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CN-121985649-A - LED packaging structure, LED backlight module and preparation method of LED backlight module

CN121985649ACN 121985649 ACN121985649 ACN 121985649ACN-121985649-A

Abstract

The invention relates to the technical field of LED packaging, and discloses an LED packaging structure, an LED backlight module and a preparation method of the LED backlight module. The LED packaging structure comprises an LED chip, a fluorescent adhesive film and a protective adhesive film, wherein the fluorescent adhesive film covers the side face and the upper surface of the LED chip, the protective adhesive film covers the side face and the upper surface of the fluorescent adhesive film, the fluorescent adhesive film is obtained by mixing and solidifying a silica gel base material and fluorescent powder, and the protective adhesive film is obtained by solidifying the silica gel base material of the fluorescent adhesive film. By implementing the invention, the luminous brightness of the LED packaging structure can be improved, the light emitting angle of the LED chip can be enlarged, the contact of water vapor and the LED chip can be blocked, the concentration and the luminous uniformity of the LED backlight module can be improved, and the light emitting uniformity and the reliability of the LED packaging structure and the backlight module can be improved.

Inventors

  • TANG QIYONG
  • LU PENG
  • HU JIAHUI
  • Jin Conglong

Assignees

  • 江西省兆驰光电有限公司

Dates

Publication Date
20260505
Application Date
20260409

Claims (10)

  1. 1. The LED packaging structure is characterized by comprising an LED chip, a fluorescent adhesive film and a protective adhesive film, wherein the fluorescent adhesive film covers the side surface and the upper surface of the LED chip, and the protective adhesive film covers the side surface and the upper surface of the fluorescent adhesive film; the fluorescent adhesive film is obtained by mixing and curing silica gel base materials and fluorescent powder; the protective adhesive film is obtained by solidifying a silica gel base material of the fluorescent adhesive film.
  2. 2. The LED package structure of claim 1, wherein the ratio of the thickness of the phosphor film to the thickness of the LED chip is (0.25-1.25): 1, and the ratio of the thickness of the protective film to the thickness of the phosphor film is (0.3-3): 1.
  3. 3. The LED package according to claim 1 or 2, wherein the mixing ratio of the silica gel base material and the phosphor is 1 (0.4-1).
  4. 4. The LED package structure of claim 1, wherein the silicone base is prepared from polydimethylsiloxane, a cross-linking agent, a catalyst and an inhibitor, wherein the silicone base is capable of being cured in stages, wherein the first curing temperature of the silicone base is 80 ℃ to 100 ℃, and wherein the second curing temperature of the silicone base is 120 ℃ to 150 ℃.
  5. 5. The LED package structure of claim 4, wherein the polydimethylsiloxane is vinyl-terminated polydimethylsiloxane, the cross-linking agent is a polysiloxane containing Si-H groups, and the molar ratio of Si-H groups to vinyl groups is (1.2-2): 1; the adding concentration of the catalyst in the silica gel base material is 10ppm-200ppm; the addition mole ratio of the inhibitor to the catalyst is (0.5-10): 1; The catalyst is a platinum complex; The inhibitor is at least one of ethynyl cyclohexanol, methylbutynol, 3-methyl-1-dodecyn-3-ol and tetramethyl tetravinyl cyclotetrasiloxane.
  6. 6. The LED packaging structure of claim 1, wherein an adhesive layer is further arranged between the fluorescent adhesive film and the LED chip, the adhesive layer is obtained by solidifying a silica gel base material in the fluorescent adhesive film, and the thickness of the adhesive layer is 5-20 μm.
  7. 7. An LED backlight module comprising a substrate and the LED package structure according to any one of claims 1-6, wherein the LED package structure is arranged in an array on the substrate.
  8. 8. The method for manufacturing the LED backlight module according to claim 7, comprising the steps of: Providing a mold, and primarily curing the fluorescent glue obtained by mixing the silica gel base material and the fluorescent powder in the mold to obtain a fluorescent glue film, and cutting the fluorescent glue film to obtain a single cross-shaped fluorescent glue film; Primary curing the silica gel base material in the mold to obtain a protective adhesive film, and cutting the protective adhesive film to obtain a single cross-shaped protective adhesive film; Providing a substrate, and fixing the LED chips on the substrate and arranging the LED chips in an array manner; Placing a single fluorescent adhesive film on the upper surface of an LED chip, coating the single fluorescent adhesive film on the side surface and the upper surface of the LED chip by using a plastic film, and completely curing and forming; And placing the single protective adhesive film on the upper surface of the fluorescent adhesive film, coating the single protective adhesive film on the side surface and the upper surface of the fluorescent adhesive film by using a plastic film, and completely curing and forming.
  9. 9. The method for manufacturing the LED backlight module according to claim 8, wherein the primary curing temperature of the silica gel base material is 80-100 ℃ and the curing time is 3-10 min; The complete curing temperature of the silica gel base material is 120-150 ℃ and the curing time is 1-2 h.
  10. 10. The method for manufacturing an LED backlight module according to claim 8, wherein the side length of the single fluorescent film is a, the height of the LED chip is H 1 , and the length is B 1 , so that a= (1.1-1.3) (2*H 1 +B 1 ) is satisfied; The side length of the single protective adhesive film is C, the height of the LED chip coated with the fluorescent adhesive film is H 2 , and the length of the LED chip coated with the fluorescent adhesive film is B 2 , so that C= (1.3-1.5) is satisfied (2*H 2 +B 2 ).

