CN-121985658-A - Display module, forming method, related equipment and terminal

Abstract

The embodiment of the invention provides a display module, a forming method, related equipment and a terminal, wherein the display module comprises a driving core particle, the driving core particle comprises a plurality of driving electrodes, the driving electrodes are distributed on the front surface of the driving core particle and are arranged in an edge electrode area on at least one side of the driving core particle, the back surface of the driving core particle comprises a bonding pad corresponding to the driving electrodes, the bonding pad is electrically connected with the driving electrodes corresponding to the bonding pad based on a through hole connection structure, and the bonding pad is used as a metal electrode for electrically connecting the display module with an external structure. The display module provided by the embodiment of the invention can reduce the whole volume of the display module.

Inventors

• ZHU YOULIANG
• LIN XIAO
• WANG YAZHOU

Assignees

• 诺视科技(苏州)有限公司

Dates

Publication Date

20260505

Application Date

20260331

Claims (20)

1. 1. A display module, comprising: Driving the core particles; The driving core particle comprises a plurality of driving electrodes, wherein the driving electrodes are distributed on the front surface of the driving core particle, and the driving electrodes are arranged in an edge electrode area on at least one side of the driving core particle; the back surface of the driving core particle comprises a bonding pad corresponding to the driving electrode, wherein the bonding pad is electrically connected with the driving electrode corresponding to the bonding pad based on a through hole connection structure, and the bonding pad is used as a metal electrode for electrically connecting the display module with an external structure.
2. 2. The display module of claim 1, wherein adjacent ones of the driving electrodes are arranged at a predetermined electrode pitch interval, and wherein the driving electrodes are arranged in at least one row or one column for an edge electrode region in which the driving electrodes are arranged.
3. 3. The display module of claim 2, further comprising a MicroLED chip located on the front side of the driving core, the MicroLED chip and the driving core forming a display panel, wherein the MicroLED chip comprises a display region and an anti-reflection region, the anti-reflection region being located in a region between the display region and the edge electrode region on the projection of the driving core; The display module further comprises a supporting substrate and an adhesion structure positioned between the driving core particle and the supporting substrate; the adhesive structure is located on the front surface of the driving core particle, and an inner edge of the area of the adhesive structure is arranged at a first distance from an outer edge of the display area.
4. 4. The display module assembly of claim 3, further comprising solder balls, and/or a heat dissipation enhancing structure; The solder balls are arranged on each bonding pad; the heat dissipation enhancing structure is positioned on the back surface of the driving core particle, and the forming area of the heat dissipation enhancing structure corresponds to the display area; In the case that the display module comprises the heat dissipation enhancing structure, the heat dissipation enhancing structure further comprises a uniformly arranged solder ball array; Wherein the bonding pads include embedded bonding pads and protruding bonding pads.
5. 5. A display module according to claim 3, wherein the adhesive structure is located on the driving core in an area other than the display area or between an inner edge of the edge electrode area and an outer edge of the display area; The bonding structure comprises bonding glue, a metal bonding layer or a combination thereof, and is an integral structure or a collection of a plurality of spacer bonding structures.
6. 6. The display module of claim 5, wherein the predetermined electrode spacing is in a range of greater than or equal to 100 microns, wherein a distance from an outer edge of the display region to an inner edge of the edge electrode region is greater than or equal to 50 microns and less than or equal to 2000 microns, wherein a minimum width of the anti-reflection region is greater than or equal to 20 microns, wherein a minimum value of the first distance is greater than or equal to 5 microns, and wherein a minimum width of the bonding structure is greater than or equal to 20 microns.
7. 7. The display module of claim 3, wherein the via connection structure includes an adhesion barrier layer and a metal pillar, the adhesion barrier layer being disposed on an inner wall of the via connection structure, the metal pillar being filled inside the adhesion barrier layer and bonded to the adhesion barrier layer, the display module further comprising: And the first insulating layer covers the front surface of the driving core particle and extends to cover the inner wall of the through hole connecting structure, and the inner wall of the through hole connecting structure is separated from the adhesion barrier layer by the first insulating layer.
8. 8. The display module assembly of claim 7, further comprising: The second insulating layer covers the back surface of the driving core particle and is contacted with the first insulating layer which extends to cover the inner wall of the through hole connecting structure; The anti-reflection structure is arranged on one side surface of the supporting substrate far away from the front surface of the driving core particle, and the vertical projection of the arrangement area of the anti-reflection structure covers the anti-reflection area and the area from the outer edge of the anti-reflection area to the outer edge of the driving core particle; and the color conversion layer is covered on the display area and is used for converting the original display color of the display area.
9. 9. A display module according to claim 3, wherein the support substrate is a transparent substrate or a non-transparent substrate; The non-transparent substrate is of a middle hollow structure, and the middle hollow area corresponds to and exposes the display area; the thickness of the supporting substrate is more than or equal to 100 micrometers and less than or equal to 800 micrometers; The thickness of the driving core particle is greater than or equal to 20 microns and less than or equal to 800 microns.
