CN-121985478-A - Circuit board assembly and manufacturing method thereof, camera module and packaging method thereof, and electronic equipment

Abstract

The application provides a manufacturing method of a circuit board assembly, which comprises the following steps of forming a through hole on a printed circuit board, wherein the printed circuit board is provided with a first surface and a second surface which are mutually spaced and oppositely arranged, the through hole penetrates through the first surface and the second surface, a sensor is arranged in the through hole, the sensor is arranged at intervals with the inner wall of the through hole, the height of the sensor is lower than that of the first surface and higher than or equal to that of the second surface, and the sensor is fixed on the printed circuit board, and is electrically connected with the printed circuit board. The application also provides a camera module packaging method comprising the circuit board assembly, the circuit board assembly manufactured according to the manufacturing method, the camera module and electronic equipment comprising the camera module.

Inventors

• YE JIANLIANG
• CHEN XINWEN
• LU JUNHONG

Assignees

• 三赢科技（深圳）有限公司

Dates

Publication Date

20260505

Application Date

20241025

Claims (12)

1. 1. The manufacturing method of the circuit board assembly is characterized by comprising the following steps: a through hole is formed in a printed circuit board, the printed circuit board is provided with a first surface and a second surface which are mutually spaced and oppositely arranged, and the through hole penetrates through the first surface and the second surface; placing a sensor in the through hole, the sensor being spaced from the inner wall of the through hole, the sensor being lower than the first surface and higher than or equal to the second surface, and And fixing the sensor on the printed circuit board and establishing electrical connection between the sensor and the printed circuit board.
2. 2. The method of manufacturing a circuit board assembly as defined in claim 1, wherein, The step of forming the through hole on the printed circuit board comprises the following steps: a through hole is formed in the printed circuit board, a groove is formed in one side, close to the through hole, of the first surface, and one side, facing the through hole, of the groove is communicated with the through hole; the step of establishing an electrical connection of the sensor to the printed circuit board comprises: Providing a plurality of first pins at the edge of the sensor, providing a plurality of second pins on the bottom wall of the recess, and The first pins and the second pins are electrically connected through wires, and the height of the wires is lower than that of the first surface.
3. 3. The method of manufacturing a circuit board assembly of claim 1, wherein said step of securing said sensor to said printed circuit board comprises: and filling an adhesive between the side surface of the sensor and the inner wall of the through hole so as to fixedly connect the sensor to the inner wall of the through hole, wherein the adhesive surrounds the sensor.
4. 4. The method of manufacturing a circuit board assembly of claim 1, wherein said step of placing said sensor in said through hole comprises: Coating a teflon coating on a die bonder; Placing the printed circuit board and the sensor on the die bonder, and And fixing the printed circuit board and the sensor through the die bonder.
5. 5. The method of manufacturing a circuit board assembly of claim 4, wherein the step of securing the printed circuit board and the sensor by the die bonder comprises: forming a plurality of mutually-spaced vent holes on the die bonder; and a vacuum pump is arranged in each vent hole, and each vacuum pump is respectively used for adsorbing the printed circuit board and the sensor.
6. 6. A camera module packaging method is characterized by comprising the following steps: A through hole is formed in the printed circuit board; placing a sensor in the through hole; fixing the sensor to the printed circuit board and establishing electrical connection of the sensor to the printed circuit board; Covering the sensor with a filter and fixing the filter on the first surface of the printed circuit board, and And covering the lens group on the filter plate and fixedly connecting the filter plate with the first surface of the printed circuit board, wherein the filter plate is positioned between the lens group and the sensor.
7. 7. The method of claim 6, wherein the step of fixedly attaching the lens assembly to the first surface of the printed circuit board comprises: The lens group is fixedly connected to the first surface of the printed circuit board by forming an adhesive between the lens group and the first surface.
8. 8. A circuit board assembly, comprising: The printed circuit board is provided with a first surface and a second surface which are mutually spaced and oppositely arranged, and the through holes penetrate through the first surface and the second surface; The sensor is positioned in the through hole, fixed on the printed circuit board and electrically connected with the printed circuit board, the sensor and the inner wall of the through hole are arranged at intervals, and the height of the sensor is lower than that of the first surface and higher than or equal to that of the second surface.
9. 9. The circuit board assembly of claim 8, wherein the first surface is formed with a groove on at least one side of the through hole, the groove is penetrated with the through hole toward one side of the through hole, the edge of the sensor is provided with a plurality of first pins, the bottom wall of the groove is provided with a plurality of second pins, and wires are electrically connected between the plurality of first pins and the plurality of second pins, and the height of the wires is lower than that of the first surface.
10. 10. The circuit board assembly of claim 8, wherein an adhesive is filled between the sensor side and the inner wall of the through hole to fixedly attach the sensor to the inner wall of the through hole.
11. 11. A camera module, comprising: The circuit board assembly of any of claims 8-10; a filter plate covering the sensor and fixedly connected to the first surface of the printed circuit board, the filter plate being spaced from the sensor, and The lens group is covered on one side of the filter sheet far away from the sensor and is fixedly connected with the first surface of the printed circuit board, wherein the lens group is formed by a lens group and a lens group, wherein the lens group is formed by a lens group The lens group is used for receiving and transmitting external light, the filter is positioned on a light path of the light emitted by the lens group and used for filtering part of the light, the other part of the light is received by the sensor through the filter, and the sensor is used for generating a corresponding image according to a light signal in the other part of the light.
12. 12. An electronic device, comprising: The camera module of claim 11, and And the display module is electrically connected with the printed circuit board and used for displaying the image generated by the camera module.

