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CN-121985491-A - Circuit board assembly and manufacturing method thereof

CN121985491ACN 121985491 ACN121985491 ACN 121985491ACN-121985491-A

Abstract

The invention provides a circuit board assembly manufacturing method, which comprises the steps of providing a circuit board to be bent, wherein the circuit board to be bent is divided into a first area, a second area and a third area, the second area is connected with the first area, an electronic element and a plurality of first connecting pads are arranged in the second area, the electronic element is arranged among the plurality of first connecting pads which are arranged at intervals, the third area is provided with a first conducting body and a plurality of second conducting bodies, and the first conducting body is arranged among the plurality of second conducting bodies which are arranged at intervals. The first region is bent, so that the second region corresponds to the third region, the first conductive bodies are electrically connected with the electronic element, and the second conductive bodies are connected with the first connecting pads one by one. And arranging a filling body between the second region and the third region to obtain the circuit board assembly. In addition, the invention also provides a circuit board assembly.

Inventors

  • WANG CHAO
  • CHEN BOYUAN

Assignees

  • 宏启胜精密电子(秦皇岛)有限公司
  • 鹏鼎控股(深圳)股份有限公司
  • 鹏鼎科技股份有限公司

Dates

Publication Date
20260505
Application Date
20241025

Claims (10)

  1. 1. A method of manufacturing a circuit board assembly, comprising the steps of: Providing a circuit board to be bent, wherein the circuit board to be bent is divided into a first area, a second area and a third area, the second area and the third area are connected with the first area, an electronic element and a plurality of first connecting pads are arranged in the second area, the electronic element is arranged among the plurality of first connecting pads which are arranged at intervals, a first conducting body and a plurality of second conducting bodies are arranged in the third area, and the first conducting body is arranged among the plurality of second conducting bodies which are arranged at intervals; bending the first region to enable the second region to correspond to the third region, wherein the first conductive bodies are electrically connected with the electronic element, and the second conductive bodies are connected with the first connecting pads one by one; And arranging a filling body between the second region and the third region to obtain the circuit board assembly.
  2. 2. The method of claim 1, wherein one end of the circuit board to be bent is provided with one of the first region, one of the second region and one of the third region, and the other end is provided with the other of the first region, the other of the second region and the other of the third region, the two third regions being disposed adjacently, and the step of bending the first region comprises: Bending the two first areas so that the two second areas correspond to the two third areas one by one, and forming a gap between the two second areas; The step of disposing a filler between the second region and the third region includes: and a filling body is arranged between the second region and the third region through the gap.
  3. 3. The method of claim 1, wherein the second region and the third region are disposed side by side prior to the step of bending the first region, and wherein the step of bending the first region comprises bending opposite ends of the first region 180 degrees toward each other.
  4. 4. The method of claim 1, wherein the step of bending the first region further comprises providing a first electrical connector to the plurality of first connection pads, providing a second electrical connector to the first conductive body, providing a second electrical connector to the plurality of second conductive bodies, wherein the sum of the heights of the second conductive bodies and the second electrical connector is greater than the sum of the heights of the first connection pads and the first electrical connector; the step of bending the first region further comprises connecting the first electrical connector and the second electrical connector, and connecting the second electrical connector and the electronic component.
  5. 5. The method for manufacturing the circuit board to be bent according to claim 1, wherein the method for manufacturing the circuit board to be bent comprises the following steps: providing a circuit substrate, wherein the circuit substrate comprises an insulating layer, a first circuit layer, a second circuit layer and an interlayer conducting body, the first circuit layer and the second circuit layer are arranged on two opposite sides of the insulating layer, the interlayer conducting body penetrates through the insulating layer and is communicated with the first circuit layer and the second circuit layer, and the first circuit comprises a plurality of first connecting pads; electroplating the first circuit to form a plurality of first through-conductors and a plurality of third through-conductors; and electroplating the third conducting body to form the second conducting body, and arranging an electronic element on the circuit substrate to obtain the circuit board to be bent.
  6. 6. The method of manufacturing a circuit board to be bent according to claim 5, further comprising the steps of: and arranging a covering layer on the second circuit layer.
  7. 7. A circuit board assembly, comprising: the bending circuit board is divided into a first area, a second area and a third area, wherein the second area is connected with the first area, an electronic element and a plurality of first connecting pads are arranged in the second area, the electronic element is arranged among the plurality of first connecting pads which are arranged at intervals, the third area is provided with a first conducting body and a plurality of second conducting bodies, the first conducting body is arranged among the plurality of second conducting bodies which are arranged at intervals, the first area is bent, the second area corresponds to the third area, the first conducting bodies are electrically connected with the electronic element, and the plurality of second conducting bodies are connected with the plurality of first connecting pads one by one; and the filling body is arranged between the second area and the third area.
  8. 8. The circuit board assembly of claim 7, further comprising an adhesive body coupled between a side of the electronic component facing away from the first conductive body and the third region.
  9. 9. The circuit board assembly of claim 7, wherein the first conductive body and the electronic component are connected by conductive paste or solder, and the second conductive body and the first connection pad are connected by conductive paste or solder.
  10. 10. The circuit board assembly of claim 7, further comprising a cover layer disposed on an outer surface of the folded circuit board.

