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CN-121985471-A - Printed circuit board structure and preparation method thereof

CN121985471ACN 121985471 ACN121985471 ACN 121985471ACN-121985471-A

Abstract

The invention provides a printed circuit board structure and a preparation method thereof, wherein the structure comprises a dielectric layer, a first microstrip line and a second microstrip line which are arranged above the dielectric layer, a reference layer which is arranged below the dielectric layer, and an isolation groove which extends along a first direction and is arranged between the first microstrip line and the second microstrip line in a second direction, wherein the center of the isolation groove coincides with the center of a space between the first microstrip line and the second microstrip line in the second direction, and the first direction is perpendicular to the second direction.

Inventors

  • ZHOU DAOLONG
  • WANG MENGYING
  • LU LEI
  • YUE YAN
  • ZHANG CHAO

Assignees

  • 联宝(合肥)电子科技有限公司

Dates

Publication Date
20260505
Application Date
20260202

Claims (10)

  1. 1. A printed circuit board structure, the structure comprising: a dielectric layer, and a first microstrip line and a second microstrip line arranged above the dielectric layer; the dielectric layer comprises a dielectric layer, a reference layer and an isolation groove, wherein the dielectric layer is arranged on the dielectric layer, the isolation groove extends along a first direction is formed in the reference layer, the isolation groove is arranged between the first microstrip line and the second microstrip line, and the center of the isolation groove coincides with the center of a gap between the first microstrip line and the second microstrip line along a second direction, and the first direction is perpendicular to the second direction.
  2. 2. The printed circuit board structure of claim 1, wherein the printed circuit board is, The width of the isolation groove along the second direction is smaller than the distance between the first microstrip line and the second microstrip line.
  3. 3. The printed circuit board structure of claim 1, wherein the printed circuit board is, The width of the first microstrip line along the second direction is equal to the width of the second microstrip line along the second direction; The ratio of the space between the first microstrip line and the second microstrip line to the width of the first microstrip line along the first direction is in direct proportion to the width of the isolation groove along the second direction.
  4. 4. The printed circuit board structure of claim 3, wherein, If the distance between the first microstrip line and the second microstrip line is greater than or equal to twice the width of the first microstrip line along the second direction, the width of the isolation groove along the second direction is 4-5 mils; And if the distance between the first microstrip line and the second microstrip line is smaller than twice the width of the first microstrip line along the second direction, the width of the isolation groove along the second direction is 2-3 mils.
  5. 5. The printed circuit board structure of claim 3, wherein, The distance between the isolation groove and the first microstrip line along the second direction is a first distance, the distance between the isolation groove and the second microstrip line along the second direction is a second distance, and the first distance and the second distance are larger than or equal to 0.8 times of the width of the first microstrip line along the second direction.
  6. 6. The printed circuit board structure of claim 1, wherein the printed circuit board is, The depth of the isolation groove is larger than or equal to the thickness of the reference layer; When the depth of the isolation groove is larger than the thickness of the reference layer, the isolation groove extends into the dielectric layer along the depth direction, and the depth direction is perpendicular to the first direction and the second direction.
  7. 7. The printed circuit board structure of claim 1, wherein the printed circuit board is, The length of the isolation groove along the first direction is greater than or equal to the length of the first microstrip line and the second microstrip line along the first direction.
  8. 8. A method of manufacturing a printed circuit board structure, the method comprising: forming a reference layer, wherein an isolation groove extending along a first direction is formed in the reference layer; forming a dielectric layer on the reference layer; And forming a first microstrip line and a second microstrip line on the dielectric layer, wherein the isolation groove is positioned between the first microstrip line and the second microstrip line, the center of the isolation groove coincides with the center of the interval between the first microstrip line and the second microstrip line along the second direction, and the first direction is perpendicular to the second direction.
  9. 9. The method of manufacturing a printed circuit board structure as defined in claim 8, wherein, The width of the isolation groove along the second direction is smaller than the distance between the first microstrip line and the second microstrip line.
  10. 10. The method of manufacturing a printed circuit board structure as defined in claim 8, wherein, The width of the first microstrip line along the second direction is equal to the width of the second microstrip line along the second direction; The ratio of the space between the first microstrip line and the second microstrip line to the width of the first microstrip line along the first direction is in direct proportion to the width of the isolation groove along the second direction.

