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CN-121985472-A - Flexible paper-based electronic device and preparation method

CN121985472ACN 121985472 ACN121985472 ACN 121985472ACN-121985472-A

Abstract

The application discloses a flexible paper-based electronic device and a preparation method thereof, which belong to the technical field of flexible electronics and are used for improving the performance of the flexible electronic device, wherein the electronic device comprises a paper substrate which is sequentially laminated; the paper substrate comprises a paper substrate, a smoothing layer, a circuit layer and an encapsulation layer, wherein the smoothing layer covers and is solidified on one side surface of the paper substrate, the surface of one side of the smoothing layer, which is away from the paper substrate, is a flat surface, the circuit layer comprises a conductive circuit and a functional unit connected with the conductive circuit, and the encapsulation layer covers the surface of one side of the circuit layer, which is away from the smoothing layer, and is used for isolating environmental water vapor and mechanical damage.

Inventors

  • LAN XUDONG

Assignees

  • 清华大学

Dates

Publication Date
20260505
Application Date
20260114

Claims (10)

  1. 1. A flexible paper-based electronic device, the electronic device comprising, in order: A paper substrate; The smooth layer covers and is solidified on one side surface of the paper substrate, and the surface of one side of the smooth layer, which faces away from the paper substrate, is a flat surface; The circuit layer comprises a conductive line and a functional unit connected with the conductive line; and the packaging layer covers the surface of one side of the circuit layer, which is away from the smooth layer, and is used for isolating environmental water vapor and mechanical damage.
  2. 2. The electronic device according to claim 1, wherein the smoothing layer is made of at least one of gelatin, chitosan, polylactic acid PLA, polybutylene succinate PBS, and polycaprolactone PCL.
  3. 3. The electronic device of claim 1, wherein the conductive trace is formed from a conductive ink, the conductive ink being one of a silver nanowire ink, a carbon nanotube ink, by a printing process.
  4. 4. The electronic device of claim 1, wherein the functional unit comprises at least one of: The device comprises a temperature sensing unit, a humidity sensing unit, a biochemical sensing unit, a heating unit, a light emitting diode and a microchip.
  5. 5. The electronic device of claim 4, wherein the microchip comprises at least one of a radio frequency identification RFID chip, a microcontroller MCU, a memory chip, and a sensor signal conditioning chip.
  6. 6. The electronic device of claim 1, wherein the encapsulation layer is made of at least one of the following materials: Beeswax, polylactic acid PLA, and polybutylene succinate PBS.
  7. 7. A method of manufacturing a flexible paper-based electronic device, characterized in that the method of manufacturing is used to manufacture the flexible paper-based electronic device of any one of claims 1-6, the method comprising: Preparing a paper substrate; Preparing a smoothing layer on one side surface of the paper substrate, wherein the smoothing layer covers and is solidified on one side surface of the paper substrate, and the surface of the smoothing layer on one side facing away from the paper substrate is a flat surface; preparing a circuit layer on one side surface of the smooth layer, wherein the circuit layer comprises a conductive circuit and a functional unit connected with the conductive circuit; and preparing an encapsulation layer on the surface of one side of the circuit layer, which is away from the smooth layer, wherein the encapsulation layer is used for isolating environmental water vapor and mechanical damage.
  8. 8. The method of manufacturing according to claim 7, wherein the manufacturing of the circuit layer on the smooth layer side surface includes: printing a circuit pattern comprising conductive lines and functional units on one side surface of the smooth layer by adopting an ink-jet printing or screen printing mode; And performing low-temperature curing on the circuit pattern.
  9. 9. The method of claim 7, wherein the low temperature cure temperature is greater than or equal to 60 ℃ and less than or equal to 100 ℃.
  10. 10. The method of producing according to claim 7, wherein the producing a smoothing layer on one side surface of the paper substrate comprises: And coating the smooth layer material on one side surface of the paper substrate by dip coating, spin coating, spray coating or knife coating, and curing.

