CN-121985492-A - Manufacturing method of packaging substrate

Abstract

The application discloses a manufacturing method of a packaging substrate, which comprises the steps of providing a multilayer circuit substrate, laminating an insulating layer on one side of the multilayer circuit substrate, forming a blind hole on one side of the insulating layer, which is away from the multilayer circuit substrate, and forming a first conductive structure in the blind hole, forming a metal column on the surface, which is away from the multilayer circuit substrate, of the first conductive structure, forming a first opening on the surface, which is away from the multilayer circuit substrate, of the insulating layer in a laser mode, so that part of the multilayer circuit substrate is exposed from the first opening, the metal column is positioned between two adjacent first openings, forming a mounting groove on the multilayer circuit substrate, wherein the mounting groove is communicated with the first opening, and mounting an electronic element in the mounting groove.

Inventors

• WU PEICHENG
• YANG YUE

Assignees

• 礼鼎半导体科技秦皇岛有限公司
• 礼鼎半导体科技(深圳)有限公司

Dates

Publication Date

20260505

Application Date

20241025

Claims (10)

1. 1. The manufacturing method of the packaging substrate is characterized by comprising the following steps of: Providing a multi-layer circuit substrate, and laminating an insulating layer on one side of the multi-layer circuit substrate; forming a blind hole on one side of the insulating layer, which is away from the multilayer circuit substrate, and forming a first conductive structure in the blind hole; forming a metal column on the surface of the first conductive structure, which is away from the multilayer circuit substrate; Forming a first opening on the surface of the insulating layer, which is away from the multilayer circuit substrate, in a laser manner, so that part of the multilayer circuit substrate is exposed from the first opening, and the metal column is positioned between two adjacent first openings; forming a mounting groove on the multilayer circuit substrate, wherein the mounting groove is communicated with the first opening; And mounting the electronic component in the mounting groove.
2. 2. The method of manufacturing a package substrate according to claim 1, wherein a spacing between two adjacent mounting grooves is less than 50 μm.
3. 3. The method of manufacturing a package substrate of claim 1, wherein the step of providing a multi-layered circuit substrate comprises: Providing an inner circuit substrate, wherein the inner circuit substrate comprises a first base material layer, a first circuit layer, a dielectric layer and a first metal layer which are sequentially laminated; forming a plurality of first through holes on the surface, facing away from the dielectric layer, of the first metal layer, wherein part of the first circuit layer is exposed at the bottom of the first through holes; forming a second conductive structure in the first through hole; And forming a second circuit layer on the surface of the dielectric layer, which is away from the first circuit layer, wherein the second circuit layer is electrically connected with the first circuit layer through the second conductive structure.
4. 4. The method of manufacturing a package substrate as claimed in claim 3, wherein the step of forming a second conductive structure in the first via hole and forming a second circuit layer on a surface of the dielectric layer facing away from the first circuit layer includes: Forming a patterned dry film on the surface of the first metal layer, which is away from the dielectric layer, electroplating the patterned dry film in the first through hole to form the second conductive structure, and forming a first copper plating layer on the surface of the first metal layer, which is away from the dielectric layer; and removing the graphical dry film, and then etching to remove part of the first metal layer, so that the rest first metal layer and the first copper plating layer form the second circuit layer together on the surface of the dielectric layer, which is away from the first circuit layer, and part of the dielectric layer is exposed on the second circuit layer.
5. 5. The method of manufacturing a package substrate according to claim 3, further comprising, after the step of forming a blind via in a side of the insulating layer facing away from the multilayer circuit substrate and forming a first conductive structure in the blind via: Forming a plurality of second through holes on the surface of the insulating layer, which is away from the multilayer circuit substrate, wherein part of the second circuit layer is exposed at the bottom of the second through holes; Forming a third conductive structure in the second through hole; And forming a third circuit layer on the surface of the insulating layer, which is away from the second circuit layer, wherein the third circuit layer is electrically connected with the second circuit layer through the third conductive structure.
6. 6. The method of manufacturing a package substrate according to claim 3, wherein the step of forming the mounting groove on the multilayer wiring substrate comprises: and etching to remove the second circuit layer exposed in the first opening to form the mounting groove, wherein the mounting groove exposes part of the second conductive structure.
7. 7. The method of claim 3, further comprising etching away the metal posts and the first conductive structures to expose the blind vias prior to the step of mounting electronic components in the mounting slots.
8. 8. The method of manufacturing a package substrate according to claim 3, wherein the step of mounting the electronic component in the mounting groove comprises: forming a conductive connecting piece at the bottom of the mounting groove, wherein the conductive connecting piece is electrically connected with the second conductive structure; The electronic component is mounted on the conductive connection member.
9. 9. The method of claim 8, wherein mounting an electronic component in the mounting groove further comprises forming a glue layer in the mounting groove and the blind hole, the glue layer encapsulating the electronic component and the conductive connection member.
10. 10. The method of claim 5, further comprising forming a protective layer on a surface of the insulating layer facing away from the dielectric layer, wherein the protective layer covers a surface of the insulating layer exposed from the third circuit layer.

