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CN-121985486-A - Preparation method of glass-based circuit board and light-emitting panel

CN121985486ACN 121985486 ACN121985486 ACN 121985486ACN-121985486-A

Abstract

The disclosure provides a preparation method of a glass-based circuit board and a light-emitting panel. The preparation method comprises the steps of preparing conductive paste, wherein the conductive paste comprises conductive powder, a low-temperature sintering aid and a flexible adhesive, printing a circuit layer pattern on the surface of a glass substrate, and sintering the printed circuit layer pattern on the surface of the glass substrate.

Inventors

  • LI HUI
  • HONG XIYANG
  • SUN ANQI
  • ZHANG FANG
  • DONG CHUAN
  • ZHANG JI

Assignees

  • 京东方华灿华汇智造(广东)有限公司

Dates

Publication Date
20260505
Application Date
20251205

Claims (10)

  1. 1. The preparation method of the glass-based circuit board is characterized by comprising the following steps: manufacturing conductive paste, wherein the conductive paste comprises conductive powder, a low-temperature sintering aid and a flexible adhesive; Printing a circuit layer pattern on the surface of the glass substrate, wherein the material of the printed circuit layer pattern comprises the conductive paste; And sintering the printed circuit layer pattern on the surface of the glass substrate.
  2. 2. The method of manufacturing a conductive paste according to claim 1, comprising: Mixing copper powder and an organic phosphine compound to form the conductive powder; Adding the low temperature sintering aid of a bismuth zinc borate system to the conductive powder and incorporating one of alumina and zirconate and one of phosphate and BaTiO 3 additives; And adding the flexible adhesive formed by mixing polymethyl methacrylate, sodium hexametaphosphate and an ester solvent into the conductive powder to form the conductive paste.
  3. 3. The method according to claim 2, wherein the particle size of the copper powder is 0.8 to 1.2 μm, the copper powder accounts for 60 to 80wt% of the conductive powder, and the organic phosphine compound is an organic phosphine compound doped with zirconium and titanium or an organic phosphine compound coated with zirconium and titanium.
  4. 4. The method according to any one of claims 1 to 3, wherein the sintering of the printed wiring layer pattern on the surface of the glass substrate comprises preheating the glass substrate, heating the glass substrate, constant temperature of the glass substrate, and cooling the glass substrate.
  5. 5. The method of manufacturing according to claim 4, wherein the preheating of the glass substrate comprises: And controlling the temperature of the glass substrate to be 78-82 ℃ for 8-10 minutes, and enabling the maximum temperature difference of different points on the surface of the substrate to be less than 5 ℃.
  6. 6. The method according to claim 5, wherein the heating of the glass substrate comprises: And heating the glass substrate to 377-383 ℃ at a temperature of 4.7-5.3 ℃ per minute.
  7. 7. The method of manufacturing according to claim 6, wherein the constant temperature of the glass substrate comprises: And introducing nitrogen and oxygen, wherein the oxygen concentration is less than 50ppm, and maintaining the temperature at 379-381 ℃ for 19-21 min.
  8. 8. The method of manufacturing according to claim 7, wherein the cooling of the glass substrate comprises: cooling at a temperature of 2.7-3.3 ℃ per minute, and cooling the glass substrate to 247-253 ℃; Cooling the glass substrate to 97-103 ℃ at a temperature of 4.7-5.3 ℃ per minute; And naturally cooling the glass substrate to room temperature.
  9. 9. A light-emitting panel, characterized in that it comprises a glass-based circuit board (10) prepared by the method according to any one of claims 1 to 8, a plurality of light-emitting units (20) and a light-reflecting layer (30); the plurality of light emitting units (20) are located on the glass-based circuit board (10), and the light reflecting layer (30) is located on the glass-based circuit board (10) and surrounds the light emitting units (20).
  10. 10. The light emitting panel according to claim 9, characterized in that the light reflecting layer (30) comprises a PET substrate and a silver layer plated on a surface of the PET substrate.

