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CN-121985634-A - Manufacturing method of LED light source and LED light source

CN121985634ACN 121985634 ACN121985634 ACN 121985634ACN-121985634-A

Abstract

The invention relates to the technical field of semiconductor light emitting, and discloses a manufacturing method of an LED light source and the LED light source. S1, dispensing light-transmitting glue on a carrier plate, inverting the LED light-emitting chip to enable the light-emitting surface of the front face of the LED light-emitting chip to face the light-transmitting glue, and pressing the LED light-emitting chip onto the light-transmitting glue of the carrier plate. And S2, after solidification, removing the carrier plate, arranging the LED light-emitting chip in a positive mode, and covering the front surface and the peripheral side surfaces of the LED light-emitting chip with light-transmitting adhesive layers. And S3, fixing the non-light-emitting surface of the LED light-emitting chip on the substrate. And S4, laminating fluorescent glue on the light-emitting surface of the front surface of the LED light-emitting chip. After curing, a fluorescent glue layer is covered on the light-transmitting glue layer. The manufacturing method is simple, and the five light-emitting surfaces can be converted into one light-emitting surface, so that the light energy utilization rate is greatly improved. The arrangement of the double-layer light-transmitting adhesive layer can make up for the thickness difference of the materials, effectively avoid edge yellowing, ensure stable product quality, make up for manufacturing errors and greatly improve the yield.

Inventors

  • HUANG WEI
  • YANG DAOQUN
  • CAO YUXING
  • LI XIANGYANG

Assignees

  • 深圳循光科技有限公司

Dates

Publication Date
20260505
Application Date
20241030

Claims (10)

  1. 1. The manufacturing method of the LED light source is characterized by comprising the following steps of: S1, dispensing light-transmitting glue on a carrier plate (1), inverting an LED light-emitting chip (2) to enable a light-emitting surface of the front surface of the LED light-emitting chip (2) to be opposite to the light-transmitting glue, and pressing the LED light-emitting chip (2) onto the light-transmitting glue of the carrier plate (1); S2, after solidification, removing the carrier plate (1), rightly arranging the LED light-emitting chip (2), and covering the front surface and the peripheral side surfaces of the LED light-emitting chip (2) with light-transmitting adhesive layers (3); s3, fixing a non-light-emitting surface of the LED light-emitting chip (2) on the substrate (4); And S4, laminating fluorescent glue on the light-emitting surface of the front face of the LED light-emitting chip (2), and covering the fluorescent glue layer (5) on the light-transmitting glue layer (3) after curing.
  2. 2. The manufacturing method according to claim 1, further comprising step S5, after step S4, of spot-injecting or die-pressing a highly reflective adhesive around the light-transmitting adhesive layer (3), so that the side surfaces around the light-transmitting adhesive layer (3) are covered with the highly reflective adhesive layer (6).
  3. 3. The method according to claim 1, wherein in the step S2, the reflecting surface (31) is formed on the peripheral side surface of the light-transmitting adhesive layer (3).
  4. 4. The method according to claim 1, wherein in the step S2, the upper surface of the light-transmitting adhesive layer (3) is a plane or a curved surface.
  5. 5. The method according to claim 1, wherein in the step S4, the upper surface of the fluorescent glue layer (5) is a plane or a curved surface.
  6. 6. An LED light source, wherein the LED light source is manufactured by the manufacturing method according to any one of claims 1 to 5, comprising: A substrate (4); An LED light emitting chip (2) provided on the substrate (4); The light-transmitting adhesive layer (3) covers the front face and the side face of the LED light-emitting chip (2), and a reflecting surface (31) is arranged on the side face of the light-transmitting adhesive layer (3); and the fluorescent adhesive layer (5) at least covers the upper surface of the light-transmitting adhesive layer (3).
  7. 7. The LED light source according to claim 6, characterized in that the thickness of the light-transmitting glue layer (3) is less than or equal to 20 μm.
  8. 8. The LED light source according to claim 6, characterized in that the surrounding side of the light-transmitting glue layer (3) is provided with a highly reflective glue layer (6).
  9. 9. The LED light source according to claim 6, characterized in that the reflecting surface (31) is an inverted conical plane or curved surface.
  10. 10. The LED light source according to claim 6, characterized in that the upper surface of the light-transmitting glue layer (3) is planar or curved.

