CN-121985652-A - Display module and manufacturing method thereof

CN121985652ACN 121985652 ACN121985652 ACN 121985652ACN-121985652-A

Abstract

The application provides a display module and a manufacturing method thereof, relating to the technical field of display devices, wherein the manufacturing method of the display module comprises the steps of mounting an LED chip array on the mounting surface of a substrate layer, coating a liquid light-transmitting layer on the surface of the LED chip array, covering a fluorescent layer on the surface of the liquid light-transmitting layer, then laminating the substrate layer, the coated liquid light-transmitting layer and the fluorescent layer, thermosetting, cutting the light-transmitting layer and the fluorescent layer to form grooves between at least part of adjacent LED chips, finally, an isolation layer is coated in the groove to obtain the display module, and in the manufacturing method provided by the embodiment of the application, the light-transmitting layer is firstly coated on the surface of the LED chip array integrally, the fluorescent layer is covered on the surface of the light-transmitting layer integrally, and then the method is in a unified cutting mode, so that the precision requirement is low, the steps are simple, the difficulty of the manufacturing process is reduced, and the problems of complicated steps and high process difficulty of the manufacturing process of the display module in the related technology are solved.

Inventors

ZHANG WEN
MAO QIQI
ZHANG NI
LI ZHUANGZHI

Assignees

惠州市聚飞光电有限公司
深圳市聚飞光电股份有限公司

Dates

Publication Date: 20260505
Application Date: 20260203

Claims (10)

1. The manufacturing method of the display module is characterized by comprising the following steps: Mounting an LED chip array on the mounting surface of the substrate layer; coating a liquid light-transmitting layer on the surface of the LED chip array and the mounting surface of the substrate layer, and covering a fluorescent layer on the surface of the liquid light-transmitting layer; pressing the substrate layer, the light-transmitting layer and the fluorescent layer, and curing the light-transmitting layer and the fluorescent layer; cutting the light-transmitting layer and the fluorescent layer, and forming a groove between at least part of adjacent LED chips, wherein the light-transmitting layer and the fluorescent layer are aligned on the inner side of the groove; And coating isolation layers in the grooves and on the surface of the LED chip array to obtain the display module.
2. The method of manufacturing a display module according to claim 1, wherein in the step of cutting the light-transmitting layer and the fluorescent layer so that a groove is formed between at least a part of the adjacent LED chips, a width at a notch of the groove is greater than or equal to a width at a bottom of the groove in a direction perpendicular to a mounting surface of the substrate layer.
3. The method of manufacturing a display module according to claim 1, wherein the step of coating an isolation layer in the trench and on the surface of the LED chip array to obtain the display module further comprises: And cutting the light-transmitting layer and the fluorescent layer, and forming the grooves around each LED chip in the LED chip array.
4. The method of manufacturing a display module according to claim 1, wherein the step of coating a liquid light-transmitting layer on the surface of the LED chip array and the mounting surface of the substrate layer, and covering the surface of the liquid light-transmitting layer with a fluorescent layer comprises: Coating a liquid light-transmitting layer on the surface of the LED chip array and the mounting surface of the substrate layer, and enabling the light-transmitting layer to wrap the LED chip array; And covering a fluorescent layer on the surface of the light-transmitting layer, wherein the fluorescent layer at least completely covers the LED chip array, and the width of the fluorescent layer is larger than that of the LED chip array.
5. The method of manufacturing a display module according to claim 4, wherein in the step of covering the surface of the light-transmitting layer with the fluorescent layer, the fluorescent layer is gradually covered from the middle to both ends of the light-transmitting layer.
6. The method of manufacturing a display module according to claim 1, wherein in the step of cutting the light-transmitting layer and the fluorescent layer so that grooves are formed between at least a part of the adjacent LED chips, the fluorescent layer is cut off and the light-transmitting layer is kept continuous.
7. The method of manufacturing a display module according to claim 1, wherein in the step of coating an isolation layer in the groove and on the surface of the LED chip array to obtain the display module, a portion of the isolation layer at the outermost periphery is connected with the substrate layer, or a portion of the isolation layer at the outermost periphery is filled in a recess of the substrate layer, and the recess of the substrate layer has a bottom lower than a bottom of the LED chip.
8. The method of claim 1, wherein the step of laminating the substrate layer, the light-transmitting layer and the fluorescent layer comprises: And pressing the substrate layer, the light-transmitting layer and the fluorescent layer, wherein the pressing temperature is 120-130 ℃ and the pressure is 0.1-0.3 MPa.
9. The method of manufacturing a display module according to claim 4, wherein the fluorescent layer used in the step of covering the surface of the light-transmitting layer with the fluorescent layer has a preformed thickness of 0.05-0.2mm.
10. A display module, characterized in that it is manufactured by a method of manufacturing a display module according to any one of claims 1-9.

