CN-121985477-A - Control method and system of printed circuit board production equipment

CN121985477ACN 121985477 ACN121985477 ACN 121985477ACN-121985477-A

Abstract

The invention discloses a control method and a control system of printed circuit board production equipment, which are characterized in that qualified batches meeting cutting standards are screened through automatic copper-clad plate scanning and image analysis processes, so that time and labor for manual inspection are reduced, meanwhile, the quality of cutting is analyzed after each copper-clad plate in the qualified batches is cut to obtain a plate quality assessment index, and the running state of a blanking machine and the use state of a cutting tool are assessed correspondingly based on the comparison result of the current copper-clad plate quality assessment index, so that problems can be timely examined when the cutting quality of the copper-clad plate is in question, the cutting quality of each subsequent copper-clad plate is ensured, and the problem that the production progress of the subsequent printed circuit board is influenced by time and labor consumption through manual inspection after the copper-clad plate in the current batch is cut in the prior art is solved.

Inventors

WU AN
ZENG YUQIANG
HUANG HUA
LUO YUANCHENG
ZHANG JIANGPING

Assignees

江西中络电子有限公司

Dates

Publication Date: 20260505
Application Date: 20240412

Claims (6)

1. A control method of a printed circuit board production apparatus, comprising: S1, sequentially placing the copper-clad plate of the current production processing batch at a set target position based on serial numbers, scanning the copper-clad plate placed at the set target position to obtain image information and size information of the copper-clad plate of the current production processing batch, identifying defective areas in each group of image information by using image processing software, marking, dividing the marked areas of each group of image information, extracting the maximum complete areas remained after each group of image information is divided to be used as normal areas of each copper-clad plate of the current production processing batch, further obtaining the size of the copper-clad plate required by the current printed circuit board, and carrying out overlapping comparison with the normal areas of each copper-clad plate of the current production processing batch, if the normal areas of the copper-clad plate are larger than the required size and the normal areas are not identified to influence the cutting defect, marking the copper-clad plate as qualified, otherwise marking the copper-clad plate as unqualified, and dividing the current production processing batch into qualified batches and unqualified batches based on analysis results; S2, screening unqualified batches based on the step S1, taking the qualified batches as processing batches for producing the current printed circuit board, inputting the size of copper-clad plates required by the current printed circuit board, automatically generating optimal cutting paths of copper-clad plates of the processing batches according to the marking information and the required size of the copper-clad plates of the processing batches, and confirming the optimal cutting paths generated by the copper-clad plates of the processing batches by an administrator; S3, after confirming no errors, controlling a cutting tool of a cutting machine to cut along an optimal cutting path of each copper-clad plate of a processing batch through preset cutting parameters, recording the running state of the cutting machine while cutting each copper-clad plate of the processing batch, automatically stopping the cutting tool and sending out a finishing signal after finishing cutting each copper-clad plate of the processing batch, and analyzing the cutting quality of the current cut copper-clad plate to obtain a plate quality evaluation index BZP of the current cut copper-clad plate; S4, comparing the plate quality evaluation index BZP of the current cut copper-clad plate with a preset machine quality reference threshold value index, if the plate quality evaluation index BZP is smaller than the preset machine quality reference threshold value index, not generating any signal, and cutting the next group of copper-clad plates; S5, comparing an operation evaluation index YXP of the blanking machine in the process of cutting the current cut copper-clad plate with a preset operation reference threshold index, generating a maintenance signaling if the operation evaluation index YXP is larger than the preset operation reference threshold index, selecting a maintainer with the largest maintenance evaluation value WP of the current maintenance signaling generation time point to go to the position of the blanking machine for checking and maintaining, and further generating a checking signaling if the operation evaluation index YXP is smaller than the preset operation reference threshold index; S6, when an inspection signaling is generated, analyzing the use state of the cutting tool of the blanking machine at the current inspection signaling generation time point to obtain a loss estimation value SG of the cutting tool of the blanking machine corresponding to the current time point, comparing the loss estimation value SG of the cutting tool of the blanking machine corresponding to the current time point with a preset loss estimation threshold value, if the loss estimation value is larger than the preset loss estimation threshold value, selecting a maintainer with the current generation time point closest to the blanking machine to replace the cutting tool at the position of the blanking machine, and if the loss estimation value is smaller than the preset loss estimation threshold value, generating a normal use signal, and starting the blanking machine to cut the next group of copper-clad plates continuously.
2. The control method of a printed circuit board production device according to claim 1, wherein the step of obtaining the board quality evaluation index BZP of the currently cut copper clad laminate comprises the following specific steps: S3-101, after a complete signal is sent out, moving the cut copper-clad plate to a detection position, firstly measuring the size of the cut copper-clad plate and comparing the size with a required size, if the size of the cut copper-clad plate has an error with the required size, further comparing an error range with a preset error allowable threshold, directly generating an abnormal signal when the error range is larger than the preset error allowable threshold, and analyzing the cutting quality of the cut copper-clad plate through the steps S3-102 when the error range is smaller than the preset error allowable threshold S3-102, adjusting the wavelength and power of a laser scanner, emitting a beam of thin laser to a cutting surface of a cut copper-clad plate, capturing the reflected laser, and establishing a three-dimensional surface model of the cutting surface of the cut copper-clad plate based on the captured laser; And multiplying the average roughness, the maximum roughness depth, the maximum height of the roughness profile and the total height of the roughness profile of the cut copper-clad plate by corresponding preset weight coefficients respectively, and then summing to obtain a plate quality evaluation index BZP of the current cut copper-clad plate.
