. An elastic wave device is characterized in that the elastic wave device comprises: A piezoelectric substrate; The plurality of wall structures are arranged on the piezoelectric substrate and form a cavity; An IDT electrode provided on the piezoelectric substrate and located in the cavity; a cover layer disposed over the wall structure, the cover layer having a slit exposing the wall structure; And the rewiring layer is arranged on the covering layer and is connected with the wall structure through the slit.
  2. 2. The elastic wave device of claim 1, wherein the slit extends through the cap layer.
  3. 3. The elastic wave device according to claim 1, further comprising a wiring metal layer between the wall structure and the piezoelectric substrate, wherein the slit is disposed over the wiring metal layer.
  4. 4. The elastic wave device according to claim 1, wherein the rewiring layer filled at the slit is grounded.
  5. 5. The elastic wave device according to claim 1, wherein the rewiring layer comprises a metallic material.
  6. 6. The elastic wave device according to claim 1, wherein the slit has an inverted trapezoid shape.
  7. 7. The elastic wave device according to claim 1, wherein the slit has a first width on a side close to the wall structure, and the first width is in a range of 10-50 micrometers.
  8. 8. The elastic wave device according to claim 7, wherein a side of the wall structure adjacent to the cover layer has a second width, and the first width is smaller than the second width.
  9. 9. The elastic wave device according to claim 8, wherein the thickness of the wall structure is in a range of 5-30 micrometers, and the second width is in a range of 11-100 micrometers.
  10. 10. The elastic wave device according to claim 1, further comprising a solder layer provided on the rewiring layer.
  11. 11. The elastic wave device according to claim 1, wherein the elastic wave device has a high power region and a low power region in plan view, the high power region having an operating power higher than that of the low power region, and the slit is located in the high power region.
  12. 12. An electronic product, characterized in that the electronic product comprises an elastic wave device and a circuit substrate, wherein the elastic wave device is arranged on the circuit substrate, and the elastic wave device is the elastic wave device according to any one of claims 1-11.

Description

Elastic wave device and electronic product Technical Field The present invention relates to the field of semiconductor manufacturing technology, and in particular, to an elastic wave device and an electronic product. Background Wafer level packaging (WLP, wafer Level Package) is one mainstream packaging form of the filter, and is an advanced packaging technology that directly completes the manufacture of the protection layer, the interconnection structure and the solder balls on the wafer and finally cuts the wafer into independent chips. The core logic is contrary to conventional packaging, which is to cut wafers first and then package, and WLP is to cut first and then package. At present, wafer level packaging technology has been widely used, however, with the improvement of performance requirements of manufacturers, the current wafer level packaging technology needs to be improved in terms of heat dissipation capability, so how to improve the heat dissipation capability of devices has become one of the technical difficulties that are needed to be solved by those skilled in the art. It should be noted that the information disclosed in this background section is only for the purpose of increasing the understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person of ordinary skill in the art. Disclosure of Invention The invention provides an elastic wave device, which comprises a piezoelectric substrate, a plurality of wall structures, an IDT electrode, a cover layer and a rewiring layer. The wall structures are arranged on the piezoelectric substrate and are formed with cavities. The IDT electrode is disposed on the piezoelectric substrate and within the cavity. The cover layer is arranged on the wall structure and is provided with a slit exposing the wall structure. The rewiring layer is arranged on the covering layer and connected with the wall body structure through the slit. Further, the slit extends through the cap layer. Further, the elastic wave device further comprises a wiring metal layer, the wiring metal layer is located between the wall structure and the piezoelectric substrate, and the slit is correspondingly arranged above the wiring metal layer. Further, the rewiring layer filled at the slit is grounded. Further, the rewiring layer includes a metal material. Further, the slit is in an inverted trapezoid shape. Further, a first width is arranged on one side, close to the wall structure, of the slit, and the range of the first width is 10-50 microns. Further, a side of the wall structure, which is close to the covering layer, is provided with a second width, and the first width is smaller than the second width. Further, the thickness of the wall structure is in the range of 5-30 micrometers, and the second width is in the range of 11-100 micrometers. Further, the elastic wave device further includes a solder layer provided on the rewiring layer. Further, in a top view, the elastic wave device is provided with a high power area and a low power area, the working power of the high power area is higher than that of the low power area, and the slit is located in the high power area. The invention also provides an electronic product, which comprises an elastic wave device and a circuit substrate, wherein the elastic wave device is arranged on the circuit substrate, and the elastic wave device adopts the elastic wave device as in any one of the above. According to the elastic wave device and the electronic product provided by the invention, the slit is formed in the cover layer, and the wiring layer is connected to the wall structure through the slit, so that a shorter path can be provided for leading out electricity (if the slit is not formed, the electricity is led out from the outermost side, and the heat of the device is serious due to the overlong path), thereby improving the heat dissipation performance of the device. Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Drawings In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, a brief description will be given below of the drawings required for the embodiments or the prior art descriptions, and it is obvious that some of the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. FIG. 1 is a schematic view of an elastic wave device according to an embodiment of the present invention; FIG. 2 is a schematic perspective view of an elastic wave device according to an embodiment of the present invention; fig. 3 is a perspective view of a conventional el