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CN-121985484-A - PCB film pasting method and film pasting equipment

CN121985484ACN 121985484 ACN121985484 ACN 121985484ACN-121985484-A

Abstract

The invention relates to the technical field of circuit board film sticking, and particularly discloses a PCB film sticking method and film sticking equipment. The method comprises the steps of assembling a boosting layer and a dry film layer on PCB film pasting equipment, respectively conveying the boosting layer and the dry film layer by utilizing the PCB film pasting equipment, enabling a hot pressing roller on the PCB film pasting equipment to be in running fit with a hard layer, enabling the boosting layer to be abutted against the dry film layer to enable a soft layer to be attached to a polyethylene protective film, debugging the production state of the PCB film pasting equipment until no wrinkling or air bubbles occur between the boosting layer and the dry film layer through the hot pressing roller within a preset distance, stopping debugging the PCB film pasting equipment, conveying a film pasting plate to be pasted by utilizing the PCB film pasting equipment, enabling the plate surface of the film pasting plate to be attached to a dry film sensitive layer, controlling the hot pressing roller to thermally press the dry film layer to the film pasting plate, and taking down the boosting layer after the hot pressing roller to obtain a processed finished product. According to the method, accurate lamination of the dry film layer on the film plate to be laminated is realized by means of the lamination layer, and the product yield of film laminating operation is improved.

Inventors

  • XIE QUANBIN
  • HE DONG
  • ZHANG YISHUI
  • ZHOU YONG

Assignees

  • 广州广合科技股份有限公司
  • 黄石广合精密电路有限公司

Dates

Publication Date
20260505
Application Date
20260326

Claims (10)

  1. A PCB film pasting method for pasting a dry film layer (200) on a film pasting plate (100), wherein the dry film layer (200) comprises a dry film photosensitive layer (210) and a polyethylene protective film (220) which are stacked, and the dry film photosensitive layer (210) is used for pasting with the plate surface of the film pasting plate (100), and the PCB film pasting method is characterized by comprising the following steps: S10, assembling a pressure-assisting layer (300) and the dry film layer (200) on PCB film pasting equipment, wherein the pressure-assisting layer (300) comprises a soft layer (310) and a hard layer (320) which are arranged in a laminated mode, the hardness of the hard layer (320) is greater than that of the soft layer (310), and the soft layer (310) does not react with the polyethylene protective film (220); s20, conveying the pressure-assisting layer (300) and the dry film layer (200) by using the PCB film pasting equipment, wherein a hot press roller (400) on the PCB film pasting equipment is in rotary fit with the hard layer (320), and the pressure-assisting layer (300) is pressed against the dry film layer (200) so as to enable the soft layer (310) to be attached to the polyethylene protective film (220); S30, debugging the production state of the PCB film sticking equipment until no wrinkling or air bubbles appear between the pressure-assisting layer (300) passing through the hot press roller (400) and the dry film layer (200) within a preset distance, stopping debugging the PCB film sticking equipment, and judging that the PCB film sticking equipment is qualified in debugging; S40, conveying the film-sticking plate (100) by using the PCB film-sticking equipment, sticking the plate surface of the film-sticking plate (100) to the dry film photosensitive layer (210), and controlling the hot press roller (400) to hot press the dry film layer (200) to the film-sticking plate (100); And S50, taking down the pressure-assisting layer (300) after passing through the hot press roller (400) to obtain a processed finished product.
  2. 2. The PCB filming method of claim 1, wherein the soft layer (310) has a fluidity lower than that of the dry film layer (200).
  3. 3. The PCB filming method of claim 1, wherein the thickness of the soft layer (310) is greater than 150um.
  4. 4. The PCB filming method of claim 1 wherein said rigid layer (320) has a thickness of 30-50um.
  5. 5. The PCB filming method of claim 1, wherein the hardness of the hard layer (320) is 5-10 times the hardness of the soft layer (310).
  6. 6. The method according to any one of claims 1 to 5, wherein the soft layer (310) is made of silica gel, and/or the hard layer (320) is made of silica gel.
  7. A PCB film laminating apparatus, characterized in that it is applied to the PCB film laminating method of any one of claims 1 to 6, and the PCB film laminating apparatus includes a film laminating module for adhering a dry film layer (200) to one side of a film board (100), the film laminating module includes a first feeding roller (500), a second feeding roller (600) and a hot press roller (400), a roll of the dry film layer (200) is mounted on the first feeding roller (500) for unreeling the dry film layer (200), and a roll of the booster layer (300) is mounted on the second feeding roller (600) for unreeling the booster layer (300).
  8. 8. The PCB laminating apparatus according to claim 7, wherein two of the laminating modules are provided, and the two laminating modules are respectively used for adhering the dry film layers (200) to two sides of the same film plate (100) to be laminated, and the two hot press rolls (400) are symmetrically arranged with respect to a conveying direction of the film plate (100) to be laminated.
  9. 9. The PCB laminating apparatus according to claim 7, wherein the transfer direction of the film plate (100) to be laminated is perpendicular to the rotation axis direction of the thermo-compression roller (400).
  10. 10. The PCB laminating apparatus according to claim 7, wherein the transfer direction of the film plate (100) to be laminated is perpendicular to the vertical direction, and the rotation axis of the thermo-compression roller (400) is axially perpendicular to the vertical direction.

