CN-121985480-A - Manufacturing process of stacked holes of circuit board and circuit board

CN121985480ACN 121985480 ACN121985480 ACN 121985480ACN-121985480-A

Abstract

The present invention relates to the field of circuit board manufacturing technologies, and in particular, to a manufacturing process of a stacked hole of a circuit board and a circuit board. A manufacturing process of a laminated hole of a circuit board comprises the steps of preparing a base layer plate, wherein the base layer plate comprises a first metal layer, a first dielectric layer and a second metal layer which are laminated, the first metal layer is arranged on the top layer of the base layer plate, metal materials at positions to be drilled of the first metal layer are etched according to the shape and the positions of the designed laminated hole to form a window exposing the first dielectric layer, a second dielectric layer and a third metal layer are pressed on the first metal layer, laser drilling is conducted from the position, corresponding to the window, of the third metal layer to form a vertical hole exposing the second metal layer, and the vertical hole is electroplated and filled to form the laminated hole. The thickness of the metal layer on the subsequent laser drilling path is reduced by etching the metal material at the position to be drilled of the first metal layer, so that the whole vertical hole is drilled by laser, then the vertical hole is electroplated and filled, the process is simplified, and the processing efficiency is improved.

Inventors

YUE HAN
HAN XUECHUAN
DONG JIN
WANG JUCAI

Assignees

深南电路股份有限公司

Dates

Publication Date: 20260505
Application Date: 20260106

Claims (10)

1. The manufacturing process of the stacked holes of the circuit board is characterized by comprising the following steps of: Preparing a base layer plate, wherein the base layer plate comprises a first metal layer, a first dielectric layer and a second metal layer which are stacked along the thickness direction of the base layer plate, and the first metal layer is positioned on the top layer of the base layer plate; Etching the metal material of the position to be drilled of the first metal layer according to the shape and the position of the designed stacked hole to form a window exposing the first dielectric layer; Sequentially pressing a second dielectric layer and a third metal layer on the first metal layer to obtain a multilayer board; laser drilling from the position of the third metal layer corresponding to the window to form a vertical hole exposing the second metal layer; And (3) electroplating and filling up the vertical holes to form stacked holes.
2. The process for manufacturing the stacked hole of the circuit board according to claim 1, wherein the etching the metal material of the first metal layer at the position to be drilled according to the shape and the position of the stacked hole to be processed to form a window exposing the first dielectric layer specifically comprises: And manufacturing a circuit pattern on the first metal layer through a dry film-exposure-development-etching-stripping process, and etching the metal material of the first metal layer at the position to be drilled to form a window.
3. The process for manufacturing the stacked hole of the circuit board according to claim 2, wherein the etching the metal material of the first metal layer at the position to be drilled according to the shape and the position of the stacked hole to be processed to form the window exposing the first dielectric layer, further comprises: Etching a target on the first metal layer in the dry film-exposure-development-etching-stripping process; The laser drilling is performed from the position of the third metal layer corresponding to the window to form a vertical hole exposing the second metal layer, and the method specifically comprises the following steps: laser burning targets of the third metal layer and the second dielectric layer to expose targets of the first metal layer; Through the target positioning of the first metal layer, a laser beam is directed at the window to laser drill from the top surface of the third metal layer until the second metal layer is exposed to form a vertical hole.
4. The process for manufacturing the stacked holes of the circuit board according to claim 1, wherein the projection contour of the window on the top surface of the first metal layer is 20-50 μm inside the projection contour of the top opening of the vertical hole on the top surface of the first metal layer.
5. The process for manufacturing the stacked holes of the circuit board according to claim 1, wherein the forming of the vertical holes exposing the second metal layer by laser drilling from the position of the third metal layer corresponding to the window comprises: and continuously laser drilling from the position of the third metal layer corresponding to the window along a direction, wherein adjacent vertical holes are partially overlapped to form a strip-shaped groove, and the groove exposes the second metal layer.
6. The process for manufacturing the stacked holes of the circuit board according to claim 1, wherein the preparing the base plate comprises: And blanking a core plate, wherein the core plate comprises an insulating base material and copper layers laminated on the surfaces of two sides of the insulating base material in the thickness direction, the copper layers on one side form a first metal layer, the copper layers on the other side form a second metal layer, and the insulating base material forms a first dielectric layer.
7. The circuit board is characterized by comprising a base layer plate, a build-up plate and a stacking hole, wherein the base layer plate comprises a first metal layer, a first dielectric layer and a second metal layer which are stacked along the thickness direction of the base layer plate, the first metal layer is positioned on the top layer of the base layer plate, and a window penetrating along the thickness direction of the first metal layer is arranged on the first metal layer; The build-up board comprises a second dielectric layer and a third metal layer, the second dielectric layer is laminated between the first metal layer and the third metal layer, the build-up hole comprises a vertical hole and a conductive structure arranged in the vertical hole, the vertical hole extends along the thickness direction of the circuit board and corresponds to the window in the thickness direction of the base board, and the conductive structure is electrically connected with the second metal layer and the third metal layer.
8. The circuit board of claim 7, wherein the projection profile of the window on the top surface of the first metal layer is 20-50 μm inside the projection profile of the top opening of the vertical hole on the top surface of the first metal layer.
9. The circuit board of claim 7, wherein a plurality of the vertical holes are provided, and a plurality of the vertical holes are partially overlapped in a direction to form a long stripe-shaped groove.
10. The circuit board according to claim 7, wherein the base board is a core board including an insulating base material and copper layers laminated on both side surfaces in a thickness direction of the insulating base material, wherein the copper layers on one side form the first metal layer, the copper layers on the other side form the second metal layer, and the insulating base material forms the first dielectric layer.