10. 10. The method for forming the display module is characterized by comprising the following steps: providing an initial driving wafer, wherein the initial driving wafer comprises a plurality of device areas which are arranged in an array manner, and the device areas comprise edge electrode areas; Forming a driving electrode in an edge electrode area on at least one side of each device area on the front surface of the initial driving wafer; forming a driving wafer, wherein the driving wafer is obtained after the initial driving wafer is thinned, the driving wafer is provided with a through hole connecting structure electrically connected with the driving electrode, a bonding pad electrically connected with the through hole connecting structure is formed on the back surface of the driving wafer, and the bonding pad is used as a metal electrode electrically connected with an external structure by the display module; and cutting the device region to form a display module, wherein a driving wafer in the device region is used as a driving core particle of the display module.
11. 11. The method of claim 10, wherein the initial driving wafer in the device region comprises MicroLED chips, wherein the MicroLED chips comprise a display region and an anti-reflection region, and wherein the forming the driving wafer comprises: forming a through hole connection structure at the position corresponding to the driving electrode in each device region on the front surface of the initial driving wafer; Forming an adhesive structure on the front surface of the initial driving wafer for forming the through hole connection structure along the direction pointing to the edge electrode area from the area with the first distance from the outer edge of the display area of the MicroLED chip; fixing the front surface of the initial driving wafer with the through hole connection structure with the support substrate or the temporary substrate through the bonding structure to obtain a bonding wafer structure; turning over the bonding wafer structure, and taking the supporting substrate or the temporary substrate as the bottom; And thinning the back of the initial driving wafer for forming the through hole connection structure, and forming a bonding pad on the back of the initial driving wafer after the thinning for forming the through hole connection structure to obtain the driving wafer.
12. 12. The method of claim 10, wherein the initial driving wafer in the device region comprises MicroLED chips, wherein the MicroLED chips comprise a display region and an anti-reflection region, and wherein the forming the driving wafer comprises: Forming an adhesive structure on the front surface of the initial driving wafer from a region which is at a first distance from the outer edge of the display region of the MicroLED chips along the direction pointing to the edge electrode region; fixing the front surface of the initial driving wafer with a supporting substrate or a temporary substrate through the bonding structure to obtain a bonding wafer structure; turning over the bonding wafer structure, and taking the supporting substrate or the temporary substrate as the bottom; Thinning the back surface of the initial driving wafer to obtain a thinned initial driving wafer; And forming a through hole connection structure and a bonding pad at the position corresponding to the driving electrode in each device region on the back of the thinned initial driving wafer to obtain the driving wafer.
13. 13. The method of forming a display module according to claim 11 or 12, wherein when the bonded wafer structure includes a temporary substrate, before forming the display module after the dicing process is performed based on the device region, the method further comprises: removing the temporary substrate and forming a color conversion layer on the display area of the MicroLED chip, or forming a color conversion layer on the display area of the MicroLED chip before the bonding wafer structure is obtained; When the bonded wafer structure includes a support substrate, a color conversion layer is formed on the display area of the MicroLED die prior to obtaining the bonded wafer structure.
14. 14. The method of forming a display module of claim 13, wherein when the bonded wafer structure includes a support substrate, the method further comprises, after the forming a drive wafer: And forming an anti-reflection structure on a plane of one side of the support substrate far away from the front surface of the driving wafer, wherein the vertical projection of the arrangement area of the anti-reflection structure covers the anti-reflection area and the area from the outer edge of the anti-reflection area to the outer edge of the driving wafer.
15. 15. The method of forming a display module according to claim 13, wherein forming a pad electrically connected to the via connection structure on the back surface of the driving wafer comprises: On the back plane of the driving wafer, a protruding bonding pad contacting with the through hole connection structure is formed, Or forming an embedded bonding pad contacted with the through hole connection structure on the back surface of the driving wafer.
16. 16. The method of claim 13, wherein the heat dissipation enhancing structure is formed at a position corresponding to the display area on the back surface of the driving wafer in synchronization with the formation of the bonding pad electrically connected to the via connection structure on the back surface of the driving wafer.
17. 17. The method of forming a display module according to claim 10, wherein forming a driving electrode in an edge electrode region of at least one side of each device region on the front surface of the initial driving wafer comprises: adjusting the driving circuit in each device region on the front surface of the initial driving wafer to form driving electrodes in the edge electrode region of at least one side of the device region, Or forming a driving electrode in the edge electrode area on at least one side of each device area in a rewiring mode on the front surface of the initial driving wafer.
18. 18. A display device comprising a display module according to any one of claims 1-9.
19. 19. An optoelectronic device comprising a display module according to any one of claims 1 to 9.
20. 20. A terminal comprising a display module according to any one of claims 1-9.

