CN-121985723-A - Preparation method of high-temperature piezoelectric transducer and high-temperature piezoelectric transducer

Abstract

The application relates to the technical field of piezoelectric device preparation, in particular to a preparation method of a high-temperature piezoelectric transducer and the high-temperature piezoelectric transducer. The method comprises the steps of selecting a metal substrate and a piezoelectric element with matched sizes according to a using field Jing Xuqiu, polishing a bonding surface of the metal substrate and two electrode surfaces of the piezoelectric element respectively, printing electrode paste on the bonding surface and the two electrode surfaces, bonding the bonding surface with one electrode surface of the piezoelectric element, sintering until the electrode paste is solidified, forming a bonding electrode layer between the metal substrate and the piezoelectric element, forming the other electrode layer on one side of the piezoelectric element far away from the metal substrate, fixedly connecting the metal substrate and the piezoelectric element through the bonding electrode layer, carrying out polarization treatment on the sintered piezoelectric element, applying a polarization electric field through the two electrode layers in the polarization process, and connecting electrode leads on the two electrode layers respectively to obtain the high-temperature piezoelectric transducer.

Inventors

• WEI QIAN
• LIU BIN
• CONG JIANSHENG

Assignees

• 中国科学院声学研究所

Dates

Publication Date

20260505

Application Date

20260115

Claims (10)

1. 1. A method of manufacturing a high temperature piezoelectric transducer comprising: step 1, selecting a metal substrate and a piezoelectric element with adaptive sizes according to a use field Jing Xuqiu; step 2, polishing the bonding surface of the metal substrate and the two electrode surfaces of the piezoelectric element respectively; Step 3, printing electrode paste on the bonding surface and two electrode surfaces, bonding the bonding surface with one electrode surface of the piezoelectric element, and sintering until the electrode paste is solidified, forming a bonding electrode layer between the metal substrate and the piezoelectric element, forming the other electrode layer on one side of the piezoelectric element far away from the metal substrate, and fixedly connecting the metal substrate and the piezoelectric element through the bonding electrode layer; step 4, carrying out polarization treatment on the sintered piezoelectric element, and applying a polarization electric field through two electrode layers in the polarization process; And 5, connecting electrode leads on the two electrode layers respectively to obtain the high-temperature piezoelectric transducer.
2. 2. The method of manufacturing a high temperature piezoelectric transducer of claim 1, wherein the metal substrate is made of kovar.
3. 3. The method for manufacturing a high-temperature piezoelectric transducer according to claim 1, wherein the piezoelectric element is made of a piezoelectric ceramic or a piezoelectric single crystal, wherein the piezoelectric ceramic is selected from one of a lead zirconate titanate-based ceramic, a lead metaniobate-based ceramic, a lead titanate-based ceramic, and a bismuth scandium acid-lead titanate-based ceramic, and the piezoelectric single crystal is selected from one of a lead magnesium niobate-lead titanate piezoelectric single crystal, a lead indium niobate-lead magnesium niobate-lead titanate piezoelectric single crystal, and a lithium niobate piezoelectric single crystal.
4. 4. The method of claim 1, wherein the electrode paste comprises one or more of silver, platinum, silver-palladium alloy, gold, and copper.
5. 5. The method of manufacturing a high temperature piezoelectric transducer according to claim 1, wherein the electrode paste comprises one of silver and platinum as a raw material.
6. 6. The method of manufacturing a high temperature piezoelectric transducer according to claim 4 or 5, wherein the raw material of the electrode paste further comprises glass frit.
7. 7. The method of manufacturing a high temperature piezoelectric transducer according to claim 1, wherein the electrode paste is printed on the bonding surface and the two electrode surfaces, respectively, by screen printing.
8. 8. The method of manufacturing a high temperature piezoelectric transducer according to claim 1, wherein the thermal expansion coefficient of the metal substrate matches the thermal expansion coefficient of the piezoelectric element.
9. 9. The method for manufacturing a high-temperature piezoelectric transducer according to claim 1, wherein in the step 3, after the bonding surface is bonded to one electrode surface of the piezoelectric element, the metal substrate and the piezoelectric element are clamped by the clamping member and sintered until the electrode paste is solidified to form a bonding electrode layer and another electrode layer, and after the temperature is reduced to room temperature, the clamping member is removed, wherein the sintering is pressurized high-temperature sintering, and the sintering temperature, the sintering pressure and the sintering time are determined according to the material characteristics of the electrode paste.
10. 10. A high temperature piezoelectric transducer produced by the method of producing a high temperature piezoelectric transducer according to any one of claims 1 to 9.