Description

Display module and manufacturing method thereof Technical Field The application relates to the technical field of display devices, in particular to a display module and a manufacturing method thereof. Background With innovations and developments of light emitting Diode (LIGHT EMITTING Diode) display technologies, LED display products gradually enter into various fields of our lives, and micro chip-on-board packaging technology (Mini Chip on Board, MINI COB) display modules with higher resolution become mainstream products of LED display screens. In the field of MINI COB modules, not only is the requirements of MINI Red-Green-Blue (MINI RGB) module schemes continuously increased, but also the requirements of MINI COB white light display modules are obvious, how to realize a small-pitch uniform white light display module to display higher-definition images and videos becomes a problem and direction of a display industry, and in the related technology, the manufacturing process steps of the display module are complicated and the process difficulty is high. Disclosure of Invention The application aims to provide a display module and a manufacturing method thereof, which are used for solving the problems of complicated steps and high process difficulty in the manufacturing process of the display module in the related technology. In one aspect, an embodiment of the present application provides a method for manufacturing a display module, including: Mounting an LED chip array on the mounting surface of the substrate layer; coating a liquid light-transmitting layer on the surface of the LED chip array and the mounting surface of the substrate layer, and covering a fluorescent layer on the surface of the liquid light-transmitting layer; pressing the substrate layer, the light-transmitting layer and the fluorescent layer, and curing the light-transmitting layer and the fluorescent layer; Cutting the light-transmitting layer and the fluorescent layer, and forming grooves between at least part of adjacent LED chips; And coating isolation layers in the grooves and on the surface of the LED chip array to obtain the display module. In one embodiment, in the step of cutting the light-transmitting layer and the fluorescent layer such that a groove is formed between at least a part of the adjacent LED chips, a width at a notch of the groove is greater than or equal to a width at a bottom of the groove in a direction perpendicular to a mounting surface of the substrate layer. In one embodiment, the step of coating an isolation layer in the groove and on the surface of the LED chip array to obtain a display module further includes: And cutting the light-transmitting layer and the fluorescent layer, and forming the grooves around each LED chip in the LED chip array. In one embodiment, the step of coating a liquid light-transmitting layer on the surface of the LED chip array and the mounting surface of the substrate layer, and covering the surface of the liquid light-transmitting layer with a fluorescent layer includes: Coating a liquid light-transmitting layer on the surface of the LED chip array and the mounting surface of the substrate layer, and enabling the light-transmitting layer to wrap the LED chip array; And covering a fluorescent layer on the surface of the light-transmitting layer, wherein the fluorescent layer at least completely covers the LED chip array, and the width of the fluorescent layer is larger than that of the LED chip array. In one embodiment, the phosphor layer used in the step of covering the surface of the light-transmitting layer with a phosphor layer has a preformed thickness of 0.05 to 0.2mm. In one embodiment, in the step of covering the surface of the light-transmitting layer with a fluorescent layer, the fluorescent layer is gradually covered from the middle to both ends of the light-transmitting layer. In one embodiment, in the step of cutting the light-transmitting layer and the fluorescent layer so that grooves are formed between at least part of the adjacent LED chips, the fluorescent layer is cut and the light-transmitting layer is kept continuous. In one embodiment, in the step of coating the isolation layer in the groove and on the surface of the LED chip array to obtain the display module, the part of the isolation layer at the outermost periphery is connected with the substrate layer, or the part of the isolation layer at the outermost periphery is filled in the concave part of the substrate layer, and the concave part of the substrate layer has a bottom lower than the bottom of the LED chip. In one embodiment, the step of laminating the substrate layer, the light-transmitting layer, and the fluorescent layer includes: And pressing the substrate layer, the light-transmitting layer and the fluorescent layer, wherein the pressing temperature is 120-130 ℃ and the pressure is 0.1-0.3 MPa. On the other hand, the embodiment of the application also provides a display module, which is manufactu