Description

Manufacturing process of stacked holes of circuit board and circuit board Technical Field The present invention relates to the field of circuit board manufacturing technologies, and in particular, to a manufacturing process of a stacked hole of a circuit board and a circuit board. Background A conventional circuit board is a substrate for mechanically supporting and electrically connecting electronic components, which realizes reliable interconnection between the electronic components through a pre-designed conductive pattern (such as copper foil wiring, pads, vias, etc.), and is a core component of an electronic product. The stacked holes are one of key technologies for realizing the development of high density of the circuit board, and high-efficiency cross-layer connection is realized in a limited space through vertical stacking of multiple layers of through holes. In the conventional hole stacking manufacturing process, as shown in fig. 1 to 4, after laminating an insulating layer 2' and a copper foil 3' on a core board 1', laser drilling is performed, a laser drilled through hole 4' penetrates through the copper foil 3' and the insulating layer 2' of the corresponding layer, after electroplating and hole filling are performed on the through hole 4', a new insulating layer 2' and copper foil 3' are laminated, and the laser drilling and electroplating and hole filling are repeated, so that through holes of different layers are stacked in a vertical direction to form a hole stack. However, in the above-mentioned stacked hole manufacturing process, each time an insulating layer and a copper foil are laminated, it is necessary to drill and fill holes once, the processing steps are complicated, and the processing efficiency is low. Disclosure of Invention Aiming at the problems of complicated processing steps and lower processing efficiency of the existing manufacturing process of the stacked holes of the circuit board, the invention provides the manufacturing process of the stacked holes of the circuit board and the circuit board. In order to solve the above problems, in one aspect, an embodiment of the present invention provides a process for manufacturing a stacked hole of a circuit board, including the following steps: Preparing a base layer plate, wherein the base layer plate comprises a first metal layer, a first dielectric layer and a second metal layer which are stacked along the thickness direction of the base layer plate, and the first metal layer is positioned on the top layer of the base layer plate; Etching the metal material of the position to be drilled of the first metal layer according to the shape and the position of the designed stacked hole to form a window exposing the first dielectric layer; Sequentially pressing a second dielectric layer and a third metal layer on the first metal layer to obtain a multilayer board; laser drilling from the position of the third metal layer corresponding to the window to form a vertical hole exposing the second metal layer; And (3) electroplating and filling up the vertical holes to form stacked holes. Optionally, etching the metal material of the first metal layer at the position to be drilled according to the shape and the position of the stacked hole to be processed to form a window exposing the first dielectric layer, which specifically includes: And manufacturing a circuit pattern on the first metal layer through a dry film-exposure-development-etching-stripping process, and etching the metal material of the first metal layer at the position to be drilled to form a window. Optionally, the etching the metal material of the first metal layer at the position to be drilled according to the shape and the position of the stacked hole to be processed to form a window exposing the first dielectric layer, and further includes: Etching a target on the first metal layer in the dry film-exposure-development-etching-stripping process; The laser drilling is performed from the position of the third metal layer corresponding to the window to form a vertical hole exposing the second metal layer, and the method specifically comprises the following steps: laser burning targets of the third metal layer and the second dielectric layer to expose targets of the first metal layer; Through the target positioning of the first metal layer, a laser beam is directed at the window to laser drill from the top surface of the third metal layer until the second metal layer is exposed to form a vertical hole. Optionally, the projection outline of the window on the top surface of the first metal layer is located at the inner side 20-50 μm of the projection outline of the top opening of the vertical hole on the top surface of the first metal layer. Optionally, the laser drilling is performed from the position of the third metal layer corresponding to the window to form a vertical hole exposing the second metal layer, which specifically includes: and continuously laser drilling from the