CN-121985633-A - APD package and temperature control method thereof

CN121985633ACN 121985633 ACN121985633 ACN 121985633ACN-121985633-A

Abstract

The application relates to an APD package and a temperature control method thereof, comprising a first thermistor, a second thermistor, a temperature difference calculation module and a TEC adjustment module, wherein the first thermistor is arranged on a refrigerating surface of the TEC adjustment module adjacent to an APD chip, the second thermistor is arranged beside the TEC adjustment module and used for collecting the ambient temperature, and the temperature difference calculation module is used for receiving the temperatures collected by the first thermistor and the second thermistor and calculating corresponding temperature differences. The application provides an APD package and a temperature control method thereof, which can realize the detection of the temperature of an APD chip through a first thermistor, the detection of the ambient temperature through a second thermistor, and the adjustment of the output of a TEC adjusting module according to the temperature difference between the temperatures detected by the first thermistor and the second thermistor, thereby realizing the control of the working temperature of the APD package and further ensuring the effect of the whole working stability.

Inventors

XIAO YU
LIU HONGLIANG
ZOU YAN
LU YIFENG
XU HU

Assignees

芯思杰技术(深圳)股份有限公司

Dates

Publication Date: 20260505
Application Date: 20251230

Claims (7)

1. The APD package is characterized by comprising a first thermistor, a second thermistor, a temperature difference calculation module and a TEC adjustment module, wherein: the first thermistor is placed on a refrigeration surface of the TEC adjusting module adjacent to the APD chip; The second thermistor is arranged beside the TEC adjusting module and is used for collecting the ambient temperature; The temperature difference calculation module is used for receiving the temperatures acquired by the first thermistor and the second thermistor and calculating corresponding temperature differences; and the TEC adjusting module is used for outputting adjusting power according to the temperature difference calculation result.
2. The APD package of claim 1, wherein the first and second thermistors each employ an NTC thermistor.
3. The APD package of claim 1, further comprising a closed loop feedback control module to compare a product temperature to a target temperature and to modify the regulated power of the TEC regulator module.
4. The APD package of claim 1, further comprising a substrate and a packaging layer, the TEC adjustment module disposed on the substrate, the APD chip disposed on the TEC adjustment module, the first thermistor disposed on the TEC adjustment module and beside the APD chip.
5. An APD package temperature control method based on the APD package of any one of claims 1 to 4, comprising the steps of: configuring two groups of thermistors in an APD package, and respectively defining the two groups of thermistors as a first thermistor and a second thermistor; the method comprises the steps of arranging a first thermistor inside an APD package and adjacent to the APD chip, and detecting the temperature of the APD chip; the second thermistor is arranged in the APD package and detects the ambient temperature outside the APD chip; outputting and feeding back the temperature information acquired by the first thermistor and the second thermistor; And calculating the temperature difference according to the detection of the first thermistor and the second thermistor which are fed back by the output, and then carrying out temperature adjustment according to the temperature difference calculation result by the TEC adjusting module.
6. The APD package temperature control method of claim 5, wherein the first and second thermistors employ a synchronous sampling mechanism, and the product temperature and the ambient temperature are obtained by corresponding sampling circuits, respectively.
7. The APD package temperature control method of claim 5, wherein a conversion formula between temperature information and resistance values of the first and second thermistors is: Wherein T is the current temperature of the first thermistor or the second thermistor; t0 is the reference temperature of the first thermistor or the second thermistor; b is the material constant of the first thermistor or the second thermistor; R is the resistance value of the first thermistor or the second thermistor at the current temperature; r0 is the resistance value of the first thermistor or the second thermistor at the temperature T0.

Description

APD package and temperature control method thereof Technical Field The application relates to the technical field of chip packaging, in particular to an APD packaging and a temperature control method thereof. Background The APD chip, i.e., the avalanche photodiode chip, is a high performance semiconductor photodetector with an internal gain mechanism. The working principle of the APD chip determines that the performance of the APD chip is extremely sensitive to temperature, and the change of the temperature can influence key parameters such as multiplication efficiency, gain, dark current, noise and the like of the APD, so that the current response of the APD chip changes along with the temperature. In many application scenarios, such as lidar, optical communication, etc., accurate measurement of relevant parameters of an optical signal is required. Only through temperature control detection, the APD chip is ensured to work in a stable temperature environment, and accurate detection of the optical signal can be realized. In the prior art, APD packages generally adopt a single feedback mode, i.e. a thermistor is packaged in a product requiring temperature control, and the temperature inside the product is fed back in real time through the thermistor. The APD chip is a temperature sensitive device, and the breakdown voltage of the APD chip changes with the change of temperature. Since calibration is usually performed at different ambient temperatures under the condition of a fixed product temperature when the performance of the product is calibrated. The change of temperature can cause the gain of the APD chip to change, if the gain needs to be controlled unchanged, the working voltage of the APD chip needs to be adjusted at different temperatures, and the control circuit and algorithm of the whole system have higher complexity. Disclosure of Invention The embodiment of the application provides an APD package and a temperature control method thereof, which aim to solve the prior art that the gain of the APD package is easily affected by temperature change in the prior art, so that the working voltage of the APD chip is required to be adjusted at different temperatures through a complex circuit to reduce the influence caused by the temperature. In a first aspect, an embodiment of the present application provides an APD package, including a first thermistor, a second thermistor, a temperature difference calculation module, and a TEC adjustment module, wherein: the first thermistor is placed on a refrigeration surface of the TEC adjusting module adjacent to the APD chip; The second thermistor is arranged beside the TEC adjusting module and is used for collecting the ambient temperature; The temperature difference calculation module is used for receiving the temperatures acquired by the first thermistor and the second thermistor and calculating corresponding temperature differences; and the TEC adjusting module is used for outputting adjusting power according to the temperature difference calculation result. Further, the first thermistor and the second thermistor respectively adopt NTC thermistors. Further, the system also comprises a closed loop feedback control module which is used for comparing the product temperature with the target temperature and correcting the adjusting power of the TEC adjusting module. Further, the packaging structure further comprises a substrate and a packaging layer, wherein the TEC adjusting module is arranged on the substrate, the APD chip is arranged on the TEC adjusting module, and the first thermistor is arranged on the TEC adjusting module and beside the APD chip. In a second aspect, an embodiment of the present application provides an APD package temperature control method, based on the APD package described above, including the steps of: configuring two groups of thermistors in an APD package, and respectively defining the two groups of thermistors as a first thermistor and a second thermistor; the method comprises the steps of arranging a first thermistor inside an APD package and adjacent to the APD chip, and detecting the temperature of the APD chip; the second thermistor is arranged in the APD package and detects the ambient temperature outside the APD chip; outputting and feeding back the temperature information acquired by the first thermistor and the second thermistor; And calculating the temperature difference according to the detection of the first thermistor and the second thermistor which are fed back by the output, and then carrying out temperature adjustment according to the temperature difference calculation result by the TEC adjusting module. Further, the first thermistor and the second thermistor adopt a synchronous sampling mechanism, and the product temperature and the environment temperature are respectively obtained through corresponding sampling circuits. Further, a conversion formula between the temperature information and the resistance value of the firs