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CN-121985479-A - Flexible circuit board production line based on intelligent circulating conveying platform

CN121985479ACN 121985479 ACN121985479 ACN 121985479ACN-121985479-A

Abstract

A flexible circuit board production line based on an intelligent circulating conveying platform belongs to the technical field of flexible circuit board manufacturing. The production line comprises a frame, and a pressing bracket and a conveying bracket which are arranged on the frame. The pressing support is sequentially provided with a hot pressing unit and a cold pressing unit, and the conveying support is provided with an upper conveying line and a lower conveying line. The automatic transfer of the workpieces among hot pressing, cold pressing and lower conveying lines is realized through a carrying manipulator on the portal frame, so that a continuous operation flow is formed. Wherein there is an auxiliary cover film which has a supporting rigidity at room temperature and is melt decomposable at a hot press temperature without a separate tearing step. The process sequentially completes low-temperature pressure equalization, temperature rising decomposition, solidification and pressure maintaining solidification in the hot pressing unit by matching with the material, and then carries out programmed cooling in the cold pressing unit. The invention couples material innovation with equipment and process depth, thoroughly eliminates the film tearing link in the traditional lamination process, and realizes the simplification of working procedures, the improvement of precision and full-automatic continuous production.

Inventors

  • YAO XIN

Assignees

  • 湖州艾格莱德智能技术有限公司

Dates

Publication Date
20260505
Application Date
20251231

Claims (8)

  1. 1. The flexible circuit board production line based on the intelligent circulating conveying platform comprises a frame, and is characterized in that the frame comprises a pressing bracket (1) and a conveying bracket (2); The hot pressing unit (3) and the cold pressing unit (4) are sequentially arranged on the pressing bracket (1), and the hot pressing unit (3) and the cold pressing unit (4) comprise an upper pressing plate and a lower pressing plate which can move relatively; An upper layer conveying line (5) and a lower layer conveying line (6) are arranged on the conveying support (2), the upper layer conveying line (5) is used for conveying the flexible circuit board assembly to be pressed to the hot pressing unit (3), and the lower layer conveying line (6) is used for outputting the pressed flexible circuit board assembly from the cold pressing unit (4); The frame still including set up in hot pressing unit (3) with cold pressing unit (4) peripheral portal frame (7), be equipped with on portal frame (7) can hot pressing unit (3) cold pressing unit (4) with transfer flexible circuit board subassembly's transport manipulator (8) between lower floor's transfer chain (6).
  2. 2. Flexible circuit board production line based on intelligent circulation conveying platform according to claim 1, characterized in that the side of conveying support (2) is provided with at least one feeding support (20), be provided with on feeding support (20) and be used for placing the feeding preparation platform (21) of waiting to pressfitting flexible circuit board subassembly, the export of feeding preparation platform (21) with upper conveying line (5) butt joint.
  3. 3. Flexible circuit board production line based on intelligent circulation conveying platform according to claim 1 or 2, characterized in that the end of conveying support (2) is provided with lifting support (22), be provided with lifting machine (23) in lifting support (22), lifting machine (23) are used for promoting the back subassembly of pressfitting on lower floor's transfer chain (6) to the production line outside.
  4. 4. The flexible circuit board production line based on the intelligent circulating conveying platform according to claim 3, wherein the feeding preparation table (21) is provided with a high-precision PIN sleeving jig, and the flexible circuit board production line is used for performing a preparation step, and performing false adhesion on the auxiliary covering film and the FPC through the high-precision PIN sleeving jig.
  5. 5. The flexible circuit board production line based on the intelligent circulating conveying platform, as claimed in claim 4, is characterized in that the auxiliary covering film is a heat-fusible sacrificial layer, and the preparation materials comprise, by mass, 40% -60% of polyvinyl butyral, 30% -50% of polyethylene glycol with molecular weight of 1000-4000, 5% -15% of citric acid ester plasticizer, and 1% -5% of modified organic silicon micropowder or zinc stearate.
  6. 6. The flexible circuit board production line based on the intelligent circulating conveying platform according to claim 5, wherein the preparation method of the auxiliary covering film is as follows: a, raw material preparation and pretreatment: vacuum drying polyvinyl butyral resin at 80 deg.c for 4 hr to eliminate water, and smelting polyethylene glycol at 50 deg.c; b, batching and dissolving: adding the dried polyvinyl butyral resin into a mixed solvent of ethanol and ethyl acetate according to a mass ratio of 7:3, and then placing the mixed solvent into a closed reaction kettle with stirring and heating; heating to 65+/-5 ℃, and continuously stirring until the polyethylene glycol is completely dissolved to form uniform glue solution; cooling the closed reaction kettle to 50 ℃, sequentially adding molten polyethylene glycol, a plasticizer and a release agent, and continuously stirring for 2-4 hours to form uniform and transparent mixed slurry; c, stirring at constant temperature and vacuum defoaming: transferring the mixed slurry into a storage tank, maintaining the temperature at 50 ℃ and stirring at a low speed, and simultaneously starting a vacuum pump to remove bubbles in the mixed slurry at-0.095 MPa for at least 1 hour; d, precise casting coating: And coating the defoamed slurry on a polyester release film carrier running at a constant speed by using a precise tape casting coater. The parameters adopted by the precise tape casting coater are that the thickness of the film to be formed is set to 80+/-5 mu m, the film is precisely controlled through the clearance of a scraper, and the coating speed is 1.5 m/min-2 m/min; And e, programming temperature and drying: The method comprises the steps of enabling a film to be formed to enter a drying tunnel with three temperature areas, wherein the temperature of the temperature areas is 60 ℃,80 ℃ and 100 ℃ in sequence in the conveying direction, the drying time of the temperature areas at 60 ℃ is 3 minutes, the drying time of the temperature areas at 80 ℃ is 5 minutes, and the drying time of the temperature areas at 100 ℃ is 10 minutes; f, cooling, shaping and rolling: and (3) cooling the dried film to be formed to room temperature by a cooling roller, stripping the film from the polyester release film, and rolling the auxiliary covering film with the final thickness of 50+/-2 mu m for standby by a tension control system.
  7. 7. Flexible circuit board production line based on intelligent circulation conveyor platform according to claim 1 or 4, characterized in that the hot press unit (3) is capable of performing a multi-stage lamination procedure comprising low Wen Junya, temperature-rising curing and pressure-maintaining curing; The hot pressing unit (3) is started at a lower temperature below 100 ℃ to enable the auxiliary covering film to be primarily and tightly attached to the FPC; the heating and solidification are that the hot pressing unit (3) is heated to the solidification temperature which is 180 ℃, and the auxiliary covering film is melted, decomposed and gasified in the step; the dwell curing is to maintain pressure at the curing temperature to ensure complete curing of the FPC.
  8. 8. Flexible circuit board production line based on intelligent circulation conveyor platform according to claim 7, characterized in that the cold pressing unit (4) is able to perform programmed cooling in a pressure-maintaining state, The programmed cooling is to cool by a preset cooling program under the pressure, and take out the product when the temperature of the product can be safely taken out.

