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CN-121985475-A - Soft and hard combined circuit board based on multilayer board

CN121985475ACN 121985475 ACN121985475 ACN 121985475ACN-121985475-A

Abstract

The invention discloses a soft and hard combined circuit board based on a multilayer board, which comprises a first hard laminated layer, a first soft laminated layer, a second soft laminated layer and a second hard laminated layer which are sequentially laminated, wherein two sides of a first aluminum layer of the first soft laminated layer are respectively plated with a second copper layer and a third copper layer, two sides of a second aluminum layer of the second soft laminated layer are respectively plated with a fourth copper layer and a fifth copper layer, the first hard laminated layer is plated with a first copper layer and fixedly bonded with a first part of the first soft laminated layer through a first bonding sheet, the second hard laminated layer is plated with a sixth copper layer and fixedly bonded with a first part of the second soft laminated layer through a second bonding sheet, so that aluminum materials are used as main base materials in the middle of the soft and hard combined circuit board, and copper materials are used as main base materials on two sides of the soft and hard combined circuit board, the production cost of the soft and hard combined circuit board based on the multilayer board is effectively reduced, the heat dissipation uniformity of the soft and hard combined circuit board is improved, and the light weight and the high hardness of the soft and hard combined circuit board are realized.

Inventors

  • HUANG BING

Assignees

  • 奕东电子科技股份有限公司

Dates

Publication Date
20260505
Application Date
20260130

Claims (10)

  1. 1. A soft or hard combination circuit board based on multiply wood, characterized in that includes: The first hard lamination, the first bonding layer, the first soft lamination, the second bonding layer, the second soft lamination, the third bonding layer and the second hard lamination are sequentially laminated; The first and second soft stacks each include a first portion, a second portion, and a third portion arranged in a lateral direction; the first hard lamination layer is plated with a first copper layer, and one surface far away from the first copper layer is fixedly bonded with a first part of the first soft lamination layer through a first bonding sheet; The first bonding layer is arranged on one surface, close to the first hard lamination, of the second part of the first soft lamination; The second soft lamination is fixedly adhered to one surface of the first soft lamination far away from the first hard lamination through the second adhesive layer, the first soft lamination comprises a first aluminum layer with two surfaces respectively plated with a second copper layer and a third copper layer, and the second soft lamination comprises a second aluminum layer with two surfaces respectively plated with a fourth copper layer and a fifth copper layer; The third bonding layer is arranged on one surface of the second part and the third part of the second soft laminate, which is far away from the first soft laminate; the second hard laminate is plated with a sixth copper layer and a side remote from the sixth copper layer is fixedly bonded to the first portion of the second soft laminate by a second bonding tab.
  2. 2. The multi-layer board-based rigid-flex circuit according to claim 1, wherein said rigid-flex circuit is provided with at least one conductive via corresponding to a first portion of said first and second flexible laminate layers, and wherein a sidewall of said conductive via is used to electrically connect said first and sixth copper layers.
  3. 3. The multi-layer board-based flexible-rigid combined circuit board according to claim 1, wherein at least one conductive buried via is provided in the flexible-rigid combined circuit board corresponding to the second portions of the first and second flexible stacks, and a sidewall of the conductive buried via is used for electrically connecting the second and fifth copper layers.
  4. 4. The rigid-flex circuit board based on the multilayer board according to claim 1, wherein, The total thickness of the second copper layer and the first aluminum layer is more than or equal to 45um; the thickness range of the third copper layer and the fourth copper layer is 2um to 8um; The total thickness of the second aluminum layer and the fifth copper layer is more than or equal to 45um.
  5. 5. The rigid-flex circuit board based on the multilayer board according to claim 1, wherein, The first bonding layer comprises a first protective film, and the first protective film is bonded and fixed with the second copper layer through a first bonding agent; The second bonding layer comprises a second protective film, and two sides of the second protective film are respectively bonded and fixed with the third copper layer and the fourth copper layer through a second bonding agent; the third bonding layer comprises a third protective film, and the third protective film is bonded and fixed with the fifth copper layer through a third bonding agent.
  6. 6. The rigid-flex circuit board based on the multilayer board according to claim 5, wherein, The first protective film, the second protective film and the third protective film are made of polyimide, the thickness ranges of the first protective film and the third protective film are 10.5um to 14.5um, and the thickness range of the second protective film is 22um to 28um; the first adhesive, the second adhesive and the third adhesive are made of pure rubber, the thickness ranges of the first adhesive and the third adhesive are 29um to 45um, and the thickness range of the second adhesive is 22um to 28um.
  7. 7. The rigid-flex circuit board based on the multilayer board according to claim 1, wherein, The first hard lamination comprises a first copper foil layer and a first substrate layer which are laminated, wherein one surface of the first copper foil layer far away from the first substrate layer is plated with the first copper layer; the second hard lamination comprises a second base material layer and a second copper foil layer which are arranged in a lamination mode, and one surface, far away from the second base material layer, of the second copper foil layer is plated with the sixth copper layer.
  8. 8. The rigid-flex circuit board based on the multilayer board according to claim 7, wherein, The thickness of the first substrate layer and the second substrate layer ranges from 135um to 165um; the total thickness of the first copper layer and the first copper foil layer is more than or equal to 50um; the total thickness of the second copper foil layer and the sixth copper layer is greater than or equal to 50um.
  9. 9. The soft and hard combined circuit board based on the multilayer board according to claim 1, wherein the first adhesive sheet and the second adhesive sheet are made of prepregs, and the thicknesses of the first adhesive sheet and the second adhesive sheet are equal to or greater than 110um.
  10. 10. The multi-layer board-based rigid-flex circuit according to claim 1, wherein a third portion of said second soft stack is laminated with a stiffening layer on a side of said third portion remote from said first soft stack.

