CN-121985493-A - Printed circuit board manufacturing method with heat conduction structure and printed circuit board

Abstract

The application discloses a printed circuit board manufacturing method with a heat conduction structure and a printed circuit board, comprising the following steps of forming a mounting hole on a first inner core board; the method comprises the steps of attaching a first carrier adhesive film to a first contact surface of a first inner core plate, burying components in mounting holes, attaching a second carrier adhesive film to a second contact surface of the first inner core plate, carrying out laser treatment on the first inner core plate to form a window opening part at a position, corresponding to a gap between the components and the mounting holes, of the second carrier adhesive film, filling high-heat-conductivity slurry into the gap between the components and the mounting holes through the window opening part, carrying out curing treatment on the first inner core plate, removing the first carrier adhesive film and the second carrier adhesive film to obtain a second inner core plate, and laminating the second inner core plate to obtain the first multilayer plate. The application aims to solve the problem of lower heat dissipation efficiency caused by single heat dissipation path of components in the prior art.

Inventors

• DONG XINYU
• KONG DECHI
• SHE YUNFENG

Assignees

• 昆山沪利微电有限公司

Dates

Publication Date

20260505

Application Date

20260209

Claims (9)

1. 1. The manufacturing method of the printed circuit board with the heat conduction structure is characterized by comprising the following steps of: The first inner core plate is provided with a mounting hole; Attaching a first carrier adhesive film to a first contact surface of the first inner core plate, and burying components into the mounting holes; attaching a second carrier adhesive film to a second contact surface of the first inner core plate so as to fix the component between the first carrier adhesive film and the second carrier adhesive film; performing laser treatment on the first inner core plate to form a window opening part at a position of the second carrier adhesive film corresponding to a gap between the component and the mounting hole; filling high-heat-conductivity slurry into a gap between the component and the mounting hole through the window part; curing the first inner core plate; Removing the first carrier adhesive film and the second carrier adhesive film to obtain a second inner core board; and pressing the second inner core plate to prepare the first multilayer plate.
2. 2. The method for manufacturing a printed circuit board with a heat conducting structure according to claim 1, wherein after the second inner core board is pressed to form a first multilayer board, the method further comprises: drilling the first multilayer board to form a heat conduction through hole penetrating through the first multilayer board; Filling the high-heat-conductivity slurry into the heat-conducting through holes; and curing the first multi-layer board to obtain a second multi-layer board.
3. 3. The method for manufacturing a printed circuit board with a heat conducting structure according to claim 2, wherein after the first multi-layer board is cured to obtain a second multi-layer board, the method further comprises: Etching the heat dissipation layer of the second multilayer board to form an insulating gap between the functional area and the heat dissipation area of the heat dissipation layer; Filling the high-heat-conductivity slurry into the insulation gap; And curing the second multilayer board to obtain a third multilayer board.
4. 4. The method for manufacturing a printed circuit board with a heat conducting structure according to claim 3, wherein after the second multi-layer board is cured to obtain a third multi-layer board, the method further comprises: Laminating and pressing the conductive layer, the barrier adhesive film, the third multilayer board, the high-heat-conductivity adhesive film and the conductive layer in sequence; and after lamination, removing the barrier adhesive film to obtain a fourth multilayer board.
5. 5. The method of manufacturing a printed wiring board having a heat conductive structure as claimed in claim 1, wherein, The high thermal conductivity slurry comprises phenolic resin and aluminum nitride powder.
6. 6. The method of manufacturing a printed wiring board having a heat conductive structure as claimed in claim 1, wherein, And filling the high-heat-conductivity slurry into a gap between the component and the mounting hole through the window opening part by adopting a screen printing process or an electrostatic spraying process.
7. 7. The method of manufacturing a printed wiring board having a heat conductive structure as claimed in claim 1, wherein, And curing the first inner core plate by adopting a UV curing or high-temperature curing process.
8. 8. The method of manufacturing a printed wiring board having a heat conductive structure as claimed in claim 2, wherein, And filling the high-heat-conductivity slurry into the heat-conducting through holes by adopting a vacuum resin hole plugging process.
9. 9. A printed wiring board, characterized in that the printed wiring board is manufactured according to the manufacturing method of any one of claims 1 to 8.

