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CN-121985473-A - Metal-based circuit board and manufacturing method thereof

CN121985473ACN 121985473 ACN121985473 ACN 121985473ACN-121985473-A

Abstract

The invention belongs to the technical field of metal-based circuit boards, and particularly relates to a metal-based circuit board and a manufacturing method of the metal-based circuit board. According to the invention, the synchronous pretreatment is realized by the steps of treating the metal substrate and forming the aluminum foil, and compared with the traditional manufacturing method of the metal-based circuit board, the method can shorten the production flow and stably promote certain production efficiency. And the staged immobilization process is matched with the multi-component high-heat-conductivity insulating pressure-sensitive film, so that the problems of glue layer flowing, copper foil warping and the like caused by single-stage solidification can be avoided, and the consistency of the final product of the metal-based circuit board is ensured.

Inventors

  • JIANG SHIYONG

Assignees

  • 深圳市博森纳新材料技术有限公司

Dates

Publication Date
20260505
Application Date
20260203

Claims (10)

  1. 1. The manufacturing method of the metal-based circuit board is characterized by comprising the following steps of: Step S1, hot-pressing and attaching a high-heat-conductivity insulating pressure-sensitive film on the surface of a metal substrate to prepare an insulating metal substrate, and simultaneously performing precise die cutting circuit forming on an aluminum foil, wherein impurities generated by attachment and die cutting are respectively treated and recycled to obtain an insulating metal substrate and a conductive circuit pattern; step S2, the conductive circuit pattern and the insulating metal substrate are subjected to hot-pressing compounding, an uncured metal base circuit board is manufactured by means of high-heat-conductivity insulating pressure-sensitive film adhesion, and then staged curing treatment is carried out on the uncured metal base circuit board; And step S3, sequentially completing operations such as drilling, solder resist forming, character printing, surface treatment, appearance cutting and the like on the metal base circuit board after the curing treatment, and obtaining the target metal base circuit board after the finished product detection is qualified.
  2. 2. The method for manufacturing a metal-based circuit board according to claim 1, wherein the high-heat-conductivity insulating pressure-sensitive film comprises the following components in parts by weight: 100 parts of E51 epoxy resin, 15-22 parts of butyl methacrylate resin, 13-16 parts of isooctyl acrylate resin, 18-22 parts of dicyandiamide, 8-10 parts of urea-formaldehyde resin, 0.8-1.5 parts of peroxy initiator, 0.8-1.5 parts of imidazole accelerator, 120-150 parts of aluminum nitride powder and 80-90 parts of silicon carbide powder.
  3. 3. The method for manufacturing a metal-based circuit board according to claim 2, wherein the method for manufacturing the high-thermal-conductivity insulating pressure-sensitive film comprises the following steps: And S4, uniformly mixing the components to obtain a colloid substrate, carrying out tape casting coating on the colloid substrate on a release film at 55-65 ℃ and preserving heat for 6-9min to cure the colloid substrate into a film, recycling colloid impurities generated by the tape casting coating, and reserving uncured epoxy resin for finishing subsequent staged curing.
  4. 4. The method for manufacturing a metal-based circuit board according to claim 1, wherein the thickness of the high heat conduction insulating pressure-sensitive film is 60-150 μm, and the casting coating rate is 1-1.5m/min; And the hot-press lamination and hot-press compounding temperatures of the step S1 and the step S2 are 50-80 ℃.
  5. 5. The method for manufacturing a metal-based circuit board according to claim 2, wherein the peroxy initiator is dicumyl peroxide (DCP), and the imidazole accelerator is 2-methylimidazole; The grain diameter of the silicon carbide powder is 2-4 mu m, and the grain diameter of the aluminum nitride powder is 4-6 mu m; The dicyandiamide and the urea resin are compounded and then are synergistic with the imidazole accelerator.
  6. 6. The method for manufacturing a metal-based circuit board according to claim 1, wherein the step curing is three-stage curing or four-stage curing; The three-stage curing is performed at 80-90 ℃ per 20-30min, 120-130 ℃ per 20-30min, 145-150 ℃ per 40-45min; The four-stage curing is carried out at 70-80 ℃ per 20-30min, 90-110 ℃ per 20-30min, 125-135 ℃ per 10-20min, 145-150 ℃ per 30-35min.
  7. 7. The method of manufacturing a metal-based circuit board according to claim 1, wherein the hole metallization is performed after the drilling, and then the hole walls are sequentially subjected to electroless copper deposition and electrolytic copper plating to form conductive same layers, and the useful components are recovered after the hole metallization waste liquid is purified; the finished product detection comprises appearance, electrical performance and size detection.
  8. 8. The method of manufacturing a metal-based circuit board according to claim 1, wherein the solder mask is formed by exposing and developing a solder mask ink-coated pre-cured solder mask to form a solder pad window; And the surface treatment is to cover an OSP organic protective film welding, a gold depositing layer, a tin depositing layer or a tin spraying layer on the bonding pad area, and the waste liquid and the waste residue after the surface treatment are recovered and reused after being purified.
  9. 9. The method of manufacturing a metal-based circuit board according to claim 1, wherein the metal substrate is made of aluminum, copper or iron and has a thickness of 1.0mm-3.0mm; the aluminum foil is electrolytic copper foil or rolled copper foil, and the thickness of the aluminum foil is 18-70 mu m.
  10. 10. The metal-based circuit board is prepared by the preparation method of any one of claims 1-9 and is characterized by comprising an electric conduction copper foil layer, an insulating heat conduction layer and a metal base layer which are laminated from top to bottom, wherein the insulating heat conduction layer is tightly attached to the electric conduction copper foil layer and the metal base layer to realize electric insulation and heat transfer.

