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CN-121985514-A - Heat conduction gasket and preparation method thereof

CN121985514ACN 121985514 ACN121985514 ACN 121985514ACN-121985514-A

Abstract

The application relates to a heat conduction gasket and a preparation method thereof, and belongs to the technical field of materials. A heat-conducting gasket comprises a heat-conducting substrate, wherein the heat-conducting substrate comprises a plurality of layers of graphene films which are stacked or compounded, the high heat-conducting direction of the heat-conducting substrate is configured to be oriented along the thickness direction, the heat-conducting substrate is provided with a first surface and a second surface which are opposite, the first surface and the second surface are respectively provided with a first coating, the side face of the heat-conducting substrate is provided with a second coating, the thickness of the first coating is not more than 10 nm, the thickness of the second coating is not less than 10 nm, and the thickness of the second coating is larger than that of the first coating. The problem of structural powder falling of the side edges of the longitudinally oriented heat conducting gaskets can be solved, and the increase of thermal resistance can be controlled.

Inventors

  • CAO YONG
  • YANG SHANGQIANG
  • FANG XIAO
  • SUN AIXIANG
  • DONG JINLAN

Assignees

  • 深圳市鸿富诚新材料股份有限公司

Dates

Publication Date
20260505
Application Date
20260228

Claims (10)

  1. 1. A thermally conductive gasket comprising a thermally conductive substrate comprising a stack or composite of multiple graphene films, the thermally conductive substrate having a high thermal conductivity direction configured to be oriented in a thickness direction; the heat conducting substrate is provided with a first surface and a second surface which are opposite to each other, the first surface and the second surface are respectively provided with a first plating layer, and the side surface of the heat conducting substrate is provided with a second plating layer; The thickness of the first coating is not more than 10nm, the thickness of the second coating is not less than 10nm, and the thickness of the second coating is more than the thickness of the first coating.
  2. 2. The heat conducting gasket of claim 1, wherein the first coating has a thickness of 0.5-2 nm and the second coating has a thickness of 10-20 nm.
  3. 3. The heat conducting gasket of claim 2, wherein the first coating has a thickness of 1-1.5 nm and the second coating has a thickness of 15-20 nm.
  4. 4. A thermal pad according to any one of claims 1-3, wherein the materials of the first and second plating layers comprise parylene.
  5. 5. A thermally conductive gasket according to any one of claims 1 to 3, wherein the graphene volume content in the thermally conductive gasket is not less than 90%.
  6. 6. A thermally conductive gasket according to any of claims 1-3, characterized in that the thickness of the thermally conductive gasket is 0.1-2 mm, preferably 0.15-0.2 mm.
  7. 7. The thermally conductive gasket of claim 6 wherein said thermally conductive gasket has a thermal resistance of no more than 0.06 °c cm2/W under 40 psi compressive stress.
  8. 8. The thermally conductive gasket of claim 7 wherein said thermally conductive gasket has a thermal resistance of no more than 0.03 ℃ cm2/W under 40 psi compressive stress.
  9. 9. A method for preparing a thermally conductive gasket as claimed in any one of claims 1 to 8, comprising: Depositing the first plating layer on the first surface and the second surface of the heat conducting substrate, wherein the thickness of the first plating layer is not more than 10 nm; Masking the first surface and the second surface of the heat conducting substrate coated with the first coating by using a mask, and continuously depositing the side surface of the heat conducting substrate to form the second coating on the side surface of the heat conducting substrate, wherein the thickness of the second coating is not less than 10 nm; and removing the mask.
  10. 10. The method according to claim 9, wherein the surface temperature of the heat conducting substrate is not more than 60 ℃, and the deposition rate is 0.1-0.2 nm/s.

Description

Heat conduction gasket and preparation method thereof Technical Field The application relates to the technical field of materials, in particular to a heat conduction gasket and a preparation method thereof. Background In recent years, a longitudinally oriented heat conductive gasket manufactured by vertically cutting after lamination of a plurality of layers of high heat conductive graphene films has received attention because of its excellent heat conductive property in the thickness direction. The material is formed by precisely cutting hundreds of layers of graphene films after being bonded by organic silicon resin, thermally pressed and solidified into blocks, wherein the volume fraction of the graphene can reach 85% -92%, a continuous longitudinal heat conduction path is formed, and the thermal resistance can be as low as 0.019 ℃ cm < 2 >/W. However, loose graphene edges can appear on two heat conducting surfaces of the cut gasket, slight dust falling may exist in the taking process, and two opposite sides of the cut gasket are exposed graphene lamellar sections, so that micron-sized sheet warpage and loose dust exist in the taking process, and the structural dust falling problem easily occurs under typical electronic assembly pressure (50 psi). During assembly or service of the electronic module, these conductive debris may migrate to adjacent circuitry, causing short circuits or electrochemical corrosion, severely threatening system reliability. For standard rectangular gaskets, the industry attempts to adopt PI film edge wrapping or epoxy edge sealing at present, but the special-shaped gaskets (such as L-shaped gaskets, holes, micro arrays and the like) cannot realize uniform and reliable edge wrapping due to complex geometry, (2) the ultrathin gaskets (with the thickness of <2 mm) are easy to deform, tear or introduce additional assembly stress in the edge wrapping process, and (3) the edge wrapping materials are low heat conducting media, so that the overall thermal resistance of the gaskets can be increased, and precious space is occupied. Disclosure of Invention In order to overcome the defects in the prior art, the embodiment of the application aims at providing a heat-conducting gasket and a preparation method thereof. The problem of structural powder falling of the side edges of the longitudinally oriented heat conducting gaskets can be solved, and the increase of thermal resistance can be controlled. In a first aspect, an embodiment of the present application provides a heat-conducting gasket, including a heat-conducting substrate, where the heat-conducting substrate includes a stacked or compounded multi-layer graphene film, and a high heat-conducting direction of the heat-conducting substrate is configured to be oriented in a thickness direction, the heat-conducting substrate has a first surface and a second surface opposite to each other, the first surface and the second surface are respectively provided with a first plating layer, a second plating layer is provided on a side surface of the heat-conducting substrate, a thickness of the first plating layer is not greater than 10 nm, a thickness of the second plating layer is not less than 10 nm, and a thickness of the second plating layer is greater than a thickness of the first plating layer. According to the application, the partition plating is carried out on the surface of the heat conducting substrate, the first plating layer is arranged on the first surface and the second surface of the heat conducting substrate, the second plating layer is arranged on the side surface, the thickness of the first plating layer is not more than 10 nm, the thickness of the second plating layer is not less than 10 nm, the thickness of the second plating layer is greater than that of the first plating layer, the second plating layer arranged on the side surface of the heat conducting substrate is thicker, the problem that structural powder dropping easily occurs on the side edge of the heat conducting gasket is solved, meanwhile, the first plating layers arranged on the first surface and the second surface of the heat conducting substrate are not too thick, so that the thermal resistance of the heat conducting gasket is controlled not to be greatly increased on the basis of possibly slightly dropping in the process of improving the taking, the problem that the side edge of the heat conducting gasket in the longitudinal orientation is structurally dropped is solved, and the increase of the thermal resistance is also controlled. In some embodiments of the present application, the thickness of the first plating layer is 0.5 to 2 nm, and the thickness of the second plating layer is 10 to 20 nm. According to the application, the specific proper thickness of the first coating and the second coating is set, the thickness of the first coating is used for keeping the thermal resistance of the heat conduction gasket not to be greatly increased on the basis of impr