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CN-121985660-A - Reinforcing plate, support, display module and packaging method of display module

CN121985660ACN 121985660 ACN121985660 ACN 121985660ACN-121985660-A

Abstract

The disclosure provides a reinforcing plate, a support, a display module and a packaging method of the display module, and belongs to the technical field of semiconductor preparation. The reinforcing plate comprises a reinforcing plate, wherein one surface of the reinforcing plate is provided with a step, the step comprises a top surface, a bottom surface and a first side surface connected with the top surface and the bottom surface, the top surface of the step comprises a welding surface, the bottom surface of the step comprises a limiting groove, the limiting groove comprises a second side surface, and a space exists between the first side surface and the second side surface. The packaging reliability can be effectively improved.

Inventors

  • LI HUI
  • ZHANG FANG
  • HONG XIYANG
  • DONG CHUAN
  • SUN ANQI
  • ZHANG JI

Assignees

  • 京东方华灿华汇智造(广东)有限公司

Dates

Publication Date
20260505
Application Date
20251211

Claims (10)

  1. 1. A stiffening plate, characterized in that one face of the stiffening plate has a step (130); The step (130) comprises a top surface (131), a bottom surface (132) and a first side surface (133) connecting the top surface (131) and the bottom surface (132); The top surface (131) of the step (130) comprises a welding surface (120), the bottom surface (132) of the step (130) comprises a limiting groove (110), the limiting groove (110) comprises a second side surface (111), and a space exists between the first side surface (133) and the second side surface (111).
  2. 2. A bracket is characterized by comprising a reinforcing plate (10) and a connecting piece (30); The stiffening plate (10) is the stiffening plate according to claim 1; A first end of the connecting piece (30) is connected with the welding surface (120).
  3. 3. The display module is characterized by comprising a reinforcing plate (10), a display chip (20) and a connecting piece (30); The stiffening plate (10) is a stiffening plate according to claim 1, the stiffening plate (10) comprising a first face and a second face opposite to the first face; The display chip (20) is positioned in the limit groove (110); the first end of the connecting piece (30) is respectively connected with the welding surface (120) and the display chip (20).
  4. 4. A display module according to claim 3, wherein the thickness of the display chip (20) is greater than the depth of the limiting groove (110).
  5. 5. A display module according to claim 3, characterized in that a gap (50) is present between the first side of the step (130) and the display chip (20).
  6. 6. A display module according to claim 3, wherein the display chip (20) comprises a display portion (210) and an electrode portion (220); the electrode part (220) is closer to the welding surface (120) than the display part (210), and the electrode part (220) is electrically connected with the connecting piece (30).
  7. 7. The display module of claim 6, wherein the connector (30) comprises a circuit board (310) and a flat cable (320); A first face of the first end of the circuit board (310) is connected with the soldering face (120); The first end of the flat cable (320) is connected with the second surface of the first end of the circuit board (310), and the second end of the flat cable (320) is connected with the electrode part (220); the distance from the top surface of the electrode part (220) to the second surface of the reinforcing plate (10) is equal to the distance from the second surface of the first end of the circuit board (310) to the second surface of the reinforcing plate (10).
  8. 8. The packaging method of the display module is characterized by comprising the following steps of: Providing a bracket, wherein the bracket is the bracket of claim 2; Providing solder paste and spraying the solder paste in the limit groove (110); Providing a display chip (20), and placing the display chip (20) into the limit groove (110) and fixing crystals.
  9. 9. The method of packaging of claim 8, wherein providing solder paste comprises: atomizing the molten SnAgCu alloy into liquid drops under the protection of argon; Cooling the droplets to obtain alloy particles; grinding and screening the alloy particles; Mixing the alloy particles with a soldering flux, wherein the proportion of the soldering flux is 8% -15%; and stirring the mixture of the alloy particles and the soldering flux in vacuum to obtain the solder paste.
  10. 10. The packaging method according to claim 8, characterized in that spraying the solder paste in the limiting groove (110) comprises: Setting the precision of the spraying thickness to +/-2 microns; And spraying the solder paste in an argon environment or a nitrogen environment.