Description

Preparation method of glass-based circuit board and light-emitting panel Technical Field The disclosure relates to the technical field of display, in particular to a preparation method of a glass-based circuit board and a light-emitting panel. Background A Mini light Emitting Diode (MINI LIGHT-emission Diode) light Emitting panel manufactured on a glass-based circuit board has the characteristics of excellent thermal stability, flatness, high optical design flexibility and the like, and is widely applied to scenes such as high-end display, vehicle-mounted and ultra-large screens. The related art provides a manufacturing method of a glass-based circuit board, which comprises the following steps of manufacturing a metal layer on a glass substrate, and performing graphical treatment on the metal layer to form the circuit board. The glass-based circuit board provided by the related technology has the advantages of complex production process, low production efficiency and high cost. Disclosure of Invention The embodiment of the disclosure provides a preparation method of a glass-based circuit board and a light-emitting panel, which can reduce process complexity, improve production efficiency and reduce production cost. The technical scheme is as follows: in one aspect, a method for preparing a glass-based circuit board is provided, the method comprising: manufacturing conductive paste, wherein the conductive paste comprises conductive powder, a low-temperature sintering aid and a flexible adhesive; Printing a circuit layer pattern on the surface of the glass substrate, wherein the material of the printed circuit layer pattern comprises the conductive paste; And sintering the printed circuit layer pattern on the surface of the glass substrate. Optionally, the preparing the conductive paste includes: Mixing copper powder and an organic phosphine compound to form the conductive powder; Adding the low temperature sintering aid of a bismuth zinc borate system to the conductive powder and incorporating one of alumina and zirconate and one of phosphate and BaTiO 3 additives; And adding the flexible adhesive formed by mixing polymethyl methacrylate, sodium hexametaphosphate and an ester solvent into the conductive powder to form the conductive paste. Optionally, the particle size of the copper powder is 0.8-1.2 μm, the proportion of the copper powder in the conductive powder is 60-80 wt%, and the organic phosphine compound is an organic phosphine compound doped with zirconium and titanium or an organic phosphine compound coated with zirconium and titanium. Optionally, the sintering of the printed circuit layer pattern on the surface of the glass substrate comprises preheating the glass substrate, heating the glass substrate, keeping the glass substrate constant temperature and cooling the glass substrate. Optionally, the preheating of the glass substrate includes: And controlling the temperature of the glass substrate to be 78-82 ℃ for 8-10 minutes, and enabling the maximum temperature difference of different points on the surface of the substrate to be less than 5 ℃. Optionally, the heating of the glass substrate includes: And heating the glass substrate to 377-383 ℃ at a temperature of 4.7-5.3 ℃ per minute. Optionally, the constant temperature of the glass substrate includes: And introducing nitrogen and oxygen, wherein the oxygen concentration is less than 50ppm, and maintaining the temperature at 379-381 ℃ for 19-21 min. Optionally, the cooling of the glass substrate includes: cooling at a temperature of 2.7-3.3 ℃ per minute, and cooling the glass substrate to 247-253 ℃; Cooling the glass substrate to 97-103 ℃ at a temperature of 4.7-5.3 ℃ per minute; And naturally cooling the glass substrate to room temperature. In another aspect, there is provided a light emitting panel including a glass-based circuit board prepared as above, a plurality of light emitting units, and a light reflecting layer; The light emitting units are located on the circuit board, and the light reflecting layer is located on the circuit board and surrounds the light emitting units. Optionally, the light reflecting layer comprises a PET substrate and a silver layer plated on the surface of the PET substrate. The technical scheme provided by the embodiment of the disclosure has the beneficial effects that: In the embodiment of the disclosure, conductive paste is manufactured by adopting conductive powder, a low-temperature sintering aid and a flexible adhesive, the conductive powder has good conductivity, a stable circuit can be formed, the low-temperature sintering aid can realize low-temperature sintering, the substrate breakage caused by stress is avoided, the flexible adhesive can ensure the fluidity of the conductive paste, the conductive paste is easy to print, a circuit layer pattern is printed on the surface of a glass substrate by adopting the conductive paste as a raw material, the step of patterning the metal layer after manufacturing t