CN-121985483-A - Production method of flexible circuit board

Abstract

The invention discloses a production method of a flexible circuit board, which comprises the steps of determining the defective board rate of each mother board, screening out target mother boards according to the defective board rate, wherein the target mother boards are mother boards with the defective board rate within a preset range, performing a steel sheet reinforcing procedure on non-defective unit boards in the target mother boards, separating boards of each target mother board to screen out non-defective unit boards, combining a plurality of the non-defective unit boards to form a virtual board, and sending the virtual board as a standard board to an SMT production line for mounting processing to prepare the flexible circuit board. According to the invention, the mother jointed boards with excessively high reject ratio are accurately screened out by setting the preset range, and the defect-free unit boards in the mother jointed boards are independently treated and recombined, so that the overall production efficiency and the material utilization rate can be effectively improved.

Inventors

• LI SHOUGANG
• YOU JIAN
• CHEN YONGBAO
• LI YIXIAO
• LI JUN

Assignees

• 台山市精诚达电路有限公司
• OPPO广东移动通信有限公司

Dates

Publication Date

20260505

Application Date

20260407

Claims (10)

1. 1. A method of producing a flexible circuit board, comprising: determining the bad board rate of each mother board, and screening out target mother boards according to the bad board rate, wherein the target mother boards are mother boards with the bad board rate within a preset range; performing a steel sheet reinforcement process on the non-defective cell plates in the target parent plate; Dividing each target mother jointed board to screen out non-defective unit boards; And combining a plurality of the defect-free unit plates to form a virtual jointed board, and sending the virtual jointed board serving as a standard jointed board to an SMT production line for mounting processing so as to prepare the flexible circuit board.
2. 2. The method of claim 1, wherein determining the failure rate of each parent panel comprises: Acquiring an electrical performance test result of each unit board in the female jointed board, and determining whether each unit board is a defective unit board or not according to the electrical performance test result; And determining the defective board rate of each mother board according to the number of defective unit boards in each mother board.
3. 3. The method according to claim 1, wherein the steel sheet reinforcement process is performed on the non-defective cell plates in the target mother panel, comprising: Marking the defective unit plates in the target female jointed board; and carrying out a steel sheet reinforcement procedure on the non-defective unit plates which are not marked in the target female jointed board through a reinforcement machine.
4. 4. The method of claim 1, wherein separating each of the target parent panels to screen out defect-free panels comprises: Blanking each target female jointed board so as to divide the target female jointed board into a plurality of independent unit boards; Reinforcing by determining whether each individual cell plate has been attached with a steel sheet; And if the cell plates are reinforced by the attached steel sheets, screening the cell plates reinforced by the attached steel sheets, thereby screening out the non-defective cell plates.
5. 5. The method of claim 1, wherein combining a plurality of said non-defective cell plates to form a virtual panel comprises: Acquiring a PI bearing film, wherein the PI bearing film corresponds to the panel layout of a mother panel, and a plurality of adhesive areas for temporarily fixing the defect-free unit plates are arranged on the PI bearing film; and respectively fixing the plurality of defect-free unit plates on the corresponding adhesive areas of the PI bearing film in a removable mode, so as to form the virtual jointed board.
6. 6. The production method according to claim 5, wherein the adhesive area is provided with a plurality of high temperature resistant double sided adhesive tapes which are arranged in a curved shape, the high temperature resistant double sided adhesive tapes are provided with weak adhesive surfaces and strong adhesive surfaces, the strong adhesive surfaces are adhered to the PI carrier film, and the weak adhesive surfaces are used for adhering the defect-free cell plates.
7. 7. The method of claim 5, wherein removably affixing the plurality of defect-free cell plates to the respective adhesive regions of the PI carrier film, respectively, comprises: Acquiring a splicing jig, wherein the splicing jig comprises a base for fixing the PI bearing film and a cover plate detachably arranged on the base; And performing auxiliary operation based on the base and the cover plate, so that the plurality of defect-free unit plates are temporarily fixed on the corresponding adhesive areas of the PI bearing film respectively, and the virtual jointed board is formed.
8. 8. The method according to claim 7, wherein performing an auxiliary operation based on the base and the cover plate to temporarily fix the plurality of non-defective cell plates to the corresponding adhesive areas of the PI carrier film, respectively, to form the virtual panel, comprises: sequentially mounting the PI bearing film and the cover plate on the base, wherein the cover plate is provided with a plurality of guide holes corresponding to the positions of the gluing areas, and the guide holes are used for exposing the corresponding gluing areas on the PI bearing film; Guiding each non-defective unit plate one by one through the guide hole, placing the non-defective unit plates in corresponding gluing areas on the PI bearing film, and applying pressure to fix the non-defective unit plates; And after all the gluing areas on the PI bearing film are fixed with non-defective unit plates, removing the cover plate to obtain the virtual jointed board.
9. 9. The method of claim 7, wherein the base is provided with a positioning PIN, the PI carrier film and the cover plate are provided with positioning holes, and the PI carrier film and the cover plate are mounted on the base in sequence, respectively, comprising: and the PI bearing film and the jig cover plate are sequentially positioned and placed on the base through the positioning PIN and the positioning hole.
10. 10. The method of producing according to claim 5, further comprising: setting a positioning mark for positioning SMT equipment at the edge of the PI bearing film, wherein the position of the positioning mark is consistent with the position of a plate edge identification mark of a standard jointed plate; after the virtual jointed boards are sent into an SMT production line, the positioning of the virtual jointed boards is completed together by identifying the positioning marks and the unit identification marks carried by each non-defective unit board, so that the SMT equipment can carry out solder paste printing and component mounting.

