Search

CN-121985665-A - Display packaging structure and packaging method

CN121985665ACN 121985665 ACN121985665 ACN 121985665ACN-121985665-A

Abstract

The application relates to a display packaging structure and a packaging method, wherein a reflection and light isolation integrated structure is arranged on the top surface of a printed circuit board, light-emitting independent cavities which are arranged in a matrix form in the structure provide independent installation space for a light-emitting unit, a reflection layer on the inner side wall of the structure can form directional reflection on lateral light generated when the light-emitting unit works, so that the lateral light which is not used effectively originally is guided to a positive light-emitting direction, and the overall light-emitting efficiency of a display device is further improved, and meanwhile, a light isolation layer is covered on the top surface of the printed circuit board and is arranged around the light-emitting independent cavities, so that light propagation paths between adjacent light-emitting independent cavities can be physically blocked, light crosstalk between pixels caused by lateral light leakage is avoided, the contrast and color separation degree of a display picture are optimized, and the comprehensive improvement of display performance is realized.

Inventors

  • SHI SONG
  • ZHENG XI
  • LI BIBO
  • LI HANG
  • DAI JIAWEN

Assignees

  • 湖北芯映光电有限公司

Dates

Publication Date
20260505
Application Date
20260123

Claims (10)

  1. 1. A display package structure, comprising: a printed circuit board (6); the reflection and light isolation integrated structure is arranged on the printed circuit board (6) and comprises a plurality of luminous independent cavities (9), a reflecting layer (4) and a light isolation layer (5) which are arranged in a matrix; the light isolation layer (5) is arranged on the top surface of the printed circuit board (6), the light-emitting independent cavity (9) is arranged on the top surface of the light isolation layer (5), and the light reflection layer (4) is arranged on the inner side wall of the light-emitting independent cavity (9); The light isolation layer (5) is used for blocking light crosstalk between adjacent light-emitting independent cavities (9), and the light reflection layer (4) is used for reflecting side light of the light-emitting independent cavities (9) to a positive light-emitting direction.
  2. 2. The display package structure according to claim 1 wherein, The side wall of the reflecting layer (4) is arranged in an arc surface.
  3. 3. The display package structure according to claim 1 wherein, The reflection and light isolation integrated structure further comprises: The cambered surface glue group (3) is filled in the luminous independent cavity (9) and covers the inner side wall of the reflecting layer (4); The top surface of cambered surface gum group (3) has seted up light-emitting hole (10), light-emitting hole (10) are used for the adaptation to accomodate light-emitting unit (7).
  4. 4. The display package structure according to claim 1 wherein, The display packaging structure further includes: and the packaging layer (8) is covered on the top surface of the light isolation layer (5) and is used for filling a gap between the light-emitting unit (7) and the light-emitting independent cavity (9) and is used for covering the surface of the light-emitting unit (7).
  5. 5. The display package structure according to claim 1 wherein, The display packaging structure further includes: and a plurality of light emitting units (7) which are accommodated in the corresponding light emitting independent chambers (9) and are all mounted on the printed circuit board (6).
  6. 6. The packaging method of the display packaging structure is characterized by comprising the following steps of: forming cambered surface rubber groups (3) which are arranged in a matrix on the top surface of the bearing substrate (1) and serve as a basic structure of the luminous independent cavity (9); covering the surfaces of the bearing substrate (1) and the cambered surface rubber groups (3) with a light reflecting layer (4), and covering the surfaces of the light reflecting layer (4) with a light isolating layer (5), so that the cambered surface rubber groups (3), the light reflecting layer (4) and the light isolating layer (5) form a composite structure; Forming a placing window (11) by processing the top surfaces of the light isolation layer (5) and the cambered surface rubber group (3), inverting the composite structure and removing the reflecting layer (4) covered on the surface of the light isolation layer (5); And processing a light outlet (10) in the central area of each cambered surface rubber group (3), and installing the composite structure on the top surface of a printed circuit board (6) with a light-emitting unit (7).
  7. 7. The display of claim 6 a packaging method of a packaging structure of a device, it is characterized in that the method comprises the steps of, The cambered surface gum group (3) that forms the matrix arrangement in the top surface that bears substrate (1) is as the foundation structure of luminous independent cavity (9), include: Dispensing glue on the top surface of the bearing substrate (1) according to a preset matrix coordinate in a glue dispensing mode, naturally spreading the glue under the action of self surface tension and gravity to form a cambered surface glue group (3); And (3) curing the cambered surface rubber groups to fix the cambered surface outline, wherein the arrangement density of the cured cambered surface rubber groups (3) is matched with the array density of the light-emitting units (7).
  8. 8. The display of claim 6 a packaging method of a packaging structure of a device, it is characterized in that the method comprises the steps of, The surface of the bearing substrate (1) and the cambered surface micelle (3) is covered with the reflecting layer (4), and the surface of the reflecting layer (4) is covered with the light isolation layer (5), and the light isolation layer comprises: forming a uniform reflecting layer (4) on the top surface of the bearing substrate (1) and the outer surface of the cambered surface rubber group (3) in a spraying mode; the surface of the reflecting layer (4) is fully covered with the light isolation material by adopting a coating or dispensing mode, the light isolation layer (5) is formed after solidification, and the thickness of the light isolation layer (5) is higher than the height of the cambered surface micelle (3).
  9. 9. The display of claim 6 a packaging method of a packaging structure of a device, it is characterized in that the method comprises the steps of, The processing of light isolation layer (5) and cambered surface micelle (3) top surface forms places window (11), inverts composite construction and gets rid of reflector layer (4) that cover in light isolation layer (5) surface, includes: Grinding the top surfaces of the light isolation layer (5) and the cambered surface rubber group (3) by adopting grinding equipment, controlling the grinding depth to expose the top of the cambered surface rubber group (3), and forming a placing window (11) which is matched with the light emitting surface of the light emitting unit (7); separating the carrier substrate (1) from the composite structure by a dissociation process; The composite structure is inverted, the bottom surface of the light isolation layer (5) is upwards, the light reflection layer (4) covered on the surface of the light isolation layer (5) is removed in a grinding or polishing mode, and only the light reflection layer (4) on the outer surface of the cambered surface micelle (3) is reserved.
  10. 10. The display of claim 6 a packaging method of a packaging structure of a device, it is characterized in that the method comprises the steps of, The processing forms out light hole (10) at the central region of every cambered surface micelle (3) to install light isolation layer (5) in the top surface of printed circuit board (6) that has luminescence unit (7), include: a through light outlet hole (10) is formed in the central area of each cambered surface rubber group (3); Calibrating the positions of the printed circuit board (6) and the light emitting holes (10) through a visual recognition system, so that the light emitting units (7) on the printed circuit board (6) are in one-to-one correspondence with the plurality of light emitting holes (10); the printed circuit board (6) and the bottom surface of the light isolation layer (5) are precisely aligned and attached; And baking and curing the bonded structure in a vacuum environment to firmly combine the printed circuit board (6) and the light isolation layer (5).