3. The control method of a printed circuit board production device according to claim 2, wherein the operation evaluation index YXP of the blanking machine in the process of cutting the current cut copper clad laminate is obtained by the following specific steps: S4-101, acquiring vibration times of the blanking machine in the recorded time period from the recorded running state of the blanking machine and recording the vibration times as ZD1; S4-102, acquiring a cutting speed value of a cutting tool of a cutting machine at each time point in the recording time period, extracting a maximum cutting speed value and a minimum cutting speed value from the cutting speed values at each time point, calculating a difference value between the maximum cutting speed value and the minimum cutting speed value, taking the difference value as a cutting speed difference value in the recording time period, further calculating the cutting speed value at each time point by using a standard deviation formula, and taking a calculated result as a cutting speed variation value in the recording time period; S4-103, acquiring a temperature value and a dust concentration value of the surrounding environment where the blanking machine is located at each time point in the recording time period, and calculating the average value of the temperature value and the dust concentration value of the surrounding environment where the blanking machine is located at each time point to obtain Wen Junzhi and a dust average value; s4-104, according to the formula The vibration times ZD1, the cutting speed estimated value ZD2 and the mirror value ZD3 are subjected to weighted calculation to obtain the operation estimated index YXP of the blanking machine in the process of cutting the current cut copper-clad plate, wherein 、 And Respectively representing the preset maximum allowable vibration times, maximum allowable cutting speed estimated value and maximum allowable mirror value of the blanking machine, wherein fq1, fq2 and fq3 are preset weighting factors of the vibration times ZD1, the cutting speed estimated value ZD2 and the mirror value ZD 3.
4. A control method of a printed circuit board production apparatus according to claim 3, wherein the specific step of obtaining the maintenance personal evaluation value WP comprises: S5-101, drawing a circle by taking a blanking machine as a circle center, setting a distance as a radius based on the current time point of generating a maintenance signaling, acquiring maintenance personnel in the circle range as preselected personnel, sending a position acquisition instruction to the mobile terminal of the maintenance personnel, and calculating the route distance between the preselected personnel and the blanking machine as a distance evaluation value JP1 of the preselected personnel after the preselected personnel confirm the received position acquisition instruction; S5-102, acquiring the historical total times and the time length of each pre-selected person, carrying out average value calculation on the time length of each pre-selected person corresponding to each maintenance, taking each group of calculated average value as the single maintenance reference time length of each pre-selected person, respectively matching the historical total times and the single maintenance reference time length of each pre-selected person with the preset total times reference range and reference time length value range, setting the experience score value and the proficiency score value corresponding to each total times reference range and each reference time length value range respectively, obtaining the experience score value and the proficiency score value of each pre-selected person corresponding to the current generation time point, accumulating the experience score value and the proficiency score value of each pre-selected person, and taking the accumulated value as the score value JP2 of each pre-selected person; S5-103, counting the total selection times of each pre-selected person corresponding to the current generation time point for nearly thirty days, and taking the total selection times as an evaluation value JP3 of each pre-selected person; s5-104, according to the formula And carrying out weighted calculation on the distance evaluation value JP1, the score evaluation value JP2 and the measurement evaluation value JP3 of each preselected person to obtain a dimension evaluation value WP of each preselected person, wherein af1, af2 and af3 are preset weighting factors of the distance evaluation value JP1, the score evaluation value JP2 and the measurement evaluation value JP3 of each preselected person respectively.
5. The control method of a printed circuit board production device according to claim 4, wherein the loss estimation value SG of the cutting tool of the blanking machine corresponding to the current time point is obtained, and the specific steps are as follows: S6-101, acquiring the mounting time of a cutting tool of a blanking machine, and calculating the time difference of the cutting tool mounting time and the time point based on the current checking signaling generation time point to obtain the used time length VS1 of the cutting tool; S6-102, detecting the cutting tool by using a wear detection instrument, and converting detected data into numerical values, wherein the numerical values comprise a tool nose radius, a tool edge length and a tool total length, comparing the numerical values with original numerical values of the type of the cutting tool, calculating various differences between the detected numerical values and the original numerical values, and accumulating the differences as wear difference VS2 of the cutting tool; s6-103, performing jitter measurement on the cutting tool, recording jitter data measured at each time point, and calculating the jitter data measured at each time point by using a standard deviation formula to serve as a jitter difference value VS3 of the cutting tool; S6-104, according to the formula Weighting the used time length VS1, the abrasion difference VS2 and the runout difference VS3 of the cutting tool to obtain a loss estimation SG of the cutting tool of the cutting machine corresponding to the current time point, wherein 、 And And ty1, ty2 and ty3 are preset weighting factors of the used duration VS1, the wear difference VS2 and the runout difference VS3 respectively.
6. A control system of a printed circuit board production apparatus, applied to the control method of a printed circuit board production apparatus according to any one of the above claims 1 to 5, characterized by comprising: the user module is used for providing an interface for interaction between an operator and the system; The data processing module is used for receiving and processing data from the scanning equipment and the sensor and analyzing and calculating the data; Comparing the analysis and calculation result with a corresponding preset threshold value, and executing corresponding measures based on the comparison result; the equipment control module is used for controlling the starting, stopping and cutting processes of the blanking machine; the communication module is used for establishing communication with the mobile terminal of the maintainer; and a database for storing parameters required in the calculation and analysis processes.