Description

Production method of flexible circuit board Technical Field The invention relates to the technical field of flexible circuit boards, in particular to a production method of a flexible circuit board. Background In the production process of flexible circuit boards (i.e., FPCs), in order to improve production and circulation efficiency, it is common practice to combine a plurality of independent unit boards (for example, in the form of 4 boards) into one board for integral processing and circulation. Because of the fine circuit design and complex manufacturing process flow of the multi-layer FPC board, the overall production yield is generally low, for example, often lower than 70%. However, in the existing production process, even if a panel includes a plurality of defective unit boards (for example, a 4-panel includes 2 or 3 defective boards), the whole board still continues to flow into the subsequent surface mounting (i.e., SMT) process. This results in expensive SMT equipment that requires a series of ineffective operations such as solder paste printing, component mounting, etc. on a large number of bad boards that should be discarded, severely seizing the effective capacity of the equipment and reducing the overall production efficiency. Meanwhile, auxiliary materials such as steel sheet reinforcement are attached to the bad plates in the earlier process, so that direct material waste is caused. Disclosure of Invention The invention aims to solve the technical problems of equipment capacity waste and material waste caused by excessive bad boards flowing into an SMT process in the existing flexible circuit board production process. In order to solve the technical problems, the technical scheme adopted by the invention is that the production method of the flexible circuit board comprises the following steps: determining the bad board rate of each mother board, and screening out target mother boards according to the bad board rate, wherein the target mother boards are mother boards with the bad board rate within a preset range; performing a steel sheet reinforcement process on the non-defective cell plates in the target parent plate; Dividing each target mother jointed board to screen out non-defective unit boards; And combining a plurality of the defect-free unit plates to form a virtual jointed board, and sending the virtual jointed board serving as a standard jointed board to an SMT production line for mounting processing so as to prepare the flexible circuit board. Optionally, the determining the failure rate of each female panel includes: Acquiring an electrical performance test result of each unit board in the female jointed board, and determining whether each unit board is a defective unit board or not according to the electrical performance test result; And determining the defective board rate of each mother board according to the number of defective unit boards in each mother board. Optionally, performing a steel sheet reinforcement process on the non-defective cell plates in the target parent panel, including: Marking the defective unit plates in the target female jointed board; and carrying out a steel sheet reinforcement procedure on the non-defective unit plates which are not marked in the target female jointed board through a reinforcement machine. Optionally, splitting each of the target parent panels to screen out non-defective cell plates, including: Blanking each target female jointed board so as to divide the target female jointed board into a plurality of independent unit boards; Reinforcing by determining whether each individual cell plate has been attached with a steel sheet; And if the cell plates are reinforced by the attached steel sheets, screening the cell plates reinforced by the attached steel sheets, thereby screening out the non-defective cell plates. Optionally, combining a plurality of said defect-free cell plates to form a virtual panel, comprising: Acquiring a PI bearing film, wherein the PI bearing film corresponds to the panel layout of a mother panel, and a plurality of adhesive areas for temporarily fixing the defect-free unit plates are arranged on the PI bearing film; and respectively fixing the plurality of defect-free unit plates on the corresponding adhesive areas of the PI bearing film in a removable mode, so as to form the virtual jointed board. Optionally, the adhesive area is provided with a plurality of high temperature resistant double faced adhesive tapes in a curved arrangement, the high temperature resistant double faced adhesive tapes are provided with a weak adhesive surface and a strong adhesive surface, the strong adhesive surface is adhered to the PI bearing film, and the weak adhesive surface is used for adhering the defect-free unit plates. Optionally, removably fixing the plurality of defect-free cell plates on the corresponding adhesive regions of the PI carrier film, respectively, including: Acquiring a splicing jig, wherein the splicing jig com