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CN-121985275-A - Package structure and microphone

CN121985275ACN 121985275 ACN121985275 ACN 121985275ACN-121985275-A

Abstract

The invention relates to the technical field of chip packaging, in particular to a packaging structure and a microphone. The packaging structure comprises a shell and a substrate, wherein the shell and the substrate are encircled to form a packaging cavity, one side of the substrate facing the packaging cavity is provided with a mounting groove, the mounting groove is internally provided with an acoustic hole, the packaging structure further comprises an MEMS chip, at least part of the packaging structure is arranged in the mounting groove along the height direction of the substrate and communicated with the acoustic hole, the packaging structure further comprises an ASIC chip, the packaging structure is arranged on one side of the substrate facing the packaging cavity and is respectively electrically connected with the MEMS chip and the substrate, and the packaging structure further comprises an adhesive part, and the adhesive part is arranged between the MEMS chip and the mounting groove and is respectively connected with the MEMS chip and the mounting groove. Realize the installation of MEMS chip subsidence through the mounting groove, reduce the direction of height stromatolite and occupy, reduce the encapsulation overall height, the bonding portion utilizes the inslot clearance to realize fixed location and seal, reduces the thick glue film in bottom and takes up a high risk to improve assembly stability and sealing reliability, thereby guarantee base plate structural strength after the further compression of encapsulation height.

Inventors

  • YANG JIE
  • DANG MAOQIANG
  • WANG SHUN
  • ZHU YAN

Assignees

  • 歌尔微电子股份有限公司

Dates

Publication Date
20260505
Application Date
20251230

Claims (10)

  1. 1. A package structure, comprising: the device comprises a shell and a substrate, wherein an encapsulation cavity is formed by surrounding the shell and the substrate, a mounting groove is formed in one side of the substrate facing the encapsulation cavity, and a sound hole is formed in the mounting groove; the MEMS chip is arranged in the mounting groove along the height direction of the substrate, and at least part of the MEMS chip is communicated with the sound hole; The ASIC chip is arranged on one side of the substrate facing the packaging cavity and is electrically connected with the MEMS chip and the substrate respectively; and the bonding part is respectively connected with the circumferential outer wall of the MEMS chip and the circumferential inner wall of the mounting groove.
  2. 2. The package structure of claim 1, wherein the MEMS chip and the ASIC chip are electrically connected by bond wires.
  3. 3. The package structure according to claim 2, further comprising a waterproof film interposed between the MEMS chip and a bottom of the mounting groove, the MEMS chip being in communication with the sound hole through the waterproof film.
  4. 4. The package structure of claim 3, wherein the ASIC chip is fixedly attached to the substrate.
  5. 5. The package structure of claim 1, wherein a first bonding pad is disposed at a bottom of the mounting groove, and the MEMS chip is soldered to the first bonding pad and electrically connected to the substrate.
  6. 6. The package structure of claim 5, wherein the substrate has a second bonding pad, and the ASIC die is soldered to the second bonding pad and electrically connected to the substrate.
  7. 7. The package structure according to any one of claims 1 to 6, wherein at least part of the ASIC is provided in the mounting groove in a height direction of the substrate.
  8. 8. The package structure according to any one of claims 1 to 6, wherein the ASIC chip is packaged with an encapsulant.
  9. 9. The package structure according to any one of claims 1 to 6, wherein the substrate is a PCB circuit board.
  10. 10. Microphone, characterized by comprising a package structure according to any of claims 1-9.

Description

Package structure and microphone Technical Field The invention relates to the technical field of chip packaging, in particular to a packaging structure and a microphone. Background With the development of smart phones, smart watches, and real wireless headphones, the miniature microphone modules for collecting voice signals are also required to achieve lower heights and higher acoustic performance in a limited installation space. A Microphone (Micro-Electro-MECHANICAL SYSTEMS Microphone, abbreviated as MEMS MIC) is widely used in the existing products, and generally includes a MEMS chip (Micro-Electro-MECHANICAL SYSTEMS), an ASIC chip (Application-SPECIFIC INTEGRATED Circuit), a substrate carrying a Circuit, a cover member for forming an acoustic cavity, and the like. In conventional packaging structures, MEMS chips are typically flip-chip or wire-bonded to the surface of a rigid PCB or ceramic substrate, with acoustic holes reserved in the substrate or mated with a metal cover to form acoustic channels. In order to ensure mechanical fixation and airtight packaging of the MEMS chip, the common practice is to coat adhesive materials such as adhesive glue and pouring sealant on the bottom or the periphery of the MEMS chip, and enclose a closed cavity above the chip through a metal cover, a plastic shell and a substrate. In order to meet the reliability requirement, the bottom adhesive layer needs to have a certain thickness and a coverage area, and the bonding wire bonding structure also needs to reserve enough height and safety clearance, so that the MEMS chip, the bonding wire, the cavity and the sealing cover are stacked in sequence in the height direction, and the whole module is difficult to compress further. Disclosure of Invention The invention aims to at least solve the problem that the height of a MEMS packaging structure is difficult to shrink. The aim is achieved by the following technical scheme: The invention provides a packaging structure, which comprises: the device comprises a shell and a substrate, wherein an encapsulation cavity is formed by surrounding the shell and the substrate, a mounting groove is formed in one side of the substrate facing the encapsulation cavity, and a sound hole is formed in the mounting groove; the MEMS chip is arranged in the mounting groove along the height direction of the substrate, and at least part of the MEMS chip is communicated with the sound hole; The ASIC chip is arranged on one side of the substrate facing the packaging cavity and is electrically connected with the MEMS chip and the substrate respectively; and the bonding part is respectively connected with the circumferential outer wall of the MEMS chip and the circumferential inner wall of the mounting groove. According to the packaging structure, the substrate is provided with the mounting groove, and the MEMS chip is at least partially arranged in the mounting groove, so that the MEMS chip forms a sinking type mounting relation in the height direction, the packaging cavity can be accommodated without completely covering the whole thickness of the MEMS chip, the lamination occupation in the height direction is structurally reduced, and the whole height of the MEMS packaging structure is reduced. The bonding part is arranged between the MEMS chip and the mounting groove and respectively connects the MEMS chip and the mounting groove, so that the fixing, positioning and sealing functions of the MEMS chip can be realized by a gap structure in the mounting groove, the height occupation risk brought by a thick adhesive layer at the traditional bottom is reduced, and meanwhile, the assembly stability and the sealing reliability of the MEMS chip in the mounting groove are improved, so that the structural strength of a substrate is ensured after the supporting and packaging height is further compressed. In addition, the packaging structure according to the invention can also have the following additional technical characteristics: In some embodiments of the invention, the MEMS chip and the ASIC chip are electrically connected by bond wires. In some embodiments of the invention, the packaging structure further comprises a waterproof membrane, wherein the waterproof membrane is clamped between the MEMS chip and the bottom of the mounting groove, and the MEMS chip is communicated with the sound hole through the waterproof membrane. In some embodiments of the invention, the ASIC chip is fixedly attached to the substrate. In some embodiments of the present invention, a first bonding pad is disposed at a bottom of the mounting groove, and the MEMS chip is soldered to the first bonding pad and electrically connected to the substrate. In some embodiments of the present invention, a second bonding pad is disposed on the substrate, and the ASIC die is soldered to the second bonding pad and electrically connected to the substrate. In some embodiments of the invention, at least a portion of the ASIC is disposed within th