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CN-121985655-A - LED packaging device structure, preparation method thereof and LED module

CN121985655ACN 121985655 ACN121985655 ACN 121985655ACN-121985655-A

Abstract

The invention discloses an LED packaging device structure, a preparation method thereof and an LED module. The LED packaging device structure comprises a PCB substrate, a plurality of LED chips and a packaging colloid, wherein the PCB substrate comprises a first surface and a second surface which are opposite to each other, the plurality of LED chips are electrically connected with the first surface of the PCB substrate, the packaging colloid wraps the plurality of LED chips on the first surface of the PCB substrate, and the projection area of the packaging colloid on the PCB substrate is smaller than the area of the first surface of the PCB substrate. According to the invention, the LED chips are directly connected with the first surface of the PCB substrate, so that the connection structures such as welding lines and the like are avoided, the blocking of the welding lines to light rays is avoided, and the luminous area of the LED packaging device structure is complete. In addition, through setting up a plurality of first pads and at least one second pad at the second surface of PCB base plate, realized when LED encapsulation device structure and external drive plate's fixed connection, increased the area of contact of external drive plate and PCB base plate, strengthened the thrust of LED encapsulation device structure.

Inventors

  • MEI XIONG
  • GONG WEN
  • YAN CHUNWEI

Assignees

  • 苏州晶台光电有限公司

Dates

Publication Date
20260505
Application Date
20260130

Claims (10)

  1. 1. The LED packaging device structure is characterized by comprising a PCB substrate, a plurality of LED chips and a packaging colloid; The PCB substrate comprises a first surface and a second surface which are away from each other; The plurality of LED chips are electrically connected with the first surface of the PCB substrate; The packaging colloid wraps the LED chips on the first surface of the PCB substrate, and the projection area of the packaging colloid on the PCB substrate is smaller than the area of the first surface of the PCB substrate.
  2. 2. The LED package device structure of claim 1, wherein a plurality of connection structures are disposed in the PCB substrate through the PCB substrate; the second surface of the PCB substrate includes a plurality of first pads and at least one second pad; The plurality of first bonding pads are respectively connected with the plurality of LED chips in a one-to-one correspondence manner through the plurality of connecting structures, and the plurality of first bonding pads are used for realizing the electric connection between the LED packaging device structure and an external driving board; the second bonding pad is used for realizing the fixed connection between the LED packaging device structure and the external driving plate.
  3. 3. The LED package device structure of claim 2, wherein said first surface of said PCB substrate comprises a functional area, a solder mask area and a bare board area, wherein said bare board area surrounds said functional area and said solder mask area; the first surface of the PCB substrate further comprises a plurality of third bonding pads, connecting wires and a plurality of fourth bonding pads, wherein the third bonding pads are positioned in the functional area, the fourth bonding pads are positioned in the solder mask area, and the connecting wires extend from the functional area to the solder mask area; The LED chips are connected with the third bonding pads in one-to-one correspondence, the third bonding pads are connected with the fourth bonding pads in one-to-one correspondence through the connecting wires, and the fourth bonding pads are connected with the first bonding pads in one-to-one correspondence through the connecting structures.
  4. 4. The LED package device structure of claim 3, wherein the plurality of third pads each comprise a positive pad and a negative pad; The negative electrode bonding pads of the third bonding pads are respectively connected with the negative electrodes of the LED chips in a one-to-one correspondence manner and are respectively connected with the fourth bonding pads in a one-to-one correspondence manner through the connecting wires; The positive electrode bonding pads of the third bonding pads are respectively connected with the positive electrodes of the LED chips in a one-to-one correspondence manner, and are all connected to the same fourth bonding pad through the connecting wires.
  5. 5. A method for preparing an LED package device structure according to any one of claims 1-4, comprising: The array substrate comprises a plurality of PCB substrates distributed in an array way, wherein the array substrate comprises a first surface and a second surface which are opposite to each other; Sequentially welding the plurality of LED chips on the first surface of the array substrate; forming a packaging adhesive layer on the first surface of the array substrate by adopting a mould pressing process, wherein the packaging adhesive layer wraps the LED chips; cutting the packaging adhesive layer by using a first cutting knife until the packaging adhesive layer is cut to the first surface of the array substrate, so as to form the packaging adhesive; And cutting the array substrate at the cutting position of the first cutting knife by using a second cutting knife until the array substrate is separated into a plurality of PCB substrates, so as to form a plurality of LED packaging device structures.
  6. 6. The method of claim 5, wherein the first cutter has a thickness greater than a thickness of the second cutter.
  7. 7. The method of manufacturing of claim 5, wherein the first surface of the PCB substrate comprises a functional area, a solder mask area and a bare board area, wherein the bare board area surrounds the functional area and the solder mask area, the first surface of the PCB substrate further comprises a plurality of third bonding pads, connecting wires and a plurality of fourth bonding pads, the plurality of third bonding pads are positioned in the functional area, the plurality of fourth bonding pads are positioned in the solder mask area, and the connecting wires extend from the functional area to the solder mask area; after providing the array substrate, before the first surface of the array substrate is sequentially soldered with the plurality of LED chips, the method further comprises: Coating a solder material on the plurality of third pads; performing three-dimensional quality detection on the welding material; Sequentially welding the plurality of LED chips on the first surface of the array substrate, wherein the method comprises the following steps: sequentially fixing the plurality of LED chips on the plurality of third bonding pads; Forming electrical connection between the plurality of LED chips and the plurality of third bonding pads through a reflow soldering process; and cleaning the LED chips and the array substrate by adopting a plasma cleaning process.
  8. 8. The method of manufacturing according to claim 5, wherein cutting the array substrate at the cutting position of the first cutter using a second cutter until the array substrate is separated into a plurality of the PCB substrates, and forming a plurality of the LED package device structures, further comprises: dehumidifying the LED packaging device structures; Performing appearance detection on the dehumidified LED packaging device structures; Performing at least one photoelectric parameter test on the LED packaging device structures detected through the appearance, and grading the LED packaging device structures according to test results; packaging the classified LED packaging device structures.
  9. 9. An LED module comprising a driving board, a mesh mask, and a plurality of LED package device structures of any one of claims 1-4 arranged in an array; The LED packaging device structure is positioned on one side surface of the driving plate, and the driving plate is used for controlling the LED packaging device structure to emit light; The mesh mask is positioned in gaps of the LED packaging device structures and used for protecting the LED packaging device structures.
  10. 10. The LED module of claim 9, wherein the mesh mask includes a mesh shade and a mesh connection; the reticular shading parts are positioned in gaps of the packaging colloid of the LED packaging device structures; The mesh connection part is positioned in gaps of the PCB substrates of the LED packaging device structures; the cross section patterns of the reticular light shielding part and the reticular connecting part on the vertical plane are T-shaped, wherein the LED packaging device structures are arranged in an array along a first direction and a second direction, the first direction is perpendicular to the second direction, the vertical plane is perpendicular to the PCB substrate, the vertical plane is parallel to the first direction or the second direction, and the vertical plane passes through the LED packaging device structures arranged along the first direction or the second direction.