Description

PCB film pasting method and film pasting equipment Technical Field The invention relates to the technical field of circuit board film sticking, in particular to a PCB film sticking method and film sticking equipment. Background In the manufacturing process of the PCB (Printed Circuit Board ), the manufacture of the outer layer circuit is one of the key links for determining the electrical connection accuracy and reliability of the product. The link is usually a film pressing process, and a dry film material with photosensitive characteristics is tightly adhered to the surface of the PCB to serve as a mask for the subsequent pattern transfer. Along with the development of electronic information technology, PCB products are evolving towards high integration level and multifunction, and various novel structures such as a high thickness-diameter ratio plate, a soft and hard combined plate and the like are emerging. The physical structure of such highly difficult PCBs presents significant non-uniformity characteristics. For example, the flatness of the plate surface is reduced due to the dense local metalized holes or the thickness difference of the base material, and the soft and hard combined plate is formed by laminating materials with different characteristics, so that obvious height drop or recess is easily formed in the soft and hard junction area. These structural features make the surface of the film to be applied no longer an ideal plane, but rather a region of localized concavity, step or warpage. In the conventional standardized film pressing operation, a conventional film pressing method applies linear pressure to a dry film by a hot press roll, so that the dry film is attached to a plate surface. However, when there is a large height difference or a concave area on the PCB surface, the dry film often cannot effectively fill these low-lying portions under the hard rolling action of the hot press roller. Because the dry film has certain rigidity and rebound resilience, when crossing the concave area, bridging phenomenon is easy to form at the concave edge, air is sealed between the dry film and the plate surface to form bubbles, and meanwhile, because the pressure bearing of the plate surface is uneven, stress concentration can be generated in the transition area of the dry film, and wrinkling is caused. The defects of the film pasting not only affect the initial binding force of the dry film and the board surface, but also cause serious quality problems such as open circuit, short circuit or precision deviation and the like of a circuit in the subsequent exposure, development and etching processes, directly lead to scrapping of products, and seriously affect the production efficiency and the delivery cycle. Disclosure of Invention The invention aims to provide a PCB film pasting method and film pasting equipment, so as to ensure the accurate pasting of a dry film layer on a film pasting plate to be pasted, and improve the product yield of film pasting operation. To achieve the purpose, the invention adopts the following technical scheme: The PCB film pasting method is used for pasting a dry film layer on a film pasting plate, the dry film layer comprises a dry film photosensitive layer and a polyethylene protective film which are arranged in a laminated mode, the dry film photosensitive layer is used for being attached to the plate surface of the film pasting plate, and the PCB film pasting method comprises the following steps of: S10, assembling a pressure-assisting layer and the dry film layer on PCB film pasting equipment, wherein the pressure-assisting layer comprises a soft layer and a hard layer which are arranged in a laminated mode, the hardness of the hard layer is larger than that of the soft layer, and the soft layer does not react with the polyethylene protective film chemically; S20, conveying the boosting layer and the dry film layer by using the PCB film pasting equipment respectively, wherein a hot press roller on the PCB film pasting equipment is in running fit with the hard layer, and the boosting layer is propped against the dry film layer to enable the soft layer to be attached to the polyethylene protective film; s30, debugging the production state of the PCB film laminating equipment until no wrinkling or air bubbles appear between the boosting layer passing through the hot press roller and the dry film layer within a preset distance, stopping debugging the PCB film laminating equipment, and judging that the PCB film laminating equipment is qualified in debugging; s40, conveying the film-sticking plate by using the PCB film-sticking equipment, sticking the plate surface of the film-sticking plate to the dry film photosensitive layer, and controlling the hot pressing roller to hot press the dry film layer on the film-sticking plate; and S50, taking down the pressure-assisting layer after passing through the hot press roller to obtain a processed finished product. As an alternativ