Search

CN-121985614-A - Manufacturing method of optical coupler high-voltage isolator and optical coupler high-voltage isolator

CN121985614ACN 121985614 ACN121985614 ACN 121985614ACN-121985614-A

Abstract

The invention relates to the technical field of semiconductors, in particular to a manufacturing method of an optical coupler high-voltage isolator and the optical coupler high-voltage isolator, comprising the steps of providing a first glass substrate with preset thickness, and respectively manufacturing a first circuit wiring and a first welding pad on two opposite surfaces of the first glass substrate; the light emitting element and the first functional chip are fixedly mounted on the first surface (emitting end) of the light emitting element, the second functional chip is fixedly mounted on the second surface (receiving end) of the light emitting element, a first accommodating groove matched with the emitting end element, second circuit wiring and a first through hole filled in a conductive mode are formed in the second glass substrate, the bonding surface is a second welding pad, wiring interconnection is achieved by bonding the first surface, a first passivation layer and a first conductive connecting piece of the second welding pad are exposed out of the deviating surface, the third glass substrate and the second substrate are manufactured into the second accommodating groove through a process, after the second surface is bonded, the optical coupler sub-module is formed through pin packaging and rib cutting forming. The invention can adapt to different high-voltage isolation voltage requirements, and has simple and convenient manufacturing process and good stability.

Inventors

  • YAO YUFENG

Assignees

  • 莱弗利科技(苏州)有限公司

Dates

Publication Date
20260505
Application Date
20251212

Claims (10)

  1. 1. A method of manufacturing an optocoupler high voltage isolator, comprising: s1, providing a first glass substrate with preset thickness, and respectively manufacturing a first circuit wiring and a first welding pad on two opposite surfaces of the first glass substrate; s2, attaching the light emitting element and the first functional chip to the first surface of the first glass substrate through a conductive connecting piece in a die bonding way to serve as an emitting end; S3, providing a second glass substrate, forming a first accommodating groove corresponding to the light emitting element and the first functional chip on the second glass substrate, manufacturing a second circuit wiring and a first via hole penetrating through the upper surface and the lower surface of the second glass substrate, filling a conductive material in the first via hole, and manufacturing a second welding pad on the bonding surface of the second glass substrate; s4, attaching the second glass substrate to the first surface of the first glass substrate, and enabling the first circuit wiring to be electrically connected with the second circuit wiring through a welding pad; S5, manufacturing a first passivation layer on the surface, facing away from the first glass substrate, of the second glass substrate, wherein the first passivation layer exposes the second welding pad, and manufacturing a first conductive connecting piece on the exposed second welding pad; S6, providing a third glass substrate, adopting the same processing and manufacturing modes as the second glass substrate, forming a second accommodating groove matched with the second functional chip in size on the third glass substrate, attaching the second accommodating groove to the second surface of the first glass substrate, enabling the first circuit wiring to be electrically connected with the third circuit wiring on the third glass substrate, and manufacturing a second passivation layer and a third welding pad on the surface, deviating from the first glass substrate, of the third glass substrate to form an optical coupler sub-module; And S7, fixedly mounting the optical coupler sub-module on the mounting frame, establishing electrical connection between a welding pad of the optical coupler sub-module and a pin of the mounting frame in a conductive connection mode, packaging the optical coupler sub-module and the mounting frame, and forming through rib cutting to obtain the optical coupler high-voltage isolator.
  2. 2. The method of manufacturing an optocoupler high voltage isolator of claim 1, wherein the thickness of the first glass substrate is adjusted according to a predetermined isolation voltage.
  3. 3. The method for manufacturing an optocoupler high-voltage isolator according to claim 1, wherein a plurality of groups of the light emitting elements and the first functional chips are arranged on the first surface of the first glass substrate at intervals, and a plurality of groups of the second functional chips are correspondingly arranged on the second surface of the first glass substrate, so that a multi-channel isolation structure is formed.
  4. 4. The method for manufacturing an optical coupler high-voltage isolator according to claim 1, wherein the number of the first accommodating grooves formed in the second glass substrate is plural, and the size of the first accommodating grooves is adapted to the external dimensions of the light emitting element and the first functional chip.
  5. 5. The method for manufacturing an optical coupling high-voltage isolator according to claim 1, wherein the bonding mode of the second glass substrate and the first glass substrate and the bonding mode of the third glass substrate and the first glass substrate are lamination bonding or adhesive bonding.
  6. 6. The method of manufacturing an optocoupler of claim 1, wherein the first via on the second glass substrate includes a via corresponding to the location of the receiving slot and a via corresponding to the second circuit wiring.
  7. 7. The method of manufacturing an optocoupler of claim 1, wherein a second via penetrating through the upper and lower surfaces of the third glass substrate is disposed on the third glass substrate, the second via includes a via corresponding to the position of the second accommodating groove and a via corresponding to the third circuit wiring, and the second via is filled with a conductive material.
  8. 8. The method of claim 1, wherein the light emitting element, the conductive connecting member connecting the first functional chip and the first surface of the first glass substrate, the conductive connecting member connecting the second functional chip and the second surface of the first glass substrate, and the first conductive connecting member are solder balls, solder bumps, or conductive adhesive bumps.
  9. 9. The method of claim 1, wherein the first passivation layer and the second passivation layer are made of one or more of silicon nitride, silicon oxide, and polyimide.
  10. 10. An optocoupler high voltage isolator characterized in that the optocoupler high voltage isolator is manufactured by the method according to any one of claims 1 to 9.

