CN-121984604-A - Ultrasonic back scattering type metal signal and energy separation wireless simultaneous transmission system and method

CN121984604ACN 121984604 ACN121984604 ACN 121984604ACN-121984604-A

Abstract

The invention discloses an ultrasonic back scattering type metal signal and energy wireless simultaneous transmission system and method, wherein the system comprises a transmitting end and a receiving end, and the transmitting end comprises a signal generating device, a power amplifying circuit, a first impedance matching circuit and an ultrasonic transmitting transducer which are sequentially arranged; the first impedance matching circuit is used for ensuring conjugate matching of the load impedance and the source impedance of the transducer to realize maximum power transmission, and the ultrasonic transmitting transducer is used for converting an electric signal into mechanical vibration by utilizing an inverse piezoelectric effect to generate ultrasonic waves; the receiving end is arranged in the airtight metal and comprises an ultrasonic receiving transducer, a second impedance matching circuit and a rectifying voltage stabilizing and energy collecting circuit which are sequentially arranged, wherein the ultrasonic receiving transducer converts received ultrasonic waves into electric energy by utilizing positive piezoelectric effect and controls the reflectivity of an incident carrier wave to transmit binary signals to the transmitting end through OOK modulation. The system has simple structure and low power consumption, and realizes synchronous transmission of energy and data.

Inventors

CHEN SHE
FENG BING
Wang Qianwang
TAN CONGCONG
WANG FENG
ZHONG LIPENG
SUN QIUQIN

Assignees

湖南大学

Dates

Publication Date: 20260505
Application Date: 20260130

Claims (8)

1. The ultrasonic back scattering type metal signal isolation and energy wireless simultaneous transmission system is characterized by comprising a transmitting end and a receiving end, wherein the transmitting end comprises a signal generating device, a power amplifying circuit, a first impedance matching circuit and an ultrasonic transmitting transducer which are sequentially arranged, the signal generating device is a first singlechip and is used for sending high-frequency electric signals to the power amplifying circuit, the power amplifying circuit is used for carrying out boosting and power amplifying treatment on the high-frequency electric signals, the first impedance matching circuit is used for ensuring conjugate matching between the load impedance of the transducer and the source impedance to realize maximum power transmission, and the ultrasonic transmitting transducer is used for converting the electric signals into mechanical vibration by utilizing an inverse piezoelectric effect to generate ultrasonic waves and transmitting the ultrasonic waves to the receiving end; The receiving end is arranged in the airtight metal and comprises an ultrasonic receiving transducer, a second impedance matching circuit and a rectifying voltage stabilizing and energy collecting circuit which are sequentially arranged, wherein the ultrasonic receiving transducer is used for converting received ultrasonic waves into electric energy by utilizing positive piezoelectric effect and transmitting the electric energy to the second impedance matching circuit, the second impedance matching circuit is used for ensuring conjugate matching of load impedance of the transducer and source impedance to realize maximum power transmission, and the rectifying voltage stabilizing and energy collecting circuit rectifies received high-frequency alternating current into direct current and feeds the direct current into a super capacitor to be stored for supplying power to the sensor and the second singlechip; The transmitting end further comprises a signal receiving circuit which is arranged between the ultrasonic transmitting transducer and the first singlechip, the sensor is used for collecting temperature data in the sealed metal and transmitting the temperature data to the second singlechip, the temperature data are transmitted to the signal receiving circuit of the transmitting end through the second singlechip, and the signal receiving circuit is used for detecting and analyzing a modulation signal reflected from the interior of the metal sealed space, converting sensor information contained in the reflected sound wave into a digital signal and transmitting the digital signal to the first singlechip.
2. The ultrasonic back scattering type metal signal isolation and energy wireless co-transmission system according to claim 1, wherein the second impedance matching circuit is further used for receiving a control signal of the single chip microcomputer, and binary on-off keying is adopted to control the reflection intensity of ultrasonic waves through the impedance modulation circuit so as to complete binary data transmission.
3. The ultrasonic back-scattering type metal signal and energy wireless co-transmission system according to claim 2, wherein the binary on-off keying mode is specifically as follows: The binary on-off keying modulation '1' and '0' respectively correspond to the opening and closing of the switch, the closing and opening of the switch determine whether the impedance of the reflecting device is matched with the load impedance, when the second singlechip outputs '0', the switch is closed to indicate that the ultrasonic receiving transducer is matched with the load impedance, the energy of the incident sound wave is absorbed at the moment and no reflection is generated, the receiving end cannot receive a reflection signal, and when the second singlechip outputs '1', the switch is opened to indicate that the impedance of the ultrasonic receiving transducer is not matched with the load impedance, and the incident sound wave is reflected back at the moment.
4. The ultrasonic back scattering type metal signal isolation and energy wireless simultaneous transmission system of claim 1 is characterized in that the signal receiving circuit comprises a signal sampling circuit, an envelope detection circuit and an operation comparison circuit, wherein a resistor voltage waveform on an impedance matching circuit is sampled through the signal sampling circuit, high-frequency noise and low-frequency noise are filtered through the envelope detection circuit, the filtered electric signals are rectified into direct current through a half wave, the voltage is stabilized in a short time through an RC circuit, then the direct current is compared with a set reference voltage, and if the voltage is higher than the reference voltage, a '1' is judged, otherwise a '0' is judged, and finally the electric signals are input to a first single chip microcomputer through serial port pins of the single chip microcomputer, and the first single chip microcomputer decodes the electric signals into data detected by a sensor.
5. The ultrasonic backscatter type metal-isolated signal and energy wireless co-transmission system of claim 4 wherein the signal receiving circuit is designed around a detection time constant and the core equation is: Wherein, the For the output signal voltage of the envelope detection circuit, For the input signal voltage of the envelope detection circuit, In order to observe the time period of the observation, As the integral time variable, RC is the time constant of the envelope detection circuit, and T is satisfied c RC T s ,T c is the carrier period, and T s is the modulation signal period.
6. The ultrasonic back scattering type metal signal isolation and energy wireless co-transmission system according to claim 1, wherein the rectifying and voltage stabilizing and energy collecting circuit is composed of a full-wave bridge rectifying circuit, an energy storage circuit and a voltage stabilizing circuit, the full-wave bridge rectifying circuit converts high-frequency alternating current received by an ultrasonic receiving transducer into full-wave direct current, the super capacitor stores electric energy, and the voltage stabilizing circuit stably outputs the stored electric energy to the sensor and the second singlechip.
7. An ultrasonic back scattering type metal signal and energy wireless co-transmission method applied to the ultrasonic back scattering type metal signal and energy wireless co-transmission system as set forth in any one of claims 1 to 6, characterized by comprising the following steps: the transmitting end generates a high-frequency ultrasonic signal, and the ultrasonic signal penetrates through the closed metal medium; the receiving end converts the received ultrasonic signals into electric energy through an ultrasonic receiving transducer, and supplies power to the internal sensor and the second singlechip through a rectifying voltage-stabilizing and energy collecting circuit; and the second singlechip modulates the impedance matching circuit of the receiving end to control the reflection intensity of the sound wave, and transmits signals in a binary data coding mode.
8. A non-transitory computer readable storage medium having stored thereon a computer program, wherein the computer program when executed by a processor implements an ultrasonic backscatter metal signal and energy wireless co-transmission method according to claim 7.

