CN-121985505-A - Master control substrate heat dissipation system and temperature control method of master control substrate

CN121985505ACN 121985505 ACN121985505 ACN 121985505ACN-121985505-A

Abstract

The application belongs to the technical field of intelligent household appliances, and particularly relates to a main control substrate heat dissipation system and a main control substrate temperature control method. The system comprises a heat pump unit, a heat radiating unit and a main control substrate, wherein the heat radiating unit comprises a heat radiating pipeline, the main control substrate is arranged at a position close to the heat radiating pipeline, a first water inlet and a first water outlet of the heat radiating pipeline are respectively communicated with a waterway circulation loop of the heat pump unit, circulating water enters the heat radiating pipeline through the first water inlet and exchanges heat with heat generated by the main control substrate, and flows back to the waterway circulation loop from the first water outlet.

Inventors

NI SHUANGQUAN
Ju xiantao

Assignees

郑州海尔新能源科技有限公司
青岛海尔新能源电器有限公司
青岛经济技术开发区海尔热水器有限公司
海尔智家股份有限公司

Dates

Publication Date: 20260505
Application Date: 20260203

Claims (10)

1. The main control substrate heat dissipation system is characterized by comprising a heat pump unit, a heat dissipation unit and a main control substrate; the main control substrate is arranged at a position close to the heat dissipation pipeline; The heat pump unit comprises a waterway circulation loop, wherein a first water inlet and a first water outlet of the heat dissipation pipeline are respectively communicated with a main pipeline section of the waterway circulation loop; circulating water of the waterway circulation loop enters the heat dissipation pipeline through the first water inlet, exchanges heat with heat generated by the main control substrate, and flows back to the waterway circulation loop from the first water outlet.
2. The heat dissipation system of the main control substrate of claim 1, wherein the waterway circulation loop comprises a second water inlet, a first water pump, a first heat exchanger and a second water outlet, and the heat dissipation unit further comprises a water valve; the water path circulation loop is sequentially provided with the second water inlet, the first water pump, the first heat exchanger and the second water outlet along the water flow direction, wherein the second water outlet is communicated with the second water inlet through a backflow pipe section; The water valve is connected in series with the heat dissipation pipeline and is arranged on a pipe section close to the first water inlet; the first water pump is used for providing power for the flow of circulating water, and the water valve is used for adjusting the water flow of the heat dissipation pipeline.
3. The heat dissipating system of claim 2 wherein said heat dissipating unit further comprises a second water pump; the second water pump is connected in series with the heat dissipation pipeline and is arranged between the water valve and the first water inlet; The second water pump is used for improving the flow rate of circulating water in the heat dissipation pipeline.
4. The master substrate heat dissipation system of claim 2 or 3, wherein the first water outlet is disposed between a water outlet side of the first heat exchanger and the second water outlet; Circulating water of the waterway circulation loop enters the heat dissipation pipeline through the first water inlet, exchanges heat with heat generated by the main control substrate after flowing through the water valve, and flows back to the second water outlet of the waterway circulation loop from the first water outlet of the heat dissipation pipeline.
5. The master substrate heat dissipation system of claim 2 or 3, wherein the first water outlet is disposed in a main pipe section between the first water pump and the second water inlet; Circulating water of the waterway circulation loop enters the heat dissipation pipeline through the first water inlet, exchanges heat with heat generated by the main control substrate after flowing through the water valve, and flows back to the second water inlet of the waterway circulation loop from the first water outlet of the heat dissipation pipeline.
6. The master substrate heat dissipation system of claim 1, wherein the heat dissipation unit further comprises a heat conduction assembly; the heat conduction component is arranged between the heat dissipation pipeline and the main control substrate; The heat conduction component is used for enhancing heat exchange efficiency between the heat dissipation pipeline and the main control substrate.
7. The heat dissipating system of the master substrate of claim 2 or 3 wherein said heat dissipating unit further comprises a first temperature sensor, a second temperature sensor, and a third temperature sensor; The first temperature sensor is attached to the surface of the main control substrate, the second temperature sensor is attached to the outer wall of the main pipeline section between the first water pump and the first water inlet, and the third temperature sensor is arranged in an external environment area of the main control substrate heat dissipation system; the first temperature sensor, the second temperature sensor and the third temperature sensor are respectively in communication connection with the main control substrate; The first temperature sensor is used for collecting the working temperature of the main control substrate, the second temperature sensor is used for collecting the water inlet temperature of the heat dissipation pipeline, and the third temperature sensor is used for collecting the environment temperature of an external environment area where the heat dissipation system of the main control substrate is located.
8. A method for controlling temperature of a master substrate, which is applied to the master substrate heat dissipation system according to claims 1 to 7, the method comprising: acquiring the working temperature of the main control substrate through a first temperature sensor; Controlling a water valve to be adjusted to an initial opening degree under the condition that the working temperature exceeds a preset temperature threshold value and a first overtemperature duration exceeds a first preset duration, wherein the first overtemperature duration is used for indicating the continuous duration time of the working temperature of the main control substrate exceeding the preset temperature threshold value; Re-acquiring the working temperature, and acquiring the ambient temperature of the main control substrate through a third temperature sensor; and determining a control strategy of the water valve based on the new working temperature, a preset temperature threshold and the environmental temperature, and adjusting the opening of the water valve according to the control strategy.
9. The method of claim 8, wherein the determining a control strategy for the water valve based on the new operating temperature, a preset temperature threshold, and an ambient temperature comprises: determining the control strategy as a first control strategy when the new working temperature is smaller than a preset temperature threshold value and larger than the environment temperature, wherein the first control strategy is used for indicating to maintain the opening of the water valve; determining the control strategy as a second control strategy under the condition that the new working temperature is not less than a preset temperature threshold value and is greater than the environment temperature, wherein the second control strategy is used for indicating to increase the opening of the water valve; And under the condition that the new working temperature is smaller than a preset temperature threshold value and not larger than the environment temperature, determining a second overtemperature duration of the new working temperature, and determining a control strategy of the water valve based on the second overtemperature duration, wherein the second overtemperature duration is used for representing the continuous duration time of the new working temperature which is not smaller than the preset temperature threshold value and not larger than the environment temperature.
10. The method of claim 9, wherein the determining a control strategy for the water valve based on the second over-temperature duration comprises: determining the control strategy as a third control strategy under the condition that the second overtemperature duration does not exceed a second preset duration, wherein the third control strategy is used for indicating to reduce the opening of the water valve according to a preset step length; And under the condition that the second overtemperature duration exceeds a second preset duration, determining the control strategy as a fourth control strategy, wherein the fourth control strategy is used for indicating and controlling the main control substrate to stop running.