Description

Reinforcing plate, support, display module and packaging method of display module Technical Field The disclosure belongs to the technical field of semiconductor preparation, and in particular relates to a reinforcing plate, a support, a display module and a packaging method of the display module. Background There is a display module, which is composed of micro light emitting diode chip packages. In the related art, the packaging process of the display module is mainly to bond the micro light emitting diode chip on the circuit board by using die bond adhesive, and after baking and curing, weld the metal wires on the bonding pads of the micro light emitting diode chip and the circuit board by using an ultrasonic hot-pressing bonding wire mode, so that the micro light emitting diode chip is electrically connected with the driving circuit on the circuit board. However, in the process of die bonding the micro light emitting diode chip, problems such as displacement and rotation are likely to occur. Disclosure of Invention The embodiment of the disclosure provides a reinforcing plate, a support, a display module and a packaging method of the display module, which can effectively improve packaging reliability. The technical scheme is as follows: in a first aspect, embodiments of the present disclosure provide a stiffening plate, one side of the stiffening plate having a step; The step comprises a top surface, a bottom surface and a first side surface connecting the top surface and the bottom surface; The top surface of step includes the welding face, the bottom surface of step includes the spacing groove, the spacing groove includes the second side, first side with there is the interval between the second side. In a second aspect, embodiments of the present disclosure provide a bracket comprising a stiffener and a connector; the reinforcing plate is the reinforcing plate of the first aspect; the first end of the connecting piece is connected with the welding surface. In a third aspect, an embodiment of the present disclosure provides a display module, including a reinforcing plate, a display chip, and a connecting member; The reinforcing plate is the reinforcing plate of the first aspect, and comprises a first surface and a second surface opposite to the first surface; the display chip is positioned in the limit groove; the first end of the connecting piece is respectively connected with the welding surface and the display chip. In one implementation of the disclosure, the thickness of the display chip is greater than the depth of the limiting groove. In one implementation of the present disclosure, a gap exists between the first side of the step and the display chip. In one implementation of the present disclosure, the display chip includes a display portion and an electrode portion; the electrode part is close to the welding surface compared with the display part, and the electrode part is electrically connected with the connecting piece. In one implementation of the present disclosure, the connector includes a circuit board and a flat cable; the first surface of the first end of the circuit board is connected with the welding surface; The first end of the flat cable is connected with the second surface of the first end of the circuit board, and the second end of the flat cable is connected with the electrode part; The distance from the top surface of the electrode portion to the second surface of the reinforcing plate is equal to the distance from the second surface of the first end of the circuit board to the second surface of the reinforcing plate. In a fourth aspect, an embodiment of the present disclosure provides a method for packaging a display module, including: providing a bracket, wherein the bracket is the bracket of the second aspect; Providing solder paste, and spraying the solder paste in the limit groove; Providing a display chip, placing the display chip into the limit groove and fixing the crystal. In one implementation of the present disclosure, a solder paste is provided, comprising: atomizing the molten SnAgCu alloy into liquid drops under the protection of argon; Cooling the droplets to obtain alloy particles; grinding and screening the alloy particles; Mixing the alloy particles with a soldering flux, wherein the proportion of the soldering flux is 8% -15%; and stirring the mixture of the alloy particles and the soldering flux in vacuum to obtain the solder paste. In one implementation of the present disclosure, spraying the solder paste in the limiting groove includes: Setting the precision of the spraying thickness to +/-2 microns; And spraying the solder paste in an argon environment or a nitrogen environment. The technical scheme provided by the embodiment of the disclosure has the beneficial effects that at least: The stiffening plate is used for providing a mounting foundation for the display chip and improving the structural strength of the display chip. Since one face of the reinfor