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CN-121985648-A - Dental auxiliary lighting lamp and production, assembly and processing technology thereof

CN121985648ACN 121985648 ACN121985648 ACN 121985648ACN-121985648-A

Abstract

The invention discloses a dental auxiliary lighting lamp and a production, assembly and processing technology thereof, comprising the following preparation steps of S1, PCB pretreatment, S2, silk-screen solder paste, S3, chip mounting, S4, reflow soldering and curing, S5, chip packaging, S6 and glue layer curing, wherein in the step of S6 and glue layer curing, a PCB board is sent into a curing oven in an inverted mode, and curing work is completed in an inverted mode. The glue layer is solidified in an inverted baking mode, glue overflows to other chip positions in the baking process can be effectively avoided, the packaging independence of the chips is guaranteed, clear isolation among the chips is guaranteed, the regularity of packaging finished products is obviously improved, the inverted posture stability of the PCB can be further guaranteed by matching with the accurate fixing of a special drying jig, the overflow-free effect is enhanced, and the method is suitable for batch mass production.

Inventors

  • CHEN XIAOHUI

Assignees

  • 东莞市茂恩电子科技有限公司

Dates

Publication Date
20260505
Application Date
20260128

Claims (7)

  1. 1. The dental auxiliary lighting lamp is characterized by comprising a lighting lamp shell and an LED chip packaging unit arranged in the lighting lamp shell; The LED chip packaging unit comprises a PCB substrate and an LED lamp bead chip welded on the PCB substrate, wherein the lower end of the PCB substrate is also welded with a wire for realizing the connection of the LED lamp bead chip; the PCB substrate is also provided with a packaging adhesive layer which is arranged to cover the LED lamp bead chip; The illuminating lamp shell is of a through shell structure, and the bottom end of the illuminating lamp shell is provided with a mounting port for mounting an LED lamp bead chip; The LED chip packaging unit is installed in the illuminating lamp shell from the installation opening in an upward mode of the LED lamp bead chip, and the PCB substrate is attached to the inner wall of the illuminating lamp shell to form positioning.
  2. 2. A process for producing, assembling and processing a dental auxiliary lighting lamp, which is used for the processing and the production of the dental auxiliary lighting lamp in the claim 1, and is characterized by comprising the following preparation steps: S1, PCB pretreatment, namely cleaning a PCB, and forming a positioning groove on the PCB through laser cutting equipment; S2, silk screen printing of the solder paste, namely uniformly printing the solder paste on a PCB (printed circuit board) through steel mesh silk screen printing equipment; s3, chip mounting, namely attaching the LED lamp bead chip into the positioning groove through a chip mounting device; S4, reflow soldering and curing, namely sending the PCB after the surface mounting into reflow soldering equipment to enable solder paste in the positioning groove to be cured, and electrically and mechanically connecting the chip with the PCB; S5, chip packaging, namely precisely dispensing all positioning grooves in the PCB by using dispensing equipment to realize chip packaging treatment in the positioning grooves on the PCB; s6, curing the adhesive layer, namely conveying the packaged PCB into a curing oven to cure the adhesive layer, and conveying the PCB into the curing oven in an inverted mode when curing the PCB, so as to finish the curing work in an inverted mode; s7, chip bonding wires, namely using a bonding pad at the bottom of a positioning groove in the PCB as a positioning reference to realize bonding wire processing of the LED lamp bead chip; s8, cutting the chip, namely, accurately cutting the PCB by taking a preset positioning groove on the PCB as a reference, and dividing the whole PCB into single independent LED chip packaging units; And S9, packaging the lamp beads, namely assembling the LED chip packaging unit into the illuminating lamp shell, enabling the lamp bead wires to penetrate out of the illuminating lamp shell so as to process welding wires, and sealing the bottom of the LED chip packaging unit to fix the LED chip packaging unit in the illuminating lamp shell.
  3. 3. The process according to claim 1, wherein in step S6, the glue layer is cured, and the PCB board is fed into the curing oven in an inverted manner by a specific drying jig.
  4. 4. The process according to claim 1, wherein in step S6, the adhesive layer is cured by stepwise heating, which comprises baking at 80 ℃ for 1 hour, baking at 100 ℃ for 1 hour, and baking at 150 ℃ for 3 hours.
  5. 5. The process for producing, assembling and processing the dental auxiliary illuminating lamp according to claim 1, wherein in the step S5, chip packaging, packaging glue adopts bi-component phenyl siloxane packaging glue as base glue, and the components are prepared according to the following proportion of glue A, glue B, fluorescent powder, diffusion powder and anti-sedimentation powder = 1:10:0.8:0.1:0.18.
  6. 6. The process of claim 5, wherein the adhesive composition A has a viscosity of 6500cP (6.5 Pa sec) at 25 ℃, the adhesive composition B has a viscosity of 2450cP (2.45 Pa sec) at 25 ℃, and the adhesive composition B has a viscosity of 2830cP (2.83 Pa sec) at 25 ℃ after mixing.
  7. 7. The process for manufacturing, assembling and processing the dental auxiliary illuminating lamp according to claim 5, wherein in the step S5, the chip packaging, the heating table for heating the PCB is arranged in the dispensing equipment.