Description

Printed circuit board manufacturing method with heat conduction structure and printed circuit board Technical Field The present application relates to the field of printed circuit boards, and more particularly, to a method for manufacturing a printed circuit board with a heat conductive structure and a printed circuit board. Background With the development of miniaturization and integration of electronic devices, the requirements on the heat dissipation performance of printed circuit boards are increasing. In order to meet the requirements of miniaturization and integration, components are directly embedded into a printed circuit board in the prior art. However, because the components are buried inside the circuit board, the heat dissipation mainly depends on the heat dissipation copper foil on the back of the components to dissipate the heat, the heat dissipation contact area is limited, the path is single, and the overall heat dissipation efficiency is low. Disclosure of Invention The application aims to provide a printed circuit board manufacturing method with a heat conduction structure and the printed circuit board, so as to solve the problem of low heat dissipation efficiency caused by single heat dissipation path of components in the prior art. In order to solve the technical problems, the application is realized by adopting the following technical scheme: in a first aspect, the present application provides a method for manufacturing a printed circuit board with a heat conducting structure, including the following steps: The first inner core plate is provided with a mounting hole; attaching a first carrier adhesive film on a first contact surface of a first inner core plate, and burying the components into the mounting holes; attaching a second carrier adhesive film to the second contact surface of the first inner core plate so as to fix the component between the first carrier adhesive film and the second carrier adhesive film; performing laser treatment on the first inner core plate to form a windowing part at a position of the second carrier adhesive film corresponding to a gap between the component and the mounting hole; Filling the high-heat-conductivity slurry into a gap between the component and the mounting hole through the windowing part; curing the first inner core plate; removing the first carrier adhesive film and the second carrier adhesive film to obtain a second inner core board; And pressing the second inner core plate to prepare the first multilayer plate. Further, after the second inner core board is pressed to be made into the first multi-layer board, the method further comprises the following steps: drilling the first multilayer board to form a heat conduction through hole penetrating through the first multilayer board; filling the high-heat-conductivity slurry into the heat-conducting through holes; And curing the first multi-layer board to obtain a second multi-layer board. Further, after the first multilayer board is cured to obtain the second multilayer board, the method further comprises: Etching the heat dissipation layer of the second multilayer board to form an insulating gap between the functional area of the heat dissipation layer and the heat dissipation area; Filling high-heat-conductivity slurry into the insulation gap; and curing the second multilayer board to obtain a third multilayer board. Further, after the second multilayer board is cured to obtain a third multilayer board, the method further includes: Laminating and pressing the conductive layer, the barrier adhesive film, the third multilayer board, the high-heat-conductivity adhesive film and the conductive layer in sequence; And after lamination, removing the barrier adhesive film to obtain a fourth multilayer board. Further, the high thermal conductivity paste includes a phenolic resin and aluminum nitride powder. Further, a screen printing process or an electrostatic spraying process is adopted, and the high-heat-conductivity slurry is filled into a gap between the component and the mounting hole through the window opening part. Further, the first inner core plate is cured by adopting a UV curing or high-temperature curing process. Further, a vacuum resin plugging process is adopted to fill the high-heat-conductivity slurry into the heat-conductivity through holes. In a second aspect, the present application also provides a printed wiring board, which is manufactured according to any one of the above manufacturing methods. Compared with the prior art, the application has the beneficial effects that: 1. The gap between the component and the mounting hole is filled with the high-heat-conductivity slurry, so that the component can directly contact and dissipate heat in the printed circuit board, and the heat conduction efficiency is remarkably improved. Specifically, the first contact surface and the second contact surface are adhered with the carrier adhesive film on the first inner core plate to fix the comp