Description

Manufacturing method of optical coupler high-voltage isolator and optical coupler high-voltage isolator Technical Field The invention relates to the technical field of semiconductors, in particular to a manufacturing method of an optical coupler high-voltage isolator and the optical coupler high-voltage isolator. Background The optical coupler isolator is used as a core device for realizing electrical isolation based on a photoelectric conversion principle, can realize safe transmission of signals while blocking electrical connection between an input end and an output end, and effectively inhibits electromagnetic interference, so that the optical coupler isolator is widely applied to the fields of industrial automation control, switching power supplies, new energy equipment, rail transit communication devices and the like. Particularly, in high-voltage working conditions (such as kilovolt and above voltage environments), the isolation voltage level, the light transmittance performance, the long-term stability and the reliability of the optocoupler isolator directly determine the safe operation efficiency and the service life of the whole electronic system, and are key links for guaranteeing the anti-interference capability of the system and the safety of personnel and equipment. The current mainstream optocoupler isolator preparation scheme has obvious limitation in isolation medium selection and structural design, and is difficult to simultaneously meet the comprehensive requirements of high-voltage isolation, high light transmittance, high integration level and process simplicity. Disclosure of Invention Therefore, the invention aims to solve the technical problems that the prior optical coupler isolator has inflexible isolation voltage adjustment, difficult manufacture of ultra-high voltage multiple channels, complex manufacturing process, poor performance stability, reliability and consistency and low yield, thereby providing a manufacturing method of the optical coupler high-voltage isolator and the optical coupler high-voltage isolator, wherein the manufacturing method of the optical coupler high-voltage isolator comprises the following steps: s1, providing a first glass substrate with preset thickness, and respectively manufacturing a first circuit wiring and a first welding pad on two opposite surfaces of the first glass substrate; s2, attaching the light emitting element and the first functional chip to the first surface of the first glass substrate through a conductive connecting piece in a die bonding way to serve as an emitting end; S3, providing a second glass substrate, forming a first accommodating groove corresponding to the light emitting element and the first functional chip on the second glass substrate, manufacturing a second circuit wiring and a first via hole penetrating through the upper surface and the lower surface of the second glass substrate, filling a conductive material in the first via hole, and manufacturing a second welding pad on the bonding surface of the second glass substrate; s4, attaching the second glass substrate to the first surface of the first glass substrate, and enabling the first circuit wiring to be electrically connected with the second circuit wiring through a welding pad; S5, manufacturing a first passivation layer on the surface, facing away from the first glass substrate, of the second glass substrate, wherein the first passivation layer exposes the second welding pad, and manufacturing a first conductive connecting piece on the exposed second welding pad; S6, providing a third glass substrate, adopting the same processing and manufacturing modes as the second glass substrate, forming a second accommodating groove matched with the second functional chip in size on the third glass substrate, attaching the second accommodating groove to the second surface of the first glass substrate, enabling the first circuit wiring to be electrically connected with the third circuit wiring on the third glass substrate, and manufacturing a second passivation layer and a third welding pad on the surface, deviating from the first glass substrate, of the third glass substrate to form an optical coupler sub-module; And S7, fixedly mounting the optical coupler sub-module on the mounting frame, establishing electrical connection between a welding pad of the optical coupler sub-module and a pin of the mounting frame in a conductive connection mode, packaging the optical coupler sub-module and the mounting frame, and forming through rib cutting to obtain the optical coupler high-voltage isolator. In one embodiment of the present invention, the thickness of the first glass substrate is adjusted according to a preset isolation voltage. In one embodiment of the present invention, a plurality of groups of the light emitting elements and the first functional chips are disposed on the first surface of the first glass substrate at intervals, and a plurality of groups of the second funct