Description

Soft and hard combined circuit board based on multilayer board Technical Field The invention relates to the technical field of soft and hard combined circuit boards, in particular to a soft and hard combined circuit board based on a multilayer board. Background The existing multilayer circuit board generally adopts a multilayer board structure made of pure copper, but the material cost of the multilayer circuit board with the structure is high, the local heat accumulation is easy to occur due to the fact that the heat conduction of copper is faster, the whole weight of the circuit board cannot be reduced due to the fact that the weight of copper is larger, and if the material of the multilayer board is replaced by other materials, the hardness of the circuit board is difficult to ensure and meet the required requirements. Disclosure of Invention The invention aims to provide a soft and hard combined circuit board based on a multilayer board, which has the advantages of low production cost, good heat dissipation uniformity and light weight and high hardness structure. In order to achieve the above object, the present invention discloses a soft and hard combined circuit board based on a multilayer board, comprising: The first hard lamination, the first bonding layer, the first soft lamination, the second bonding layer, the second soft lamination, the third bonding layer and the second hard lamination are sequentially laminated; The first and second soft stacks each include a first portion, a second portion, and a third portion arranged in a lateral direction; the first hard lamination layer is plated with a first copper layer, and one surface far away from the first copper layer is fixedly bonded with a first part of the first soft lamination layer through a first bonding sheet; The first bonding layer is arranged on one surface, close to the first hard lamination, of the second part of the first soft lamination; The second soft lamination is fixedly adhered to one surface of the first soft lamination far away from the first hard lamination through the second adhesive layer, the first soft lamination comprises a first aluminum layer with two surfaces respectively plated with a second copper layer and a third copper layer, and the second soft lamination comprises a second aluminum layer with two surfaces respectively plated with a fourth copper layer and a fifth copper layer; The third bonding layer is arranged on one surface of the second part and the third part of the second soft laminate, which is far away from the first soft laminate; the second hard laminate is plated with a sixth copper layer and a side remote from the sixth copper layer is fixedly bonded to the first portion of the second soft laminate by a second bonding tab. Preferably, the soft-hard combined circuit board is provided with at least one conductive through hole corresponding to the first part of the first soft laminate and the first part of the second soft laminate, and the side wall of the conductive through hole is used for electrically connecting the first copper layer and the sixth copper layer. Preferably, at least one conductive buried hole is formed in the soft-hard combined circuit board and corresponds to the second part of the first soft laminate layer and the second soft laminate layer, and the side wall of the conductive buried hole is used for electrically connecting the second copper layer and the fifth copper layer. Preferably, the total thickness of the second copper layer and the first aluminum layer is greater than or equal to 45um; the thickness range of the third copper layer and the fourth copper layer is 2um to 8um; The total thickness of the second aluminum layer and the fifth copper layer is more than or equal to 45um. Preferably, the first adhesive layer includes a first protective film, and the first protective film is adhered and fixed with the second copper layer through a first adhesive; The second bonding layer comprises a second protective film, and two sides of the second protective film are respectively bonded and fixed with the third copper layer and the fourth copper layer through a second bonding agent; the third bonding layer comprises a third protective film, and the third protective film is bonded and fixed with the fifth copper layer through a third bonding agent. Preferably, the first protective film, the second protective film and the third protective film are made of polyimide, the thickness ranges of the first protective film and the third protective film are 10.5um to 14.5um, and the thickness range of the second protective film is 22um to 28um; the first adhesive, the second adhesive and the third adhesive are made of pure rubber, the thickness ranges of the first adhesive and the third adhesive are 29um to 45um, and the thickness range of the second adhesive is 22um to 28um. Preferably, the first hard laminate comprises a first copper foil layer and a first substrate layer which are stacked