Description

Master control substrate heat dissipation system and temperature control method of master control substrate Technical Field The application belongs to the technical field of intelligent household appliances, and particularly relates to a main control substrate heat dissipation system and a main control substrate temperature control method. Background The heat pump system is used as an efficient energy conversion and regulation device, and the stable operation of the heat pump system is highly dependent on the accurate cooperation of the core control unit. In the prior art, a main control substrate is configured in a heat pump system, and the main control substrate carries various electrical elements to realize accurate control of system operation. However, the electrical components of the main control substrate generate heat in the working process, the temperature of the components is increased due to heat accumulation, so that the working efficiency of the components is reduced, the service life of the components is shortened, and the main control substrate is easily damaged in severe cases. Disclosure of Invention The application provides a main control substrate heat dissipation system and a main control substrate temperature control method, which are used for solving the technical problems that the temperature of an element is increased due to heat generation caused by the operation of an electric element of a main control substrate, so that the working efficiency of the element is reduced, the service life of the element is shortened, and the main control substrate is easily damaged when serious. In a first aspect, the application provides a master substrate heat dissipation system, comprising a heat pump unit, a heat dissipation unit and a master substrate; The main control substrate is arranged at a position close to the heat dissipation pipeline; The heat pump unit comprises a waterway circulation loop, wherein a first water inlet and a first water outlet of the heat dissipation pipeline are respectively communicated with a main pipeline section of the waterway circulation loop; Circulating water of the waterway circulation loop enters the heat dissipation pipeline through the first water inlet, exchanges heat with heat generated by the main control substrate, and flows back to the waterway circulation loop from the first water outlet. In one possible implementation, the waterway circulation loop comprises a second water inlet, a first water pump, a first heat exchanger and a second water outlet, wherein the radiating unit further comprises a water valve; The water path circulation loop is sequentially provided with a second water inlet, a first water pump, a first heat exchanger and a second water outlet along the water flow direction, wherein the second water outlet is communicated with the second water inlet through a backflow pipe section; the water valve is connected in series with the heat dissipation pipeline and is arranged on the pipe section close to the first water inlet; the first water pump is used for providing power for the flow of circulating water, and the water valve is used for adjusting the water flow of the heat dissipation pipeline. In one possible embodiment, the heat dissipating unit further comprises a second water pump; The second water pump is connected in series with the heat dissipation pipeline and is arranged between the water valve and the first water inlet; The second water pump is used for improving the flow rate of circulating water in the heat dissipation pipeline. In one possible embodiment, the first water outlet is arranged between the water outlet side of the first heat exchanger and the second water outlet; circulating water of the waterway circulation loop enters the heat dissipation pipeline through the first water inlet, exchanges heat with heat generated by the main control substrate after flowing through the water valve, and flows back to the second water outlet of the waterway circulation loop from the first water outlet of the heat dissipation pipeline. In one possible embodiment, the first water outlet is provided in the main pipe section between the first water pump and the second water inlet; Circulating water of the waterway circulation loop enters the heat dissipation pipeline through the first water inlet, exchanges heat with heat generated by the main control substrate after flowing through the water valve, and flows back to the second water inlet of the waterway circulation loop from the first water outlet of the heat dissipation pipeline. In one possible embodiment, the heat dissipating unit further comprises a heat conducting component; The heat conduction component is arranged between the heat dissipation pipeline and the main control substrate; The heat conduction component is used for enhancing heat exchange efficiency between the heat dissipation pipeline and the main control substrate. In one possible embodiment, the heat dissipating uni