Description

Manufacturing method of packaging substrate Technical Field The application relates to the field of electronic packaging, in particular to a manufacturing method of a packaging substrate. Background With the continued miniaturization and higher performance of electronic devices, the design and fabrication of package substrates is subject to increasing demands for more and more complex electronic components to be mounted in a limited space. To accommodate components of different heights and sizes, the need for embedded components has arisen to achieve a more compact layout. The conventional package substrate is generally provided with a plurality of grooves for accommodating electronic components to save space. But is limited by the capability of a laser machine, the minimum spacing distance between adjacent grooves can only be 50 mu m, which is not beneficial to realizing miniaturization. Disclosure of Invention In view of the above, the present application provides a method for manufacturing a package substrate that can solve the above-mentioned problems. A manufacturing method of a packaging substrate comprises the following steps: Providing a multi-layer circuit substrate, and laminating an insulating layer on one side of the multi-layer circuit substrate; forming a blind hole on one side of the insulating layer, which is away from the multilayer circuit substrate, and forming a first conductive structure in the blind hole; forming a metal column on the surface of the first conductive structure, which is away from the multilayer circuit substrate; Forming a first opening on the surface of the insulating layer, which is away from the multilayer circuit substrate, in a laser manner, so that part of the multilayer circuit substrate is exposed from the first opening, and the metal column is positioned between two adjacent first openings; forming a mounting groove on the multilayer circuit substrate, wherein the mounting groove is communicated with the first opening; And mounting the electronic component in the mounting groove. In some embodiments, two adjacent mounting grooves are less than 50 μm apart. In some embodiments, the step of providing a multilayer wiring substrate includes: Providing an inner circuit substrate, wherein the inner circuit substrate comprises a first base material layer, a first circuit layer, a dielectric layer and a first metal layer which are sequentially laminated; forming a plurality of first through holes on the surface, facing away from the dielectric layer, of the first metal layer, wherein part of the first circuit layer is exposed at the bottom of the first through holes; forming a second conductive structure in the first through hole; And forming a second circuit layer on the surface of the dielectric layer, which is away from the first circuit layer, wherein the second circuit layer is electrically connected with the first circuit layer through the second conductive structure. In some embodiments, the step of forming a second conductive structure in the first via hole and forming a second circuit layer on a surface of the dielectric layer facing away from the first circuit layer includes: Forming a patterned dry film on the surface of the first metal layer, which is away from the dielectric layer, electroplating the patterned dry film in the first through hole to form the second conductive structure, and forming a first copper plating layer on the surface of the first metal layer, which is away from the dielectric layer; And removing the graphical dry film, and then etching to remove part of the first metal layer so that the rest of the first metal layer and the first copper plating layer form the second circuit layer together on the surface of the dielectric layer, which is away from the first circuit layer, and part of the dielectric layer is exposed on the second circuit layer. In some embodiments, after the step of forming a blind via on a side of the insulating layer facing away from the multilayer circuit substrate and forming a first conductive structure in the blind via, the method further includes: Forming a plurality of second through holes on the surface of the insulating layer, which is away from the multilayer circuit substrate, wherein part of the second circuit layer is exposed at the bottom of the second through holes; Forming a third conductive structure in the second through hole; And forming a third circuit layer on the surface of the insulating layer, which is away from the second circuit layer, wherein the third circuit layer is electrically connected with the second circuit layer through the third conductive structure. In some embodiments, the step of forming a mounting groove on the multilayer wiring substrate includes: and etching to remove the second circuit layer exposed in the first opening to form the mounting groove, wherein the mounting groove exposes part of the second conductive structure. In some embodiments, prior to the step of "mounting