Description

LED packaging device structure, preparation method thereof and LED module Technical Field The invention relates to the technical field of LED packaging, in particular to an LED packaging device structure, a manufacturing method thereof and an LED module. Background In recent years, the increase of demands of global performance activities, sports events and the like promotes the remarkable expansion and competition upgrading of the leasing market of the LED display screen, and the overseas middle-high-end market particularly puts more stringent demands on the display quality and reliability of products. Under the background, the indoor small-space leasing market such as P1.56/P1.95 is gradually rising, and the Top1212/1010 packaging devices and the corresponding processes (bracket dehumidification, die bonding, bonding wire, dispensing, light splitting and the like) which are widely adopted currently have a series of inherent defects, so that the requirements of high-end application are difficult to meet. The LED lamp is characterized in that a single-sided light emitting structure is limited, a light emitting angle is narrow, a half-wave power angle of the LED lamp is only 103 degrees, 101 degrees and 90 degrees in the horizontal direction, the half-wave power angle is as low as 95 degrees, 101 degrees and 84 degrees in the vertical direction, side view brightness and color uniformity are poor, meanwhile, due to poor flatness of support pins and poor matching property of solder paste printing and bonding pads in an SMT (surface mount technology), light beads are easily slightly inclined due to uneven surface tension influence during reflow soldering, and uneven display of bright and dark left visual angles and dark visual angles of a display screen are caused, in addition, the welding thrust of the device is only 1.1Kg on average, the mechanical strength is weak, collision damage and even lamp dropping are easily caused during installation of a mask and module splicing, and reliability and use experience of the product are seriously influenced. Therefore, how to improve the light emitting viewing angle, display uniformity and soldering reliability of the device from the packaging structure and the process level system has become a technical problem that needs to be solved in the art. Disclosure of Invention The invention provides an LED packaging device structure, a preparation method thereof and an LED module, which solve the problem of uneven display of the LED packaging device structure and improve the overall thrust, the luminous brightness and the display visual angle. In a first aspect, the invention provides an LED packaging device structure, comprising a PCB substrate, a plurality of LED chips and a packaging colloid; The PCB substrate comprises a first surface and a second surface which are away from each other; The plurality of LED chips are electrically connected with the first surface of the PCB substrate; The packaging colloid wraps the LED chips on the first surface of the PCB substrate, and the projection area of the packaging colloid on the PCB substrate is smaller than the area of the first surface of the PCB substrate. Optionally, a plurality of connection structures penetrating the PCB substrate are arranged in the PCB substrate; the second surface of the PCB substrate includes a plurality of first pads and at least one second pad; The plurality of first bonding pads are respectively connected with the plurality of LED chips in a one-to-one correspondence manner through the plurality of connecting structures, and the plurality of first bonding pads are used for realizing the electric connection between the LED packaging device structure and an external driving board; the second bonding pad is used for realizing the fixed connection between the LED packaging device structure and the external driving plate. Optionally, the first surface of the PCB substrate comprises a functional area, a solder resist area and a bare board area, wherein the bare board area surrounds the functional area and the solder resist area; the first surface of the PCB substrate further comprises a plurality of third bonding pads, connecting wires and a plurality of fourth bonding pads, wherein the third bonding pads are positioned in the functional area, the fourth bonding pads are positioned in the solder mask area, and the connecting wires extend from the functional area to the solder mask area; The LED chips are connected with the third bonding pads in one-to-one correspondence, the third bonding pads are connected with the fourth bonding pads in one-to-one correspondence through the connecting wires, and the fourth bonding pads are connected with the first bonding pads in one-to-one correspondence through the connecting structures. Optionally, each of the plurality of third pads includes a positive electrode pad and a negative electrode pad; The negative electrode bonding pads of the third bonding pads are respec