Description

Manufacturing method of LED light source and LED light source Technical Field The invention belongs to the technical field of semiconductor light emitting, and particularly relates to a manufacturing method of an LED light source and the LED light source. Background The CSP package in the current market mainly has two package forms of five-side light emission and single-side light emission, and in order to realize single-side emergent white light, the existing flip chip with single-color RGB five-side light emission generally has two methods: In the first prior art, the fluorescent glue layer 5 covers the front and the peripheral side surfaces of the LED light-emitting chip 2, the peripheral side surfaces of the fluorescent glue layer 5 are set to be vertical planes, and referring to fig. 7, light emitted from the side surfaces of the light-emitting chip 2 is incident to the vertical planes of the fluorescent glue layer 5 and then reflected to the side surfaces of the light-emitting chip 2. The emitted light of the side surface is transmitted back and forth between the side surface of the fluorescent glue layer 5 and the side surface of the light-emitting chip 2, the light is absorbed by the material after a plurality of back and forth, the light energy of the side surface of the light-emitting chip 2 reaches less emergent light of the front surface, the light energy utilization rate is low, and the light emitting brightness is low. Meanwhile, the edge light emitted from the front surface is easy to generate the phenomenon of yellowing around due to the fact that excessive fluorescent powder is excited, and the consistency of the light spot colors is poor. In the second prior art, the fluorescent glue layer 5 covers the front surface of the LED light-emitting chip 2, and the high-reflection glue 6 layer covers the fluorescent glue layer 5 and the peripheral side surfaces of the LED light-emitting chip 2, referring to fig. 8. The light of the peripheral sides of the fluorescent glue layer 5 and the LED light-emitting chip 2 is absorbed by the high-reflection glue layer 6, so that only the front side emits light, and the brightness of the peripheral sides of the LED light-emitting chip 2 is lower than that of the first prior art because the light of the peripheral sides of the LED light-emitting chip 2 is not utilized. Based on the above, the problems to be solved at present are to provide an LED light source with high front light emission, high light energy utilization rate and high light spot quality and a method for manufacturing the LED light source. Disclosure of Invention The invention aims to provide a manufacturing method of an LED light source and the LED light source thereof, and aims to solve the problems of complex manufacturing method, low production efficiency, low light energy utilization rate, low light-emitting brightness and unstable light spot quality of the LED light source in the prior art. The invention is realized in such a way that the manufacturing method of the LED light source comprises the following steps: S1, dispensing light-transmitting glue on a carrier plate, inverting an LED light-emitting chip, enabling a light-emitting surface of the front surface of the LED light-emitting chip to be opposite to the light-transmitting glue, and pressing the LED light-emitting chip onto the light-transmitting glue of the carrier plate; S2, after solidification, removing the carrier plate, rightly arranging the LED light-emitting chip, and covering the front surface and the peripheral side surfaces of the LED light-emitting chip with light-transmitting adhesive layers; s3, fixing a non-luminous surface of the LED luminous chip on a substrate; and S4, laminating fluorescent glue on the light-emitting surface of the front surface of the LED light-emitting chip, and covering the fluorescent glue layer on the light-transmitting glue layer after curing. Further, step S5 is further included after step S4, and the high-reflection glue is dotted or molded around the transparent glue layer, so that the high-reflection glue layer is covered on the peripheral side surfaces of the transparent glue layer. Further, in the step S2, an inverted conical reflecting surface is formed on the peripheral side surface of the light-transmitting glue layer. Further, in the step S2, the upper surface of the light-transmitting glue layer is a plane or a curved surface. Further, in the step S4, the upper surface of the fluorescent glue layer is a plane or a curved surface. The invention discloses an LED light source manufactured by adopting the manufacturing method, which comprises the following steps: A substrate; an LED light emitting chip arranged on the substrate; The light-transmitting adhesive layer covers the front face and the side face of the LED light-emitting chip, and the side face of the light-transmitting adhesive layer is provided with a reflecting surface; And the fluorescent adhesive layer at least cove