Description

Display module, forming method, related equipment and terminal Technical Field The embodiment of the invention relates to the technical field of photoelectric devices, in particular to a display module, a forming method, related equipment and a terminal. Background The display module is a core display and light-emitting device in the field of photoelectric devices. Such as MicroLED (Micro Light-Emitting Diode) display modules. MicroLED the display module is a modular display unit with independent driving and self-luminescence at pixel level, and has the characteristics of high brightness, high contrast, long service life, low power consumption and the like. The overall volume (Footprint) of the display module is one of its core design indexes, directly affecting the device integration level, manufacturing cost, performance and application scenario suitability. Therefore, how to provide the technical solution and reduce the overall volume of the display module becomes a technical problem to be solved. Disclosure of Invention In view of the above, embodiments of the present invention provide a display module, a forming method, a related device and a terminal, so as to reduce the overall volume of the display module. The embodiment of the invention provides a display module, which comprises: Driving the core particles; The driving core particle comprises a plurality of driving electrodes, wherein the driving electrodes are distributed on the front surface of the driving core particle, and the driving electrodes are arranged in an edge electrode area on at least one side of the driving core particle; the back surface of the driving core particle comprises a bonding pad corresponding to the driving electrode, wherein the bonding pad is electrically connected with the driving electrode corresponding to the bonding pad based on a through hole connection structure, and the bonding pad is used as a metal electrode for electrically connecting the display module with an external structure. Optionally, adjacent driving electrodes are arranged at intervals according to a preset electrode spacing, and the driving electrodes are arranged in at least one row or one column for the edge electrode area provided with the driving electrodes. Optionally, the display module further comprises MicroLED chips positioned on the front surface of the driving core particle, wherein the MicroLED chips and the driving core particle form a display panel, and the MicroLED chips comprise a display area and an anti-reflection area, wherein the anti-reflection area is positioned in an area between the display area and the edge electrode area on the projection of the driving core particle; The display module further comprises a supporting substrate and an adhesion structure positioned between the driving core particle and the supporting substrate; the adhesive structure is located on the front surface of the driving core particle, and an inner edge of the area of the adhesive structure is arranged at a first distance from an outer edge of the display area. Optionally, the display module further comprises a solder ball and/or a heat dissipation enhancing structure; The solder balls are arranged on each bonding pad; the heat dissipation enhancing structure is positioned on the back surface of the driving core particle, and the forming area of the heat dissipation enhancing structure corresponds to the display area; In the case that the display module comprises the heat dissipation enhancing structure, the heat dissipation enhancing structure further comprises a uniformly arranged solder ball array; Wherein the bonding pads include embedded bonding pads and protruding bonding pads. Optionally, the adhesive structure is located on the driving core particle in an area other than the display area, or an area between an inner edge of the edge electrode area and an outer edge of the display area; The bonding structure comprises bonding glue, a metal bonding layer or a combination thereof, and is an integral structure or a collection of a plurality of spacer bonding structures. Optionally, the preset electrode spacing is in a range of greater than or equal to 100 micrometers, the distance from the outer edge of the display area to the inner edge of the edge electrode area is greater than or equal to 50 micrometers and less than or equal to 2000 micrometers, the minimum width of the anti-reflection area is greater than or equal to 20 micrometers, the minimum value of the first distance is greater than or equal to 5 micrometers, and the minimum width of the bonding structure is greater than or equal to 20 micrometers. Optionally, the through hole connection structure comprises an adhesion barrier layer and a metal column, wherein the adhesion barrier layer is arranged on the inner wall of the through hole connection structure, the metal column is filled inside the adhesion barrier layer and is attached to the adhesion barrier layer, and the display module