Description

Circuit board assembly and manufacturing method thereof, camera module and packaging method thereof, and electronic equipment Technical Field The application relates to a circuit board assembly manufacturing method, a camera module packaging method comprising the circuit board assembly, a camera module and electronic equipment comprising the camera module. Background The camera module is widely applied to the fields of mobile phones, notebook computers, toys, industrial detection, automobiles, medical appliances and the like. In which consumer digital products such as notebook computers are gradually developed toward miniaturization and slimness, the camera module is required to have smaller size. How to reduce the size of the camera module is a problem to be solved at present. Disclosure of Invention The first aspect of the present application provides a method for manufacturing a circuit board assembly, comprising the steps of: a through hole is formed in a printed circuit board, the printed circuit board is provided with a first surface and a second surface which are mutually spaced and oppositely arranged, and the through hole penetrates through the first surface and the second surface; placing a sensor in the through hole, the sensor being spaced from the inner wall of the through hole, the sensor being lower than the first surface and higher than or equal to the second surface, and And fixing the sensor on the printed circuit board and establishing electrical connection between the sensor and the printed circuit board. According to the manufacturing method of the circuit board assembly, after the through hole is formed in the printed circuit board, the sensor is placed in the through hole, and the sensor is directly and fixedly connected with the printed circuit board by connecting the side face of the sensor with the inner wall of the through hole. The manufacturing method of the circuit board assembly reduces the height of the circuit board assembly and reduces the size of the circuit board assembly under the condition of not changing the size of the traditional element. Further, the step of forming the through hole on the printed circuit board comprises forming the through hole on the printed circuit board, forming a groove on one side of the first surface close to the through hole, wherein the groove is communicated with the through hole towards one side of the through hole; the step of establishing the electrical connection of the sensor to the printed circuit board includes providing a plurality of first pins at an edge of the sensor and a plurality of second pins on a bottom wall of the recess, and The first pins and the second pins are electrically connected through wires, and the height of the wires is lower than that of the first surface. Further, the step of fixing the sensor to the printed circuit board includes: and filling an adhesive between the side surface of the sensor and the inner wall of the through hole so as to fixedly connect the sensor to the inner wall of the through hole, wherein the adhesive surrounds the sensor. Further, the step of placing the sensor in the through hole includes: Coating a teflon coating on a die bonder; Placing the printed circuit board and the sensor on the die bonder, and And fixing the printed circuit board and the sensor through the die bonder. Further, the step of fixing the printed circuit board and the sensor by the die bonder includes: forming a plurality of mutually-spaced vent holes on the die bonder; and a vacuum pump is arranged in each vent hole, and each vacuum pump is respectively used for adsorbing the printed circuit board and the sensor. The second aspect of the present application provides a method for packaging a camera module, including: A through hole is formed in the printed circuit board; placing a sensor in the through hole; fixing the sensor to the printed circuit board and establishing electrical connection of the sensor to the printed circuit board; Covering the sensor with a filter and fixing the filter on the first surface of the printed circuit board, and And covering the lens group on the filter plate and fixedly connecting the filter plate with the first surface of the printed circuit board, wherein the filter plate is positioned between the lens group and the sensor. The camera module packaging method integrates the circuit board assembly manufacturing method, and can realize all the beneficial effects of the circuit board assembly manufacturing method. Further, the step of fixedly connecting the lens group to the first surface of the printed circuit board includes: The lens group is fixedly connected to the first surface of the printed circuit board by forming an adhesive between the lens group and the first surface. A third aspect of the application provides a circuit board assembly comprising: The printed circuit board is provided with a first surface and a second surface which are mutually spaced and oppositely arran