CN-121985269-A - Integrated injection molding loudspeaker, manufacturing method and electronic equipment
Abstract
The invention provides an integrated injection molding loudspeaker, a manufacturing method and electronic equipment, wherein the integrated injection molding loudspeaker comprises a first sound cavity bracket, a second sound cavity bracket, a magnetic circuit component, a vibration component and a flexible circuit board, wherein the magnetic circuit component is wrapped by plastic through an in-mold injection molding process and is integrated with the first sound cavity bracket, the vibration component is assembled on the second sound cavity bracket in an adhesive manner, the flexible circuit board is welded on the vibration component to realize circuit conduction, and the first sound cavity bracket and the second sound cavity bracket are fixedly connected in an ultrasonic welding manner. The magnetic circuit component is wrapped by plastic through an in-mold injection molding process and is integrated with the first sound cavity bracket, so that the magnetic circuit component and the first sound cavity bracket form a gapless rigid connection structure, the key part is not required to be sealed by adopting a gluing process, and the core pain point where the glue consumption is difficult to control is thoroughly avoided.
Inventors
- SU JIACAI
- WANG LONGHUI
- Zheng Zukong
Assignees
- 厦门东声电子有限公司
Dates
- Publication Date
- 20260505
- Application Date
- 20260123
Claims (10)
- 1. The integrated injection molding loudspeaker is characterized by comprising a first sound cavity support (1), a second sound cavity support (2), a magnetic circuit assembly (3), a vibration assembly (4) and a flexible circuit board (5), wherein the magnetic circuit assembly (3) is wrapped by plastic through an in-mold injection molding process and is integrated with the first sound cavity support (1), the vibration assembly (4) is assembled on the second sound cavity support (2) in an adhesive mode, the flexible circuit board (5) is welded on the vibration assembly (4) to realize circuit conduction, and the first sound cavity support (1) and the second sound cavity support (2) are fixedly connected in an ultrasonic welding mode.
- 2. The integrated injection molding loudspeaker according to claim 1, wherein the first sound cavity bracket (1) and the second sound cavity bracket (2) are closed to form an installation space (A) and a hollowed-out space (B), and the vibration component (4) and the flexible circuit board (5) are arranged in the installation space (A).
- 3. The integrated injection molding loudspeaker according to claim 2, wherein the first sound cavity bracket (1) is provided with a through hole (11) communicated with the hollowed-out space (B), and a damping net (6) is stuck at the opening of the through hole (11).
- 4. The integrated injection molding loudspeaker according to claim 1, wherein the magnetic circuit assembly (3) comprises a U-shaped iron (31), a magnet (32) and a magnetic core (33), and the U-shaped iron (31), the magnet (32) and the magnetic core (33) are fixedly connected in an adhesive manner and assembled to form the magnetic circuit assembly (3).
- 5. The speaker of claim 4, wherein the vibration component (4) comprises a base frame (41), a vibrating diaphragm (42) and a voice coil (43), the base frame (41), the vibrating diaphragm (42) and the voice coil (43) are fixedly connected through gluing and assembled to form the vibration component (4), and the flexible circuit board (5) is welded on the base frame (41).
- 6. The integrated injection molding loudspeaker according to claim 5, wherein a turnover part (311) extending towards the second sound cavity bracket (2) is arranged around the U-shaped iron (31), and the magnet (32) and the magnetic core (33) are sequentially and centrally glued and attached to the lower end of the U-shaped iron (31); The vibrating diaphragm (42) is adhered to the lower end of the base frame (41), the voice coil (43) is arranged in the hollow part of the base frame (41), a first yielding groove (44) is formed between the base frame (41) and the voice coil (43), and the turnover part (311) is embedded in the first yielding groove (44); a second yielding groove (34) is formed between the U-shaped iron (31) and the magnet (32) and the magnetic core (33), and the upper end of the voice coil (43) is embedded into the second yielding groove (34).
- 7. The integrated injection molding loudspeaker according to claim 8, wherein a sound amplifying space (C) is arranged between the lower end of the vibrating diaphragm (42) and the second sound cavity bracket (2), and the second sound cavity bracket (2) is provided with an inclined sound outlet hole (D) which is communicated with the outside and the sound amplifying space (C).
- 8. The integrally molded loudspeaker as claimed in claim 7, wherein the diaphragm (42) is provided with an annular recess (421).