Description

Circuit board assembly and manufacturing method thereof Technical Field The invention relates to the technical field of circuit boards, in particular to a manufacturing method of a circuit board assembly and the circuit board assembly manufactured by the method. Background Embedded component technology (Embedded Component Technology) is implemented by embedding surface mount components (SMDs) or discrete components with a larger partial volume directly into the interior of a multilayer Printed Circuit Board (PCB), which can be implemented by a layer-by-layer incremental method. However, this method is complicated in manufacturing process, and requires high-precision processing equipment and sophisticated process technologies for supporting. For example, during the manufacturing process, the etching, drilling, plating, etc. of each layer must be accurate, and once the deviation occurs, the whole circuit board is likely to be scrapped. Disclosure of Invention In view of the foregoing, there is a need for a method of manufacturing a circuit board assembly and a circuit board assembly manufactured by such a method that can solve the above-described problems. The manufacturing method of the circuit board assembly comprises the steps of providing a circuit board to be bent, wherein the circuit board to be bent is divided into a first area, a second area and a third area, the second area and the third area are connected with the first area, an electronic element and a plurality of first connecting pads are arranged in the second area, the electronic element is arranged among the plurality of first connecting pads which are arranged at intervals, a first conducting body and a plurality of second conducting bodies are arranged in the third area, and the first conducting body is arranged among the plurality of second conducting bodies which are arranged at intervals. And bending the first region so that the second region corresponds to the third region, wherein the first conductive bodies are electrically connected with the electronic element, and the second conductive bodies are connected with the first connecting pads one by one. And arranging a filling body between the second region and the third region to obtain the circuit board assembly. In some possible embodiments, one end of the circuit board to be bent is provided with one first area, one second area and one third area, the other end of the circuit board to be bent is provided with the other first area, the other second area and the other third area, the two third areas are adjacently arranged, and the step of bending the first area comprises bending the two first areas so that the two second areas correspond to the two third areas one by one, and a gap is formed between the two second areas. The step of disposing a filler between the second region and the third region includes disposing a filler between the second region and the third region through the gap. In some possible embodiments, the step of "bending the first region" is preceded by the step of "bending the second region and the third region side by side," and the step of "bending the first region" includes bending opposite ends of the first region 180 degrees toward each other. In some possible embodiments, the step of bending the first region may further comprise providing a first electrical connector to a plurality of the first connection pads. And arranging a second electric connector on the first conductive body. And arranging a third electric connector on the second conductive bodies, wherein the sum of the heights of the second conductive bodies and the second electric connector is larger than that of the first connecting pad and the first electric connector. The step of bending the first region further comprises connecting the first electrical connector and the second electrical connector, and connecting the second electrical connector and the electronic component. In some possible embodiments, the method for manufacturing the circuit board to be bent includes the steps of providing a circuit substrate, wherein the circuit substrate includes an insulating layer, a first circuit layer and a second circuit layer disposed on opposite sides of the insulating layer, and an interlayer conductor penetrating through the insulating layer and communicating the first circuit layer and the second circuit layer, and the first circuit includes a plurality of first connection pads. And electroplating the first circuit to form a plurality of first through-holes and a plurality of third through-holes. Electroplating the third conductive body to form the second conductive body. And arranging an electronic element on the circuit substrate to obtain the circuit board to be bent. In some possible embodiments, the method for manufacturing the circuit board to be bent further includes the step of disposing a cover layer on the second circuit layer. A circuit board assembly includes a folded circuit board and a fi