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CN-121985662-A - Integrated functional layer for light-emitting module, preparation method of integrated functional layer and light-emitting module

CN121985662ACN 121985662 ACN121985662 ACN 121985662ACN-121985662-A

Abstract

The invention discloses an integrated functional layer for a light-emitting module, a preparation method thereof and the light-emitting module, wherein a conductive circuit layer and an optical functional layer are integrated on the same insulating substrate, the optical functional layer at least comprises a reflecting area for improving the light utilization rate and a shading area for preventing light leakage, and the reflecting area and the shading area are positioned on the same structural layer. The structure of the light-emitting module is fundamentally simplified by replacing the traditional 5-layer structure which is separately arranged in a layering way through the one-layer integrated functional layer structure, the material types for manufacturing the light-emitting module are reduced, the production cost is reduced, complex procedures such as alignment and solidification in the processing process can be reduced, the production period is shortened, and meanwhile, the light-emitting module can meet the diversified demands of thinned and light-weight products.

Inventors

  • LI ZHI
  • HUANG KUN
  • Gou Haibing

Assignees

  • 深圳博诚信电子有限公司

Dates

Publication Date
20260505
Application Date
20260130

Claims (10)

  1. 1. An integrated functional layer for a light emitting module is characterized in that a conductive circuit layer and an optical functional layer are integrated on the same insulating substrate, the optical functional layer at least comprises a reflecting area for improving light utilization rate and a shading area for preventing light leakage, and the reflecting area and the shading area are located on the same structural layer.
  2. 2. The integrated functional layer for a light emitting module according to claim 1, wherein the thickness of the insulating substrate ranges from 5 μm to 2000 μm.
  3. 3. The integrated functional layer for a light emitting module according to claim 1, wherein the insulating substrate is any one of polyethylene terephthalate, polyvinyl chloride, polyimide, and epoxy glass cloth laminated board.
  4. 4. The integrated functional layer for a light emitting module according to claim 1, wherein the conductive wiring layer is formed by curing a printable conductive paste containing silver, copper or an alloy thereof.
  5. 5. The integrated functional layer for a light emitting module according to claim 1, wherein the reflective region is composed of a white high-reflectivity ink layer coated on the insulating substrate, and the light shielding region is composed of a dark high-reflectivity ink layer coated on the insulating substrate.
  6. 6. The integrated functional layer for a light emitting module as set forth in claim 5, wherein the white high reflectivity ink layer overlies the conductive trace layer and exposes only pads and connection terminal portions for electrical connection in the conductive trace area.
  7. 7. The integrated functional layer for a light emitting module according to claim 1 or 5, wherein the reflective region and the light shielding region are disposed on opposite surfaces of the insulating substrate, respectively.
  8. 8. A light emitting module comprising a light guide plate, a light emitting element provided on a light incident side of the light guide plate, and the integrated functional layer according to any one of claims 1 to 7; the light-emitting element is electrically connected to the conductive circuit layer region of the integrated functional layer, and the optical functional layer of the integrated functional layer is correspondingly arranged on the bottom surface and/or the side surface of the light guide plate.
  9. 9. The light-emitting module of claim 8, wherein a light shielding layer and a dust shielding layer are sequentially arranged above the light guide plate from bottom to top, the light shielding layer is in adhesive connection with the light guide plate, and the light guide plate is in adhesive connection with the light-emitting element.
  10. 10. A method of preparing an integrated functional layer for a light emitting module according to any one of claims 1 to 7, comprising the steps of: s1, providing an insulating substrate; s2, printing a conductive paste pattern on the first surface of the insulating substrate, and curing to form a conductive circuit layer area; S3, printing optical ink covering the conductive circuit layer area on the first surface of the insulating substrate to form at least a part of reflection area of the optical function layer, and precisely exposing a bonding pad and a connecting terminal in the conductive circuit layer area; and S4, printing shading ink on a second surface of the insulating substrate opposite to the first surface so as to form shading areas of the optical functional areas.

Description

Integrated functional layer for light-emitting module, preparation method of integrated functional layer and light-emitting module Technical Field The invention relates to the technical field of flexible printed circuit boards, in particular to an integrated functional layer for a light-emitting module, a preparation method of the integrated functional layer and the light-emitting module. Background In light emitting devices such as a backlight module (BLU) of a Liquid Crystal Display (LCD), an advertising light box, and various signboards, three core functional components are generally involved, namely a flexible circuit board (FPC) for carrying and electrically connecting with Light Emitting Diodes (LEDs), a reflective film for efficiently reflecting light back to a light emitting area to enhance brightness, and a light shielding film for preventing light from leaking from a non-display surface, and ensuring visual contrast or neat appearance. Currently, the mainstream technical solution generally adopts the functional components as independent physical layers, and the functional components are assembled by stacking and gluing. However, the conventional scheme has the obvious defects that the use of the multi-layer independent component increases the types and cost of materials, the manufacturing process of the multi-layer independent component involves complex procedures such as FPC processing, multi-layer lamination, multi-time alignment, solidification and the like, so that the production period is longer, and in addition, the overall thickness of the module is necessarily increased due to the multi-layer stacked structure, so that the increasingly urgent requirements for thinning and light-weight design of terminal products are difficult to meet. For this reason, improvements are necessary for the above-mentioned existing drawbacks. Disclosure of Invention The invention aims to provide an integrated functional layer for a light-emitting module, a preparation method of the integrated functional layer and the light-emitting module. The technical scheme for solving the technical problems is as follows: In a first aspect, the present invention provides an integrated functional layer for a light emitting module, in which a conductive circuit layer and an optical functional layer are integrated on the same insulating substrate, the optical functional layer includes at least a reflective region for improving light utilization and a light shielding region for preventing light leakage, and the reflective region and the light shielding region are located on the same structural layer. The invention has the beneficial effects that the FPC circuit board layer structure, the reflecting layer structure and the shading layer structure which are separately arranged in a layering way in the traditional structure are integrated on the same structure layer structure, so that the bonding layers for bonding the reflecting layer structure and the shading layer structure and the bonding layers for bonding the reflecting layer structure and the FPC circuit board layer structure are reduced, and the separately arranged reflecting layer structure and the shading layer structure are also reduced. That is, the present invention integrates a conventional FPC circuit board layer structure, which is separately layered, a reflective layer having a reflective illumination effect, 2 adhesive layers for adhesion, and a 5-layer structure having a light shielding layer having a light shielding effect, into a single integrated functional layer structure. The integrated functional layer can not only meet the function of a conductive circuit, but also meet the functions of reflection illumination and shading, namely, compared with a light-emitting module manufactured by a traditional four-layer structure, the light-emitting module structure has the advantages that the structure of the light-emitting module structure is simplified, the types of materials used for manufacturing the light-emitting module are reduced, the production cost is reduced, meanwhile, the structure is simplified, complex procedures such as alignment and solidification in the processing process can be reduced in the FPC processing process, the production period is shortened, in addition, the structure of the light-emitting module is simplified, and the product structure thickness of the light-emitting module can be reduced as a whole, so that the light-emitting module can meet the requirements of thin and light-weight product diversification. On the basis of the technical scheme, the invention can be improved as follows. Further, the thickness of the insulating substrate ranges from 5 μm to 2000 μm. The adoption of the further scheme has the beneficial effects that the light-emitting module can meet the requirement of an ultrathin structure and can be applied to an ultra-thick structure by adopting the insulating base material with the thickness of 5-2000 mu m. Further,