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CN-121985527-A - Electronic component manufacturing equipment

CN121985527ACN 121985527 ACN121985527 ACN 121985527ACN-121985527-A

Abstract

The present invention relates to the field of electronic component manufacturing technology, and in particular, to an electronic component manufacturing apparatus. The manufacturing device comprises a manufacturing platform, wherein a processing groove is formed in the top of the manufacturing platform, a circulating disc is arranged on a bottom plate of the processing groove, and a plurality of groups of substrate limiting mechanisms are distributed on the top of the circulating disc in an annular array. According to the invention, when the lifting rings of the plurality of groups are controlled to sequentially descend from inside to outside to the position below the second air guide hole, the adsorption area of the substrate limiting mechanism on the substrate can be adjusted, and when the lifting rings of the plurality of groups are controlled to sequentially descend from outside to inside, the edge bending position of the substrate can be in a suspended state, so that the corresponding folding pressure rod can drive the hot pressing plate to reversely and excessively correct the bending position to offset the internal stress of the bending position, the adsorption adaptability of manufacturing equipment to substrates with different sizes is improved, the problem that the bending stress cannot be eliminated by flattening the existing equipment is avoided, and the working effect of the manufacturing equipment is improved.

Inventors

  • LIU RONGWEI
  • GONG PENGFEI

Assignees

  • 江西微视光学科技有限公司

Dates

Publication Date
20260505
Application Date
20260224

Claims (10)

  1. 1. The electronic component manufacturing equipment comprises a manufacturing platform and is characterized in that a processing groove is formed in the top of the manufacturing platform, a circulating disc is arranged on a bottom plate of the processing groove, a plurality of groups of substrate limiting mechanisms are distributed on the top of the circulating disc in an annular array mode, and a substrate taking mechanism, a chip mounting mechanism and a hot-press bonding mechanism are sequentially arranged on the side wall of the top of the manufacturing platform along the rotating direction of the circulating disc; the substrate limiting mechanism comprises a supporting seat, wherein the top of the supporting seat is provided with a first adjusting cavity, and the center of the inner wall of the bottom of the first adjusting cavity is provided with a supporting ring; The top of the supporting ring is provided with a rigid bottom plate, a flexible bottom plate is connected between the outer wall of the rigid bottom plate and the inner wall of the first adjusting cavity, and a plurality of groups of first air guide holes are distributed in an annular array; the outer wall of the supporting ring is sequentially sleeved with a plurality of groups of lifting rings capable of moving vertically, the outer side of the supporting seat is provided with a plurality of groups of folding pressure rods, and one end, far away from the guide ring, of each group of folding pressure rods is provided with a hot pressing plate.
  2. 2. The electronic component manufacturing equipment according to claim 1, wherein a manipulator structure, a first lifting seat and a second lifting seat are sequentially arranged on the top side wall of the manufacturing platform along the rotation direction of the circulating disc, the output end of the manipulator structure is in transmission connection with the substrate taking mechanism, the output end of the first lifting seat is in transmission connection with the chip mounting mechanism, and the output end of the second lifting seat is in transmission connection with the hot-press bonding mechanism.
  3. 3. The electronic component manufacturing equipment according to claim 1 is characterized in that the inner edge and the outer edge of the top of each lifting ring are round corners, a plurality of first adsorption holes are uniformly distributed on the top of the rigid base plate, a plurality of second adsorption holes are uniformly distributed on the top of the flexible base plate, and the top of each lifting ring is movably abutted to the bottom of the flexible base plate.
  4. 4. The electronic component manufacturing equipment according to claim 3, wherein each group of the first air guide holes is communicated with the corresponding group of the first adsorption holes, a guide ring is arranged at the bottom of the supporting seat, a guide groove I is formed in the bottom of the guide ring, the top view section of the guide groove I is circular, a plurality of groups of driving blocks are connected inside the guide groove I, and a folding pressure rod is arranged at one end, far away from the central axis of the guide ring, of each group of driving blocks.
  5. 5. The electronic component manufacturing equipment according to claim 1, wherein the substrate taking mechanism comprises a clamp, a plurality of groups of clamping plates are connected to the output end of the bottom of the clamp in a transmission mode, an electric push rod is arranged at the center of the bottom of the clamp, and a substrate cleaning assembly is connected to the output end of the electric push rod in a transmission mode.
  6. 6. The electronic component manufacturing equipment according to claim 5, wherein the substrate cleaning assembly comprises a driving motor, a double-end motor is connected to the output end of the driving motor in a transmission mode, two groups of guide rods are symmetrically arranged on two side walls of the double-end motor, each group of guide rods is U-shaped in side view cross section, two groups of cleaning brushes are symmetrically arranged at two side edges of the bottom of each group of guide rods, and one group of extension rods movably penetrate through one end, far away from the double-end motor, of each group of guide rods.
  7. 7. The electronic component manufacturing equipment according to claim 6 is characterized in that a group of cleaning brushes II are arranged at the bottoms of the extension rods, two groups of screw rods are symmetrically connected to the output end of the double-end motor in a transmission mode, the two groups of screw rods are in the same straight line with the central axes of the two groups of extension rods, each group of screw rods is in threaded connection with a corresponding group of extension rods, and a group of laser profile sensors are arranged at the bottoms of one ends, far away from the double-end motor, of each group of extension rods.
  8. 8. The electronic component manufacturing equipment according to claim 1 is characterized in that the chip mounting mechanism comprises a mounting frame, a plurality of groups of adsorption plates are arranged in the mounting frame, the adsorption plates are connected end to end in sequence, a group of vacuum suction heads are arranged on the outer wall of each group of adsorption plates, sealing structures are arranged at the connection positions of the adsorption plates and the contact positions of the adsorption plates and the inner wall of the mounting frame, a vacuum pump is arranged on one side wall of the mounting frame and communicated with the inside of the adsorption plates, a chip storage box is arranged on the inner wall of the top of the mounting frame, a chip blanking device is arranged at the bottom of the chip storage box, and each group of vacuum suction heads movably penetrates through the chip blanking device.
  9. 9. The electronic component manufacturing equipment according to claim 1 is characterized in that the hot-press bonding mechanism comprises a hot-press seat, a plurality of groups of guide grooves II are distributed on the bottom of the hot-press seat in an annular array, a plurality of groups of hot-press bonding heads are arranged in each group of guide grooves II, a plurality of groups of heat-insulation folding plates are distributed on the bottom of the hot-press seat in an annular array, two ends of each group of heat-insulation folding plates are connected to the outer walls of two corresponding groups of hot-press bonding heads on the outermost side in a armful mode, an adjusting cavity II is arranged in the hot-press seat and communicated with the plurality of groups of guide grooves II, and a plurality of groups of compensation blocks are arranged on the inner wall of the bottom of the adjusting cavity II.
  10. 10. The electronic component manufacturing equipment according to claim 9, wherein each group of compensation blocks is in sliding connection with a corresponding group of second guide grooves, the bottoms of the compensation blocks are in transmission connection with a corresponding group of hot-press bonding heads, a group of compensation grooves are formed in the top of each group of compensation blocks, each group of compensation grooves is parallel to a corresponding group of guide grooves, a group of transmission rods are arranged in each group of compensation grooves, an adjusting disc is arranged in the second adjusting cavity, a third guide groove is formed in the bottom of the adjusting disc, the third guide groove is in a plane spiral shape, and the top of each group of transmission rods extends into the third guide groove.