Description

Metal-based circuit board and manufacturing method thereof Technical Field The invention belongs to the technical field of metal-based circuit boards, and particularly relates to a metal-based circuit board and a manufacturing method of the metal-based circuit board. Background The metal-based circuit board is generally referred to as a metal-based printed circuit board, and is a special circuit board using a metal material as a core substrate. The metal-based circuit board is a composite board and consists of a metal basal layer, an insulating layer and a circuit layer (copper-clad layer). Different from the traditional FR-4 glass fiber board, the main purpose of the design of the metal-based circuit board is to quickly conduct out the heat generated by high-power components so as to prevent the problem of overheat failure. In the related art, the manufacturing process of the metal-based circuit board needs a plurality of processing procedures such as substrate treatment, circuit forming, compounding, curing and the like. The metal-based circuit board is manufactured by adopting a subtractive chemical etching process, and the core of the subtractive chemical etching process is that the redundant copper foil is removed through acid-base etching liquid to form a circuit. However, this method is complicated in steps and requires repeated alignment. The whole manufacturing step is time-consuming and labor-consuming, and the cost loss is huge. Disclosure of Invention The invention aims to provide a metal-based circuit board and a manufacturing method thereof, which are used for solving the problems of complex production flow, time and labor waste in the traditional manufacturing method of the metal-based circuit board. The technical scheme adopted by the invention is as follows: < first aspect > A metal base circuit board and a method for manufacturing the metal base circuit board comprise the following steps: Step S1, hot-pressing and attaching a high-heat-conductivity insulating pressure-sensitive film on the surface of a metal substrate to prepare an insulating metal substrate, and simultaneously performing precise die cutting circuit forming on an aluminum foil, wherein impurities generated by attachment and die cutting are respectively treated and recycled to obtain an insulating metal substrate and a conductive circuit pattern; step S2, the conductive circuit pattern and the insulating metal substrate are subjected to hot-pressing compounding, an uncured metal base circuit board is manufactured by means of high-heat-conductivity insulating pressure-sensitive film adhesion, and then staged curing treatment is carried out on the uncured metal base circuit board; And step S3, sequentially completing operations such as drilling, solder resist forming, character printing, surface treatment, appearance cutting and the like on the metal base circuit board after the curing treatment, and obtaining the target metal base circuit board after the finished product detection is qualified. In some possible implementations, the high thermal conductivity insulating pressure sensitive film includes, in parts by weight: 100 parts of E51 epoxy resin, 15-22 parts of butyl methacrylate resin, 13-16 parts of isooctyl acrylate resin, 18-22 parts of dicyandiamide, 8-10 parts of urea-formaldehyde resin, 0.8-1.5 parts of peroxy initiator, 0.8-1.5 parts of imidazole accelerator, 120-150 parts of aluminum nitride powder and 80-90 parts of silicon carbide powder. In some possible implementations, the preparation method of the high-thermal-conductivity insulating pressure-sensitive film includes: And S4, uniformly mixing the components to obtain a colloid substrate, carrying out tape casting coating on the colloid substrate on a release film at 55-65 ℃ and preserving heat for 6-9min to cure the colloid substrate into a film, recycling colloid impurities generated by the tape casting coating, and reserving uncured epoxy resin for finishing subsequent staged curing. In some possible implementations, the high thermal conductivity insulating pressure sensitive film has a thickness of 60-150 μm and the casting coating rate is 1-1.5m/min; And the hot-press lamination and hot-press compounding temperatures of the step S1 and the step S2 are 50-80 ℃. In some possible implementations, the peroxygen initiator is dicumyl peroxide (DCP) and the imidazole accelerator is 2-methylimidazole; The grain diameter of the silicon carbide powder is 2-4 mu m, and the grain diameter of the aluminum nitride powder is 4-6 mu m; The dicyandiamide and the urea resin are compounded and then are synergistic with the imidazole accelerator. In some possible implementations, the staged curing is a three-stage curing or a four-stage curing; The three-stage curing is performed at 80-90 ℃ per 20-30min, 120-130 ℃ per 20-30min, 145-150 ℃ per 40-45min; The four-stage curing is carried out at 70-80 ℃ per 20-30min, 90-110 ℃ per 20-30min, 125-135 ℃ per 10-20min, 145-150 ℃ per