CN-121985508-A - Passive heat dissipation cloud node and traveling case comprising same

CN121985508ACN 121985508 ACN121985508 ACN 121985508ACN-121985508-A

Abstract

The invention relates to the technical field of manufacture of hotel clothes cases, in particular to a passive heat dissipation cloud node and a hotel clothes case comprising the same. For the passive heat dissipation cloud node, a cloud node main body comprises a PCBA substrate and a chip integrated on the PCBA substrate, a core heat conduction module comprises a heat dissipation base, a heat pipe assembly and a high heat conduction interface material, the high heat conduction interface material is filled between the chip and the heat dissipation base, the heat pipe assembly is in contact with the heat dissipation base, an evaporation section of the heat pipe assembly corresponds to the chip, a condensation section of the heat pipe assembly exceeds the upper end and the lower end of the cloud node main body, an upper epitaxial heat dissipation unit is fixed with the upper condensation section of the heat pipe assembly and is exposed to the outside, and a lower epitaxial heat dissipation unit is in thermal conduction with the heat dissipation base and is exposed to the outside. The heat-conducting efficiency of the passive heat-radiating cloud node is greatly improved through the cooperation of the low-resistance heat-conducting path and the heat pipe assembly, and the dual-path heat-radiating expansion module radiates heat synchronously from the upper independent path and the lower independent path through the upper epitaxial heat-radiating unit and the lower epitaxial heat-radiating unit, so that the heat-exchanging efficiency is effectively improved.

Inventors

LI LIJIAN
SUN JUN
LI HUI
WU QI
WANG YANFANG

Assignees

苏州华启智能科技股份有限公司

Dates

Publication Date: 20260505
Application Date: 20260205

Claims (8)

1. The passive heat dissipation cloud node is characterized by comprising a cloud node main body, a core heat conduction module and a dual-path heat dissipation expansion module; the cloud node main body comprises a PCBA substrate and a chip integrated on the PCBA substrate; The core heat conduction module comprises a heat dissipation base, a heat pipe assembly and a high heat conduction interface material, wherein the high heat conduction interface material is filled between the chip and the heat dissipation base to form a low-resistance heat conduction path; The dual-path heat dissipation expansion module comprises an upper-level epitaxial heat dissipation unit and a lower-level epitaxial heat dissipation unit, wherein the upper-level epitaxial heat dissipation unit is fixedly connected with a condensation section of the heat pipe assembly, which is beyond the upper end of the cloud node main body, and is exposed out of the cloud node main body, and the lower-level epitaxial heat dissipation unit is thermally conducted with the heat dissipation base and is exposed out of the cloud node main body.
2. The passive heat dissipation cloud node of claim 1, wherein the heat pipe assembly comprises an upper heat pipe and a lower heat pipe, an evaporation section of the upper heat pipe and an evaporation section of the lower heat pipe are arranged corresponding to the chip, a condensation section of the upper heat pipe extends to the upper end of the cloud node main body and is in thermal conduction with the upper epitaxial heat dissipation unit, and a condensation section of the lower heat pipe extends to the lower end of the cloud node main body and is in thermal conduction with the lower epitaxial heat dissipation unit.
3. The passive heat dissipation cloud node of claim 2, wherein the upper epitaxial heat dissipation unit is an aluminum alloy heat dissipation block with fins, and is fixedly connected with the condensation section of the upper heat pipe through a heat conduction adhesive with bonding and heat conduction functions.
4. The passive heat dissipation cloud node of claim 2, wherein the lower-level epitaxial heat dissipation unit is an integrally formed heat dissipation module, heat conduction is achieved between the lower-level epitaxial heat dissipation unit and the heat dissipation base through high-heat-conductivity silicone grease only used for heat conduction, and the lower-level epitaxial heat dissipation unit is fixedly connected with a condensation section of the lower-level heat pipe through heat-conducting glue with bonding and heat conducting functions.
5. The passive heat sink cloud node of claim 1, wherein the thermal conductivity of the high thermal conductivity interface material is not less than 3W/(m-K) and the thickness is controlled to be 0.1-0.3 mm.
6. The passive heat dissipation cloud node of claim 1, wherein the heat dissipation base comprises a base body and heat dissipation fins, the base body is in a flat plate shape, the bottom surface of the base body is attached to the high-heat-conductivity interface material, the top surface of the base body is a forming carrier of the heat dissipation fins, and the array direction of the heat dissipation fins is consistent with the extension direction of a condensation section of the heat pipe assembly.
7. The utility model provides a traveling case, its characterized in that includes main frame, upper cover plate, left shrouding, right shrouding, bottom plate and the passive heat dissipation cloud node of any one of claims 1-6, the main frame is rectangular frame construction, upper cover plate, left shrouding, right shrouding, the bottom plate all can dismantle with the main frame and be connected, enclose and form the case accommodation chamber, the upper cover plate shaping has the technology hole, passive heat dissipation cloud node installs in the case accommodation chamber, and the upper position is epitaxial the radiating unit passes the technology hole and is exposed to the outside of traveling case.
8. The hotel case of claim 7, wherein the base plate has a heat dissipation function and contacts the lower epitaxial heat dissipation unit to achieve thermal conduction.