Description

Electronic component manufacturing equipment Technical Field The invention belongs to the technical field of electronic component manufacturing, and particularly relates to electronic component manufacturing equipment. Background In the manufacturing process of electronic components, packaging is a bridge connecting a micro chip and a macro world, and is a key link for determining the performance, reliability and cost of the components and final electronic products, and at present, technologies such as wire bonding, thermal compression bonding and the like are generally adopted. Through searching, in the prior art, chinese patent bulletin No. CN118919460B, bulletin day 2024-12-20 discloses a multi-chip positioning and packaging device of an integrated circuit and a packaging method thereof. The multi-chip stacking device comprises a processing platform, wherein a transfer mechanism is arranged at the top of the processing platform, the output end of the transfer mechanism is in transmission connection with a multi-chip stacking mechanism, and a substrate fixing mechanism is arranged at the center of the top of the processing platform. According to the invention, a plurality of groups of chips are adsorbed at one time by controlling the multi-chip stacking mechanism, then the multi-chip stacking mechanism and the chip bonding mechanism are controlled to alternately work to complete the stacking of a plurality of groups of chips, and then the gold wire bonding mechanism is controlled to connect all the chips with the substrate in a circuit manner so as to complete the stacking and packaging work of the chips, so that the repeated vacuum adsorption and the placement and stacking of the chips are avoided, the packaging work efficiency is improved, the multi-chip stacking mechanism can ensure that the chips are placed at the same position each time, and the packaging work precision is improved. The device still has the following drawbacks: In the existing manufacturing equipment, when the edge of the substrate is warped, the substrate is usually flattened, but when pressure is applied to flatten the substrate to an ideal plane, the restoring moment generated by the internal stress is only temporarily overcome, after the pressure is removed, the internal stress still exists, and the substrate can be restored to the original warped state instantaneously or with the lapse of time (after the stress is relaxed), so that the working effect of the manufacturing equipment is reduced. Disclosure of Invention The invention provides electronic component manufacturing equipment which comprises a manufacturing platform, wherein a processing groove is formed in the top of the manufacturing platform, a circulating disc is arranged on a bottom plate of the processing groove, a plurality of groups of substrate limiting mechanisms are distributed on the top of the circulating disc in an annular array, and a substrate taking mechanism, a chip mounting mechanism and a hot-press bonding mechanism are sequentially arranged on the side wall of the top of the manufacturing platform along the rotating direction of the circulating disc; the substrate limiting mechanism comprises a supporting seat, wherein the top of the supporting seat is provided with a first adjusting cavity, and the center of the inner wall of the bottom of the first adjusting cavity is provided with a supporting ring; The top of the supporting ring is provided with a rigid bottom plate, a flexible bottom plate is connected between the outer wall of the rigid bottom plate and the inner wall of the first adjusting cavity, and a plurality of groups of first air guide holes are distributed in an annular array; the outer wall of the supporting ring is sequentially sleeved with a plurality of groups of lifting rings capable of moving vertically, the outer side of the supporting seat is provided with a plurality of groups of folding pressure rods, and one end, far away from the guide ring, of each group of folding pressure rods is provided with a hot pressing plate. Further, a manipulator structure, a first lifting seat and a second lifting seat are sequentially arranged on the top side wall of the manufacturing platform along the rotation direction of the circulating disc, the output end of the manipulator structure is in transmission connection with the substrate material taking mechanism, the output end of the first lifting seat is in transmission connection with the chip mounting mechanism, and the output end of the second lifting seat is in transmission connection with the hot-press bonding mechanism. Furthermore, the inner edge and the outer edge of the top of each lifting ring are provided with round corners, a plurality of groups of first adsorption holes are uniformly distributed on the top of the rigid bottom plate, a plurality of groups of second adsorption holes are uniformly distributed on the top of the flexible bottom plate, and the top of each lifting ring i