Description

Preparation method of high-temperature piezoelectric transducer and high-temperature piezoelectric transducer Technical Field The application relates to the technical field of piezoelectric device preparation, in particular to a preparation method of a high-temperature piezoelectric transducer and the high-temperature piezoelectric transducer. Background The piezoelectric transducer is a functional device for realizing the mutual conversion of electric energy and mechanical energy by using piezoelectric materials. The piezoelectric transducer has the advantages of high response speed, good frequency response characteristic, high energy conversion efficiency, high sensitivity, simple structure, easy miniaturization and integration, and the like. By virtue of the above-mentioned excellent characteristics, the application of piezoelectric transducers is almost penetrating into every corner of modern technology, for example, the ultrasonic technical field is used for medical ultrasonic imaging, industrial nondestructive inspection, ultrasonic cleaning, and sonar systems, the sensing and measuring field is used for pressure sensors, acceleration sensors, vibration monitoring sensors, and the like, the precision driving and controlling field is used for piezoelectric motors, micro displacement systems, and the like, the energy collecting field, and the like. With the development of industrial fields such as aerospace, energy chemical industry, advanced manufacturing and the like, the requirement for piezoelectric transducers capable of stably working for a long time under a severe environment with high temperature (usually more than or equal to 250 ℃) is increasingly urgent. For example, the field of high-temperature process on-line monitoring is used for real-time sensing of vibration, temperature and pressure in an aeroengine/gas turbine, the field of deep resource exploration is used for acoustic logging and imaging of geothermal wells and ultra-deep oil wells, and the field of ultrasonic nondestructive testing and processing in a high-temperature environment is used for on-line flaw detection on thermal metal blanks, nuclear facility state monitoring and the like. Piezoelectric transducers for high temperature environmental applications face a serious set of technical challenges in the fabrication process. Such as high temperature failure of the piezoelectric material, high temperature also accelerates aging, depolarization of the piezoelectric material, and leads to dramatic deterioration of dielectric and piezoelectric properties. The problem of high-temperature electrode materials is that common silver electrodes can oxidize, migrate and even react with piezoelectric materials at high temperature, so that the common silver electrodes fail. Platinum, gold or some high temperature resistant alloys are required as electrodes, but are costly and adhesion is a problem. In addition, the bonding of the metal substrate to the piezoelectric element is also a major challenge in the high temperature piezoelectric transducer fabrication process. In order to achieve good mechanical coupling, heat dissipation and structural strength, high temperature piezoelectric transducers often require that the piezoelectric element (wafer or ceramic plate) be bonded or soldered to a metal substrate (e.g., stainless steel, titanium alloy, heat resistant alloy). The bonding or welding process has the following challenges that firstly, the adhesive scheme is adopted to solve the problem of high-temperature failure of the adhesive. The metal substrate and piezoelectric element are typically bonded together with an organic adhesive (e.g., epoxy). The existing organic adhesive cannot withstand high temperatures above 250 ℃ for a long time, and the adhesive strength can be lost at high temperatures for a long time. Even inorganic glue or special high-temperature glue has the problems of large brittleness, poor thermal matching property and the like. Secondly, the use of a welding scheme presents challenges. For example, the high temperatures required for soldering (typically well above the operating temperature) may subject the piezoelectric material to thermal processes beyond its tolerance limits, resulting in reduced or even damaged performance, elemental diffusion and chemical reactions between the piezoelectric material and the solder, metal substrate may occur at the high temperature soldering interface, forming brittle intermetallic layers, while significant residual stresses may be introduced into the piezoelectric element due to shrinkage differences during cooling, severely affecting its performance reliability and lifetime, and the uniformity, thickness and porosity of the soldering are difficult to control accurately, affecting the consistency and final performance of the transducer. In summary, the development of high temperature piezoelectric transducers is limited by the piezoelectric transducer fabrication process. Among t