Description

Passive heat dissipation cloud node and traveling case comprising same Technical Field The invention relates to the technical field of manufacture of hotel clothes cases, in particular to a passive heat dissipation cloud node and a hotel clothes case comprising the same. Background The travel service system control chassis is a special hardware platform customized and developed for a passenger service system in the rail transit industry, and the core functions are functional software modules related to passenger services such as integration, bearing and running ticket information display, train arrival broadcasting and the like. Along with the continuous evolution of the intelligent technology in the field of rail transit, the hotel system control chassis gradually introduces a cloud node technology to realize performance upgrading, namely, an elastically schedulable resource pool is formed by carrying out virtualized processing on computing, storing and service functions, and an independent chassis which is traditionally scattered at each station is converted into a cloud node which is centrally managed and distributed as required. However, the application of the cloud node technology also causes the bottom hardware to face the difficult problem of heat dissipation, so that the power consumption of a core chip is greatly improved to meet the high concurrent processing requirement of the cloud node, the heat quantity (heat flux density) required to be dissipated in a unit area is rapidly increased, and furthermore, the track traffic site has clear fan-free operation requirements on hardware equipment, namely the problems of equipment shutdown caused by fan mechanical faults, interference of operation noise with station environments, heat dissipation efficiency reduction caused by fan dust accumulation and the like are required to be avoided. The traditional passive heat dissipation scheme (such as a single aluminum heat dissipation block and a fin structure) has a physical upper limit on heat dissipation capacity, so that a large amount of heat generated by a cloud node core chip cannot be effectively dissipated under the existing constraint condition, and the chip is in a high-temperature running state for a long time, is easy to cause system blocking, functional failure and even hardware damage, and seriously threatens the stable running of a traveling system. Thus, a technician is required to solve the above problems. Disclosure of Invention The invention aims to provide a passive heat dissipation cloud node, and aims to solve the problems that after a cloud node technology is introduced into a control cabinet of a traveling service system in the existing design, the heat flux density is increased suddenly due to the improvement of power consumption of a core chip, and the heat dissipation capacity reaches the physical upper limit and the heat cannot be effectively dissipated due to the fact that the track traffic is free of hard constraint of fan operation. The invention relates to a passive heat dissipation cloud node, which comprises a cloud node main body, a core heat conduction module and a dual-path heat dissipation expansion module, wherein the core heat conduction module is connected with the cloud node main body; The cloud node main body comprises a PCBA substrate and a chip integrated on the PCBA substrate; The heat pipe assembly is contacted with the heat dissipation base, an evaporation section of the heat pipe assembly corresponds to the chip and is arranged, and a condensation section extends along the length direction of the cloud node main body and exceeds the upper end and the lower end of the cloud node main body by a set distance; The dual-path heat dissipation expansion module comprises an upper-position epitaxial heat dissipation unit and a lower-position epitaxial heat dissipation unit, wherein the upper-position epitaxial heat dissipation unit is fixedly connected with a condensation section of the heat pipe assembly, which is beyond the upper end of the cloud node main body, and is exposed outside the cloud node main body, and the lower-position epitaxial heat dissipation unit is in thermal conduction with the heat dissipation base and is exposed outside the cloud node main body. As a further improvement of the technical scheme disclosed by the invention, the heat pipe assembly comprises an upper heat pipe and a lower heat pipe, wherein the evaporation section of the upper heat pipe and the evaporation section of the lower heat pipe are arranged corresponding to chips, the condensation section of the upper heat pipe extends to the upper end of the cloud node main body and is in thermal conduction with the upper epitaxial heat dissipation unit, and the condensation section of the lower heat pipe extends to the lower end of the cloud node main body and is in thermal conduction with the lower epitaxial heat dissipation unit. As a further improvement of the technical scheme disclosed