Description

Flexible circuit board production line based on intelligent circulating conveying platform Technical Field The invention relates to the technical field of flexible circuit board manufacturing, in particular to a flexible circuit board production line based on an intelligent circulating conveying platform. Background When laminating a cover film or a reinforcing plate, the flexible circuit board needs to ensure extremely high alignment precision, and particularly when being applied to precision fields such as laser welding, the alignment precision needs to be controlled within 0.05 mm. In the prior art, to achieve this accuracy, a complex multi-step process is typically employed. In the disclosure document with publication number CN113411973A, a layer of PET film is adhered to the cover film to increase its rigidity for easy processing, and then the cover film is pasted to FPC via PIN fixture, cold pressed to fix preliminarily, and then the PET film is torn manually or mechanically, and then the high temperature TPX film is covered on FPC for final hot press solidification. The process has the defects of complicated whole working procedure, particularly the independent step of film tearing, low efficiency, possibility of introducing secondary alignment errors or pollution, and high cost due to the fact that a TPX high-temperature film is used as a glue blocking medium, wherein the film belongs to disposable consumable materials, cold pressing and hot pressing are carried out step by step, and therefore the distribution of equipment of the whole production line is dispersed, and automation consistency is poor. For this reason, the applicant has been working on developing a lamination solution which allows to simplify the process, to increase the efficiency, to guarantee the precision and to be more suitable for automated continuous production. Disclosure of Invention The invention aims to solve the technical problems of complicated working procedures, low efficiency and secondary alignment risk of the existing FPC lamination process, and provides a flexible circuit board production line based on an intelligent circulating conveying platform, and a material and a process matched with the flexible circuit board production line, so that integrated high-efficiency precise lamination is realized. In order to solve the technical problems, the invention adopts the following technical scheme: In a first aspect, a flexible circuit board production line based on an intelligent circulating conveying platform is provided, which comprises a frame, wherein the frame comprises a pressing bracket and a conveying bracket; the pressing bracket is provided with a hot pressing unit and a cold pressing unit which are sequentially arranged, and each hot pressing unit and each cold pressing unit comprises an upper pressing plate and a lower pressing plate which can relatively move; An upper layer conveying line and a lower layer conveying line are arranged on the conveying support, the upper layer conveying line is used for conveying the flexible circuit board assembly to be pressed to the hot pressing unit, and the lower layer conveying line is used for outputting the pressed flexible circuit board assembly from the cold pressing unit; the frame is equipped with the transport manipulator that can shift flexible circuit board subassembly between hot pressing unit, cold pressing unit and lower floor's transfer chain on the portal frame including setting up in hot pressing unit and cold pressing unit peripheral portal frame. In an embodiment, at least one feeding support is arranged on the side face of the conveying support, a feeding preparation table for placing the flexible circuit board assembly to be pressed is arranged on the feeding support, and an outlet of the feeding preparation table is in butt joint with the upper conveying line. In an embodiment, the end of the conveying support is provided with a lifting support, a lifting machine is arranged in the lifting support, and the lifting machine is used for lifting the pressed assembly on the lower conveying line out of the production line. In the implementation mode, the feeding preparation table is provided with a high-precision PIN sleeving jig, and the feeding preparation table is used for carrying out preparation steps, and the auxiliary covering film and the FPC are subjected to fake bonding through the high-precision PIN sleeving jig. A special polymer auxiliary covering film with low melting point and high thermal decomposition efficiency is adopted as a sacrificial layer. The material starts to melt and gasify and decompose rapidly at 160-180 ℃ and the decomposition products are harmless small molecule gases. In the second aspect, the auxiliary covering film is a heat-fusible sacrificial layer, and the preparation material comprises, by mass, 40% -60% of polyvinyl butyral, 30% -50% of polyethylene glycol with a molecular weight of 1000-4000, 5% -15% of a citrate plas