Description

Flexible paper-based electronic device and preparation method Technical Field The application belongs to the technical field of flexible electronics, and particularly relates to a flexible paper-based electronic device and a preparation method thereof. Background With the rapid development of the internet of things, intelligent packaging and wearable devices, there is an increasing demand for low-cost, flexible, environment-friendly electronics. Paper is considered an ideal substrate for flexible electronic devices as a widely available, flexible, biodegradable material. The related art implements simple conductive traces or sensors on a paper substrate. However, the current paper-based electronic device still has defects in stability, reliability and the like, and particularly, the performance retention in a complex environment needs to be further improved, so that the large-scale practical application of the paper-based electronic device is restricted. Disclosure of Invention The embodiment of the application provides a flexible paper-based electronic device and a preparation method thereof, which are used for improving the performance of the paper-based electronic device. An embodiment of the present application provides, in a first aspect, a flexible paper-based electronic device, including: A paper substrate; The smooth layer covers and is solidified on one side surface of the paper substrate, and the surface of one side of the smooth layer, which faces away from the paper substrate, is a flat surface; The circuit layer comprises a conductive line and a functional unit connected with the conductive line; and the packaging layer covers the surface of one side of the circuit layer, which is away from the smooth layer, and is used for isolating environmental water vapor and mechanical damage. In some embodiments, the smoothing layer is made of at least one of gelatin, chitosan, polylactic acid PLA, polybutylene succinate PBS, and polycaprolactone PCL. In some embodiments, the conductive lines are formed from a conductive ink, one of silver nanowire ink, carbon nanotube ink, by a printing process. In some embodiments, the functional unit includes at least one of: The device comprises a temperature sensing unit, a humidity sensing unit, a biochemical sensing unit, a heating unit, a light emitting diode and a microchip. In some embodiments, the microchip comprises at least one of a radio frequency identification RFID chip, a microcontroller MCU, a memory chip, a sensor signal conditioning chip. In some embodiments, the material used for the encapsulation layer is at least one of: Beeswax, polylactic acid PLA, and polybutylene succinate PBS. The second aspect of the embodiment of the present application further provides a method for preparing a flexible paper-based electronic device, where the method is used to prepare the flexible paper-based electronic device according to the first aspect of the embodiment of the present application, and the method includes: Preparing a paper substrate; Preparing a smoothing layer on one side surface of the paper substrate, wherein the smoothing layer covers and is solidified on one side surface of the paper substrate, and the surface of the smoothing layer on one side facing away from the paper substrate is a flat surface; preparing a circuit layer on one side surface of the smooth layer, wherein the circuit layer comprises a conductive circuit and a functional unit connected with the conductive circuit; and preparing an encapsulation layer on the surface of one side of the circuit layer, which is away from the smooth layer, wherein the encapsulation layer is used for isolating environmental water vapor and mechanical damage. In some embodiments, the preparing a circuit layer on a side surface of the smoothing layer includes: printing a circuit pattern comprising conductive lines and functional units on one side surface of the smooth layer by adopting an ink-jet printing or screen printing mode; And performing low-temperature curing on the circuit pattern. In some embodiments, the low temperature cure temperature is greater than or equal to 60 ℃ and less than or equal to 100 ℃. In some embodiments, the preparing a smoothing layer on one side surface of the paper substrate comprises: And coating the smooth layer material on one side surface of the paper substrate by dip coating, spin coating, spray coating or knife coating, and curing. The embodiment of the application has the beneficial effects that the special smooth layer is introduced between the paper substrate and the circuit layer, so that the adverse effect caused by rough and porous paper surface is effectively overcome. The smooth layer not only fills up fiber pores, but also provides a flat and continuous attachment interface for subsequent circuit printing, remarkably improves the forming quality, conductivity and mechanical reliability of the conductive circuit, and fundamentally improves the electrical perform