Description

Ultrasonic back scattering type metal signal and energy separation wireless simultaneous transmission system and method Technical Field The invention relates to the technical field of wireless energy supply, in particular to an ultrasonic back scattering type metal signal isolation and energy wireless simultaneous transmission system and method. Background Along with the continuous improvement of the performance of modern high and new technology and modern equipment, the airtight metal structure is widely used for resisting extreme working conditions such as high temperature, high pressure, toxic or strong electromagnetic radiation and the like. To monitor the internal state of the structure, a stable energy supply and signal transmission channel is usually established between the built-in sensor and the external system. The traditional method is to perforate the metal closed shell, and realize the transmission of electric energy and signals through wire connection. However, this approach can compromise the structural integrity of the container, impair its overall reliability, significantly increase maintenance costs over the life cycle, and may cause a series of problems such as internal media leakage, pressure imbalance, or vacuum failure. Therefore, the technology for wirelessly supplying power to the sensor in the closed structure and realizing wireless transmission of monitoring signals across the metal wall on the premise of not damaging the metal wall is researched, and the technology has important application value. Conventional metal-isolated wireless power and data transmission mainly comprises inductive coupling, electric field coupling and magnetic resonance coupling. Both inductive and magnetic resonance couplings rely on alternating magnetic fields, which when applied to a metal conductor induce an encircling eddy current, i.e. "eddy currents", in its surface layer. The physical phenomenon has two fatal consequences, namely, firstly, the induced vortex can generate a reverse magnetic field with the direction opposite to that of the original magnetic field, and strongly repel and reflect most of incident magnetic energy to form a remarkable electromagnetic shielding effect, secondly, the vortex can be directly converted into Joule heat under the effect of limited resistance of metal, so that energy is greatly consumed, and the phenomena are extremely limited in penetrating the thickness of the metal. Whereas the electric field coupling relies on a high frequency alternating electric field. The metal is a good conductor, and a large amount of free electrons exist in the metal, which attracts electric field lines, so that the electric field is severely distorted or even short-circuited, and effective coupling capacitance cannot be established on two sides of the metal. Whereas conventional sensor nodes for ultrasonic signal transmission require active generation of an acoustic signal. This means that a sufficient amount of energy is required to drive the internal piezoelectric transducer into vibration, causing it to emit sound waves of sufficient intensity, which is very energy-consuming. The USWPT metal-isolated wireless charging device of Cai Changsong can realize metal-penetrating wireless charging and data transmission, but the transmitting and receiving units are provided with more complex signal processing modules, and can transmit and receive signals once at intervals, so that the real-time signal transmission is difficult. The GIS bus electric connection area temperature monitoring device provided by Cao Pei also adopts ultrasonic wave for signal transmission, and the principle is that a signal modulation circuit and a temperature sensor are utilized to acquire a characteristic frequency pulse signal, and then internal temperature data is calculated through the mapping relation between frequency and a sensor resistance value, however, the application range of the data transmission mode is limited, and only very simple information can be processed. Wang Jingyi, a signal transmitting circuit of the ultrasonic wireless power supply and signal transmission circuit, a high-voltage isolating switch detection system and a detection method thereof need to actively generate pwm signals to modulate impedance so as to drive a transducer to transmit signals, the required power consumption is relatively high, and synchronous transmission of the signals and energy is difficult to realize. In summary, it is known that providing energy for the sensor in the closed metal space of the modern equipment in a wireless energy supply manner, and realizing real-time detection of the internal state of the closed metal container, and the sensor is an urgent need in various application fields. Disclosure of Invention The invention aims to provide an ultrasonic back scattering type metal signal and energy wireless co-transmission system and method, the system has simple structure and low power consumption, and real