Description

Dental auxiliary lighting lamp and production, assembly and processing technology thereof Technical Field The invention belongs to the technical field of packaging processing, and relates to an auxiliary dental lighting lamp and a production, assembly and processing process thereof. Background The dental auxiliary illuminating lamp is key equipment in oral clinical diagnosis and treatment and dental restoration processing, has the core effects of providing illumination support with high uniformity, no shadow and color temperature adaptation for an operation area, ensuring accurate judgment of accurate operations such as caries detection, root canal preparation, aesthetic restoration and the like for doctors, and simultaneously considering the eye comfort level of patients and the visual definition of a diagnosis and treatment area. The accuracy of diagnosis and treatment operation, the attractiveness of the repairing effect and the doctor-patient operation experience are directly determined by the advantages and disadvantages of the illumination performance, and the method has a decisive influence on the overall quality of dental diagnosis and treatment. Along with the development of the oral medical technology to the directions of minimally invasive, digital and fine, the market provides higher requirements on the light spot stability, the illumination adjustability, the anti-fog and anti-fouling capability of the dental auxiliary illuminating lamp and the compatibility of adapting to various diagnosis and treatment scenes. However, in the mass production and assembly process of the current dental auxiliary illuminating lamp, in the cementing and curing stage of the optical lens and the lamp body bracket, the incompletely cured glue is easy to overflow and spread to the optical surface of the lens or the circuit interface in the lamp body, so that serious defects such as the reduction of the light transmittance of the lens, the light spot distortion, the circuit short circuit and the like are caused, the qualification rate of products is greatly reduced, and the production cost is increased. Disclosure of Invention In order to solve the technical problems, the invention adopts the following technical scheme: The dental auxiliary lighting lamp is characterized by comprising a lighting lamp shell and an LED chip packaging unit arranged in the lighting lamp shell; The LED chip packaging unit comprises a PCB substrate and an LED lamp bead chip welded on the PCB substrate, wherein the lower end of the PCB substrate is also welded with a wire for realizing the connection of the LED lamp bead chip; the PCB substrate is also provided with a packaging adhesive layer which is arranged to cover the LED lamp bead chip; The illuminating lamp shell is of a through shell structure, and the bottom end of the illuminating lamp shell is provided with a mounting port for mounting an LED lamp bead chip; When the LED lamp bulb is assembled, the LED chip packaging unit is installed in the lamp shell from the mounting opening in an upward mode through the LED lamp bulb chip, and the PCB substrate is attached to the inner wall of the lamp shell to form positioning. The production, assembly and processing technology of the dental auxiliary illuminating lamp is used for processing and producing the dental auxiliary illuminating lamp and comprises the following preparation steps: S1, PCB pretreatment, namely cleaning a PCB, and forming a positioning groove on the PCB through laser cutting equipment; S2, silk screen printing of the solder paste, namely uniformly printing the solder paste on a PCB (printed circuit board) through steel mesh silk screen printing equipment; s3, chip mounting, namely attaching the LED lamp bead chip into the positioning groove through a chip mounting device; S4, reflow soldering and curing, namely sending the PCB after the surface mounting into reflow soldering equipment to enable solder paste in the positioning groove to be cured, and electrically and mechanically connecting the chip with the PCB; S5, chip packaging, namely precisely dispensing all positioning grooves in the PCB by using dispensing equipment to realize chip packaging treatment in the positioning grooves on the PCB; s6, curing the adhesive layer, namely conveying the packaged PCB into a curing oven to cure the adhesive layer, and conveying the PCB into the curing oven in an inverted mode when curing the PCB, so as to finish the curing work in an inverted mode; s7, chip bonding wires, namely using a bonding pad at the bottom of a positioning groove in the PCB as a positioning reference to realize bonding wire processing of the LED lamp bead chip; s8, cutting the chip, namely, accurately cutting the PCB by taking a preset positioning groove on the PCB as a reference, and dividing the whole PCB into single independent LED chip packaging units; And S9, packaging the lamp beads, namely assembling the LED chip packaging unit into the illuminati