Description

Printed circuit board structure and preparation method thereof Technical Field The disclosure relates to the technical field of circuit boards, in particular to a printed circuit board structure and a preparation method thereof. Background With the continued development of integrated circuits, data transmission rates have become higher and higher, and it has become more and more important to reduce low levels of crosstalk between lines. The current method for reducing crosstalk between the wirings of the printed circuit board mainly comprises the steps of increasing the distance between the victim line and the attack line, adding an isolated GND line, changing the microstrip line into a strip line, reducing the coupling length and the like, but is often limited by factors such as the placement position of a chip, the position of a pin of a connector and the like in practice, and is difficult to change the distance between the wirings, change layers or add an isolated structure. Disclosure of Invention The present disclosure provides a printed circuit board structure and a method for manufacturing the same, which at least solve the above technical problems existing in the prior art. According to a first aspect of the present disclosure there is provided a printed circuit board structure, the structure comprising: a dielectric layer, and a first microstrip line and a second microstrip line arranged above the dielectric layer; the dielectric layer comprises a dielectric layer, a reference layer and an isolation groove, wherein the dielectric layer is arranged on the dielectric layer, the isolation groove extends along a first direction is formed in the reference layer, the isolation groove is arranged between the first microstrip line and the second microstrip line, and the center of the isolation groove coincides with the center of a gap between the first microstrip line and the second microstrip line along a second direction, and the first direction is perpendicular to the second direction. In an embodiment, a width of the isolation groove along the second direction is smaller than a distance between the first microstrip line and the second microstrip line. In an embodiment, a width of the first microstrip line along the second direction is equal to a width of the second microstrip line along the second direction; The ratio of the space between the first microstrip line and the second microstrip line to the width of the first microstrip line along the first direction is in direct proportion to the width of the isolation groove along the second direction. In an embodiment, if the distance between the first microstrip line and the second microstrip line is greater than or equal to twice the width of the first microstrip line along the second direction, the width of the isolation groove along the second direction is 4-5 mils; And if the distance between the first microstrip line and the second microstrip line is smaller than twice the width of the first microstrip line along the second direction, the width of the isolation groove along the second direction is 2-3 mils. In an embodiment, the distance between the isolation groove and the first microstrip line along the second direction is a first distance, and the distance between the isolation groove and the second microstrip line along the second direction is a second distance, wherein the first distance and the second distance are greater than or equal to 0.8 times of the width of the first microstrip line along the second direction. In an embodiment, the depth of the isolation trench is greater than or equal to the thickness of the reference layer; When the depth of the isolation groove is larger than the thickness of the reference layer, the isolation groove extends into the dielectric layer along the depth direction, and the depth direction is perpendicular to the first direction and the second direction. In an embodiment, the length of the isolation groove along the first direction is greater than or equal to the length of the first microstrip line and the second microstrip line along the first direction. According to a second aspect of the present disclosure, there is provided a method of manufacturing a printed circuit board structure, the method comprising: forming a reference layer, wherein an isolation groove extending along a first direction is formed in the reference layer; forming a dielectric layer on the reference layer; And forming a first microstrip line and a second microstrip line on the dielectric layer, wherein the isolation groove is positioned between the first microstrip line and the second microstrip line, the center of the isolation groove coincides with the center of the interval between the first microstrip line and the second microstrip line along the second direction, and the first direction is perpendicular to the second direction. In an embodiment, a width of the isolation groove along the second direction is smaller than a dista