CN-121985699-A - Packaging method of luminescent fiber and luminescent fiber

Abstract

The invention discloses a packaging method of luminescent fibers and the luminescent fibers. The packaging method comprises the steps of providing packaging glue, a pipe mold and a luminescent fiber substrate, placing the luminescent fiber substrate into the pipe mold, injecting the packaging glue into the pipe mold, solidifying the packaging glue, and removing the pipe mold to obtain the luminescent fiber with the packaging layer. The packaging layer is formed in an injection molding mode, compared with a dip-coating mode, in the injection molding process of the packaging adhesive, the luminescent fiber base material is in a relatively static state relative to the pipe mold, so that the problem that the packaging adhesive is easy to flow channels in a moving state can be effectively avoided, the density of the packaging adhesive at each part of the luminescent fiber base material is uniform, and the diameters of all parts of the formed luminescent fibers are the same. In addition, the through hole of the pipe mold forms an injection molding cavity, the packaging glue is injected into the pipe mold in an injection molding mode, the set injection molding pressure is formed, and the service life of the luminous fiber is long.

Inventors

• YU XINLIANG
• ZHAO CHENG
• SHAO QINGRU
• ZHANG JIAMING
• LI YAWEI

Assignees

• 歌尔股份有限公司

Dates

Publication Date

20260505

Application Date

20241031

Claims (10)

1. 1. A method of encapsulating a luminescent fiber, comprising: Providing packaging glue, a pipe mold and a luminous fiber base material; placing the luminescent fiber substrate into the tube mold; Injecting the packaging glue into the pipe mould and solidifying the packaging glue; and removing the pipe mould to obtain the luminescent fiber with the packaging layer.
2. 2. The method of packaging of claim 1, further comprising, prior to the step of injection molding the potting compound into the tube mold and curing: and defoaming the packaging adhesive.
3. 3. The packaging method according to claim 2, wherein the packaging adhesive is subjected to defoaming treatment by means of vacuumizing.
4. 4. The packaging method according to claim 1, wherein the packaging adhesive is at least one of silicone adhesive, epoxy adhesive and silicone adhesive.
5. 5. The packaging method according to claim 1, wherein the packaging adhesive is an organic silica gel, and the organic silica gel comprises polydimethylsiloxane and vinyl silicone oil.
6. 6. The packaging method according to claim 5, wherein the mass content of the polydimethylsiloxane is 50% -80% and the mass content of the vinyl silicone oil is 20% -50%.
7. 7. The packaging method according to claim 1, wherein in the step of injecting the packaging paste into the tube mold and curing, the packaging paste is cured at a temperature of 20 ℃ to 30 ℃ for 10 hours to 15 hours.
8. 8. The encapsulation method of claim 1, wherein the cured encapsulant has a hardness of greater than or equal to 35A, a coefficient of thermal expansion of less than or equal to 2.0 x 10 －5 /°c, and a volume resistance of greater than or equal to 1.0 x 10 16 Ω -cm.
9. 9. The method of packaging of claim 1, further comprising, prior to the step of providing the potting compound, the tube mold, and the luminescent fiber substrate: and cleaning the surface of the luminescent fiber substrate.
10. 10. A luminescent fiber, characterized in that it is encapsulated according to the encapsulation method as claimed in claims 1-9.

Description

Packaging method of luminescent fiber and luminescent fiber Technical Field The invention relates to the technical field of luminescent materials, in particular to a packaging method of luminescent fibers and the luminescent fibers. Background In the related art, the outermost layer of the light emitting fiber is generally provided with an encapsulation layer. The encapsulation layer can protect the electron injection layer, the light emitting layer and the hole injection layer and insulate the electron injection layer, the light emitting layer and the hole injection layer. In the preparation, the encapsulation layer is usually formed by dip coating. However, the encapsulation layer formed in this way has a small adhesion and is easily detached. Therefore, a new technical solution is needed to solve the above technical problems. Disclosure of Invention An object of the present invention is to provide a method for packaging a luminescent fiber and a novel technical solution for a luminescent fiber. According to a first aspect of the present invention, a method of encapsulating a luminescent fiber is provided. The packaging method comprises the following steps: Providing packaging glue, a pipe mold and a luminous fiber base material; placing the luminescent fiber substrate into the tube mold; Injecting the packaging glue into the pipe mould and solidifying the packaging glue; and removing the pipe mould to obtain the luminescent fiber with the packaging layer. Optionally, before the step of injecting the encapsulation glue into the pipe mold and curing, the method further comprises: and defoaming the packaging adhesive. Optionally, the packaging glue is defoamed in a vacuumizing mode. Optionally, the packaging adhesive adopts at least one of organic silica gel, epoxy resin adhesive and silicone resin adhesive. Optionally, the encapsulation adhesive adopts organic silica gel, and the organic silica gel comprises polydimethylsiloxane and vinyl silicone oil. Optionally, the mass content of the polydimethylsiloxane is 50% -80%, and the mass content of the vinyl silicone oil is 20% -50%. Optionally, in the step of injecting the encapsulation compound into the pipe mold and curing, the encapsulation compound is cured at a temperature of 20 ℃ to 30 ℃ for 10 hours to 15 hours. Optionally, the cured encapsulant has a hardness greater than or equal to 35A, a coefficient of thermal expansion less than or equal to 2.0X10 －5/DEG C, and a volume resistance greater than or equal to 1.0X10 16 Ω cm. Optionally, before the step of providing the potting compound, the tube mold and the luminescent fiber substrate, the method further comprises: and cleaning the surface of the luminescent fiber substrate. According to a second aspect of the present invention, there is provided a luminescent fiber. The luminescent fiber is encapsulated according to the encapsulation method of the invention. In the embodiment of the invention, the encapsulation layer is formed by adopting an injection molding mode, and compared with a dip-coating mode, the encapsulation glue is in a relatively static state relative to a pipe mould in the injection molding process, so that the problem that the encapsulation glue is easy to flow channels in a moving state can be effectively avoided, the density of the encapsulation glue at each part of the luminescence fiber substrate is uniform, and the diameters of all parts of the formed luminescence fibers are the same. In addition, the tube mold is adopted for injection molding, the luminous fiber base material is arranged in the tube mold, and the diameters of all parts in the axial direction of the tube mold are the same, so that the thickness uniformity of the encapsulation adhesive of all parts of the luminous fiber base material is further ensured, and the diameters of all parts of the formed luminous fibers are the same. In addition, the through hole of the pipe mold forms an injection molding cavity, the packaging glue is injected into the pipe mold in an injection molding mode, and the set injection molding pressure is formed, so that the compactness of the packaging glue is higher, the binding force between the cured packaging glue and the luminous fiber substrate is higher, and the packaging glue is not easy to fall off. The service life of the luminous fiber is long. Other features of the present invention and its advantages will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings. Drawings The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention. Fig. 1 is a flowchart of a method of encapsulating a luminescent fiber according to an embodiment of the invention. Fig. 2 is a schematic structural view of a luminescent fiber substrate accor