Description

LED packaging structure, LED backlight module and preparation method of LED backlight module Technical Field The invention relates to the technical field of LEDs, in particular to an LED packaging structure, an LED backlight module and a preparation method of the LED backlight module. Background The LED and the LED module have the advantages of low energy consumption, long service life, high response speed and the like, and are widely applied to a plurality of fields such as a display screen backlight source and the like. The core structure of the conventional LED and module consists of a bracket 10, an LED chip 1 and a fluorescent adhesive film 2, wherein the fluorescent adhesive film 2 is a mixture formed by uniformly dispersing fluorescent powder in silica gel, and the fluorescent adhesive film 2 is covered on the surface of the LED chip 1 in a dispensing mode in the packaging process to obtain an LED packaging structure, as shown in fig. 1. However, when the conventional LED and the conventional module are applied to a display screen backlight scene, the packaging mode of dispensing can lead to large dispersion of the luminous performance of the LED and the conventional module, low product concentration and reduced yield of mass production. Meanwhile, most of fluorescent powder is far away from the LED chip 1, so that the excitation degree of the fluorescent powder is low, the photon conversion efficiency is limited, the brightness of the LED is low finally, moreover, the fluorescent powder close to the surface of the LED is directly exposed in the external environment, and water vapor easily permeates into and contacts with the LED chip 1, so that the performance of the LED and the module is reduced. In addition, the conventional backlight module is generally composed of a substrate 4, an LED packaging structure, a lens 8 and a diffusion sheet 9, the conventional LED chip 1 is in a single-sided light emitting mode, the light intensity distribution is characterized by strong center and weak periphery, and the inherent light emitting angle is small. The backlight source of the display screen needs to be covered by uniform and wide illumination, in order to make up the deficiency of the light emitting angle, a lens 8 and a diffusion sheet 9 are additionally arranged outside the LED, the light emitting angle is enlarged by refraction of the lens 8, and the formed LED backlight module is shown in fig. 2. Disclosure of Invention The invention aims to solve the technical problems of providing an LED packaging structure, an LED backlight module and a preparation method of the LED backlight module, which have the advantages of high luminous brightness and high concentration, enlarge the light emitting angle of an LED chip, prevent water vapor from contacting with the LED chip, and effectively improve the light emitting uniformity and reliability of the LED packaging structure and the backlight module. In order to solve the technical problems, the first aspect of the invention provides an LED packaging structure, which comprises an LED chip, a fluorescent adhesive film and a protective adhesive film, wherein the fluorescent adhesive film covers the side surface and the upper surface of the LED chip, and the protective adhesive film covers the side surface and the upper surface of the fluorescent adhesive film; the fluorescent adhesive film is obtained by mixing and curing silica gel base materials and fluorescent powder; the protective adhesive film is obtained by solidifying a silica gel base material of the fluorescent adhesive film. As an improvement of the scheme, the ratio of the thickness of the fluorescent adhesive film to the thickness of the LED chip is (0.25-1.25): 1, and the ratio of the thickness of the protective adhesive film to the thickness of the fluorescent adhesive film is (0.3-3): 1. As improvement of the scheme, the preparation raw materials of the silica gel base material comprise polydimethylsiloxane, a cross-linking agent, a catalyst and an inhibitor, the silica gel base material can be cured in a staged manner, the first curing temperature of the silica gel base material is 80-100 ℃, and the second curing temperature of the silica gel base material is 120-150 ℃. As an improvement of the scheme, the polydimethylsiloxane is vinyl-terminated polydimethylsiloxane, the cross-linking agent is polysiloxane containing Si-H groups, and the addition molar ratio of the Si-H groups to the vinyl groups is (1.2-2): 1; the adding concentration of the catalyst in the silica gel base material is 10ppm-200ppm; the molar ratio of the inhibitor to the catalyst is (0.5-10) 1. The catalyst is a platinum complex; The inhibitor is at least one of ethynyl cyclohexanol, methylbutynol, 3-methyl-1-dodecyn-3-ol and tetramethyl tetravinyl cyclotetrasiloxane. As an improvement of the scheme, an adhesive layer is further arranged between the fluorescent adhesive film and the LED chip, and the adhesive layer is obtained