- 9. A method of manufacturing an integrated injection molded speaker as claimed in any one of claims 1 to 8, comprising the steps of: S1, fixedly connecting U-shaped iron (31), a magnet (32) and a magnetic core (33) in an adhesive manner, and assembling to form a magnetic circuit assembly (3); S2, placing the magnetic circuit assembly (3) obtained in the step S1 into an injection mold, injecting plastic materials into the mold by adopting an in-mold injection molding process, and after injection molding, wrapping the magnetic circuit assembly (3) by plastic and integrating the magnetic circuit assembly with the first sound cavity bracket (1) to obtain the first sound cavity bracket (1) with the magnetic circuit assembly (3); S3, fixedly connecting the base frame (41), the vibrating diaphragm (42) and the voice coil (43) in an adhesive manner, assembling to form a vibration assembly (4), and assembling the vibration assembly (4) on the second sound cavity bracket (2) in an adhesive manner; S4, welding the flexible circuit board (5) on the base frame (41) of the vibration assembly (4) in the step S3 to realize circuit conduction; S5, fixedly connecting the first sound cavity bracket (1) with the magnetic circuit assembly (3) obtained in the step S2 with the second sound cavity bracket (2) provided with the vibration assembly (4) and the flexible circuit board (5) obtained in the step S4 in an ultrasonic welding mode.
- 10. An electronic device comprising an integrally injection molded speaker according to any one of claims 1 to 8.
Description
Integrated injection molding loudspeaker, manufacturing method and electronic equipment Technical Field The invention relates to the technical field of acoustics, in particular to an integrally injection molded loudspeaker. Background As a conventional electroacoustic transducer for converting electric energy into acoustic energy, a micro-speaker is disclosed in chinese patent document CN103338424 a. In order to adapt to the height limitation of various installation spaces, the design of magnetic frame (equivalent to U iron) leakage is adopted to save the installation height, in the scheme, the magnetic frame and the bracket are sealed by adopting a glue spraying process, glue permeates along a gap between the magnetic frame and the bracket (equivalent to the first sound cavity bracket) of the invention, if the glue is used too much and before the glue is solidified, the glue is easy to permeate into a vibration assembly, the performance of internal parts of the vibration assembly is damaged, the product is finally caused, and if the glue is insufficient, the sealing is poor. Disclosure of Invention Aiming at the defects in the prior art, the invention aims to provide an integrated injection molding loudspeaker, a manufacturing method and electronic equipment, and solves the problems in the background art. The invention is realized by the following technical scheme: The integrated injection molding loudspeaker comprises a first sound cavity support, a second sound cavity support, a magnetic circuit assembly, a vibration assembly and a flexible circuit board, wherein the magnetic circuit assembly is wrapped by plastic through an in-mold injection molding process and is integrated with the first sound cavity support, the vibration assembly is assembled on the second sound cavity support in an adhesive mode, the flexible circuit board is welded on the vibration assembly to realize circuit conduction, and the first sound cavity support is fixedly connected with the second sound cavity support in an ultrasonic welding mode. Further, the first sound cavity support and the second sound cavity support are closed to form an installation space and a hollowed-out space, and the vibration assembly and the flexible circuit board are arranged in the installation space. Further, the first sound cavity bracket is provided with a through hole communicated with the hollowed-out space, and a damping net is stuck at the opening of the through hole. Further, the magnetic circuit assembly comprises U-shaped iron, a magnet and a magnetic core, wherein the U-shaped iron, the magnet and the magnetic core are fixedly connected in an adhesive mode and assembled to form the magnetic circuit assembly. Further, the vibration assembly comprises a base frame, a vibrating diaphragm and a voice coil, wherein the base frame, the vibrating diaphragm and the voice coil are fixedly connected in an adhesive mode and assembled to form the vibration assembly, and the flexible circuit board is welded to the base frame. Further, a turnover part extending towards the second sound cavity support is arranged around the U-shaped iron, the magnet and the magnetic core are sequentially and centrally glued and attached to the lower end of the U-shaped iron, the vibrating diaphragm is glued and attached to the lower end of the base frame, the voice coil is arranged at the hollow part of the base frame, a first yielding groove is arranged between the base frame and the voice coil, the turnover part is embedded in the first yielding groove, a second yielding groove is arranged between the U-shaped iron and the magnet and the magnetic core, and the upper end of the voice coil is embedded in the second yielding groove. Further, a sound amplifying space is arranged between the lower end of the vibrating diaphragm and the second sound cavity support, and the second sound cavity support is provided with an inclined sound outlet hole for communicating the outside with the sound amplifying space. Further, the diaphragm is provided with an annular concave portion. In another aspect, the present invention provides a method for manufacturing an integrated injection speaker according to any one of the above, including the following steps: S1, fixedly connecting a U iron, a magnet and a magnetic core in an adhesive manner, and assembling to form a magnetic circuit assembly; S2, placing the magnetic circuit assembly obtained in the step S1 into an injection mold, injecting plastic materials into the mold by adopting an in-mold injection molding process, and after injection molding, wrapping the magnetic circuit assembly by plastic and integrating the magnetic circuit assembly with a first sound cavity bracket to obtain a first sound cavity bracket with the magnetic circuit assembly; s3, fixedly connecting the base frame, the vibrating diaphragm and the voice coil in an adhesive manner, assembling to form a vibration assembly, and assembling the vibration assembly on a sec