Description

Display packaging structure and packaging method Technical Field The application relates to the field of LED display, in particular to a display packaging structure and a packaging method. Background At present, a small-pitch and high-brightness display technology has become a core development direction of the display field, and the MiP (Micro LED IN PACKAGE) and COB (Chip On Board) packaging technology is widely applied to various scenes such as indoor high-definition display, outdoor highlighting display, special environment display and the like by virtue of high-density integration, high-image-quality performance and the like. Along with the continuous improvement of the requirements of terminal application on display resolution, picture contrast and brightness, how to further optimize light utilization efficiency and reduce light loss while guaranteeing pixel isolation effect becomes a key requirement to be broken through in industry, and the iterative upgrading of related packaging structures in the direction of light control precision and light utilization efficiency is also promoted. In the related art, the mips and COB display devices all adopt a chip direct die bonding or a module integrated die bonding mode to realize pixel array arrangement, and in order to meet the pixel isolation requirement, an optical isolation structure is usually arranged between pixels so as to reduce the mutual interference of light rays. However, the light beads in the MiP packaging structure are directly fixed on the surface of the printed circuit board, the chips in the COB packaging structure are directly attached to the printed circuit board of the PCB, and a high proportion of lateral light can be generated in the working process of the light beads and the COB packaging structure, while the traditional optical isolation structure is focused on shading blocking among pixels, and the design of effectively recycling and utilizing lateral light is lacking, so that the lateral light is leaked to adjacent pixels to cause optical crosstalk, the contrast and the color separation degree of a display picture are influenced, or the light loss is caused by being directly absorbed by the shading structure, so that the effective light-emitting quantity of the front surface of the device is limited. Disclosure of Invention The application provides a display packaging structure and a packaging method, which can solve the technical problems that in the related art, the front luminous quantity is limited due to the fact that lateral light cannot be effectively recycled, light crosstalk is easy to occur among pixels, and further the contrast ratio, color separation degree and brightness of a display picture are affected. In a first aspect, an embodiment of the present application provides a display package structure, including: A printed circuit board; The reflection and light isolation integrated structure is arranged on the printed circuit board and comprises a plurality of luminous independent cavities, a reflecting layer and a light isolation layer which are arranged in a matrix; the light isolation layer is arranged on the top surface of the printed circuit board, the light-emitting independent cavity is arranged on the top surface of the light isolation layer, and the light reflection layer is arranged on the inner side wall of the light-emitting independent cavity; the light isolation layer is used for blocking light crosstalk between adjacent independent light-emitting cavities, and the light reflection layer is used for reflecting side light of the independent light-emitting cavities to a positive light-emitting direction. With reference to the first aspect, in one embodiment, a sidewall of the light reflecting layer is disposed in a cambered surface. With reference to the first aspect, in an implementation manner, the reflection and optical isolation integrated structure further includes: The cambered surface glue group is filled in the luminous independent cavity and covers the inner side wall of the reflecting layer; The top surface of cambered surface gum group has seted up the light-emitting aperture, the light-emitting aperture is used for the adaptation to accomodate the luminescence unit. With reference to the first aspect, in an implementation manner, the display packaging structure further includes: The packaging layer is covered on the top surface of the light isolation layer, fills a gap between the light-emitting unit and the light-emitting independent cavity and is used for covering the surface of the light-emitting unit. With reference to the first aspect, in an implementation manner, the display packaging structure further includes: And the plurality of light-emitting units are accommodated in the corresponding light-emitting independent cavities and are all mounted on the printed circuit board. In a second aspect, an embodiment of the present application provides a packaging method of a display packaging stru