Description

Control method and system of printed circuit board production equipment Technical Field The invention relates to the technical field of production equipment control, in particular to a control method and a control system of printed circuit board production equipment. Background The printed circuit board is one of important parts in the electronic industry, is used as an electric connection carrier of electronic components, is widely used in various electronic equipment, and is required to be cut into the original copper-clad plate by using a cutting machine in the production process of the printed circuit board, and is cut into the size suitable for processing of a production line. The control method and system of the printed circuit board production equipment in the prior art have the following defects in the actual application process: The method comprises the steps that defects of copper-clad plates in a current production batch cannot be pre-detected, so that qualified batches meeting cutting standards are screened, the quality of cutting is analyzed after each copper-clad plate in the qualified batches is cut, the running state of a blanking machine and the use state of a cutting tool are evaluated based on the analysis result, and inspection, maintenance or replacement are timely carried out according to the evaluation result, so that the quality of each copper-clad plate in the cutting process cannot be guaranteed, and the follow-up production progress of a printed circuit board is influenced while time and labor are consumed by carrying out one-to-one inspection after the copper-clad plates in the current batch are cut; When the production equipment is abnormal, a maintainer is usually randomly screened to go to an abnormal point for inspection, and the maintainer in the range cannot be selected after being screened based on the position of the current abnormal generation point, so that the intelligent degree is low and the abnormality cannot be timely solved. For this purpose, a control method and a system for a printed circuit board production device are proposed. Disclosure of Invention In view of the above, the present invention provides a control method and system for a printed circuit board production device, so as to solve the above-mentioned problems of the background art. The invention can be realized by the following technical scheme: S1, sequentially placing the copper-clad plate of the current production processing batch at a set target position based on serial numbers, scanning the copper-clad plate placed at the set target position to obtain image information and size information of the copper-clad plate of the current production processing batch, identifying defective areas in each group of image information by using image processing software, marking, dividing the marked areas of each group of image information, extracting the maximum complete areas remained after each group of image information is divided to be used as normal areas of each copper-clad plate of the current production processing batch, further obtaining the size of the copper-clad plate required by the current printed circuit board, and carrying out overlapping comparison with the normal areas of each copper-clad plate of the current production processing batch, if the normal areas of the copper-clad plate are larger than the required size and the normal areas are not identified to influence the cutting defect, marking the copper-clad plate as qualified, otherwise marking the copper-clad plate as unqualified, and dividing the current production processing batch into qualified batches and unqualified batches based on analysis results; S2, screening unqualified batches based on the step S1, taking the qualified batches as processing batches for producing the current printed circuit board, inputting the size of copper-clad plates required by the current printed circuit board, automatically generating optimal cutting paths of copper-clad plates of the processing batches according to the marking information and the required size of the copper-clad plates of the processing batches, and confirming the optimal cutting paths generated by the copper-clad plates of the processing batches by an administrator; S3, after confirming no errors, controlling a cutting tool of a cutting machine to cut along an optimal cutting path of each copper-clad plate of a processing batch through preset cutting parameters, recording the running state of the cutting machine while cutting each copper-clad plate of the processing batch, automatically stopping the cutting tool and sending out a finishing signal after finishing cutting each copper-clad plate of the processing batch, and analyzing the cutting quality of the current cut copper-clad plate to obtain a plate quality evaluation index BZP of the current cut copper-clad plate; S4, comparing the plate quality evaluation index BZP of the current cut copper-clad plate with a preset machine qualit