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CN-121985742-A - Method for manufacturing dielectric film columnar graph

CN121985742ACN 121985742 ACN121985742 ACN 121985742ACN-121985742-A

Abstract

The invention discloses a method for manufacturing a dielectric film columnar graph, and relates to the technical field of semiconductor manufacturing processes. The invention adopts photosensitive glue as a sacrificial layer to manufacture the columnar graph of the first dielectric film, combines the high filling capacity of atomic layer deposition and the global planarization characteristic of chemical mechanical polishing, realizes the processing of the columnar graph with high precision and alternate staggering of the two dielectric films, uses a simple process to manufacture a high-requirement product under the limited equipment capacity, saves the input cost, ensures the critical dimension and the side wall sharpness of the columnar graph, and realizes zero damage to the substrate lamination.

Inventors

  • NING JIAQI
  • CHEN YINPEI

Assignees

  • 杭州美迪凯光电科技股份有限公司

Dates

Publication Date
20260505
Application Date
20260203

Claims (7)

  1. 1. The method for manufacturing the dielectric film columnar graph is characterized by comprising the following steps of: s1, coating a layer of photosensitive adhesive on the surface of a substrate in a gluing mode; S2, making a basic pattern by exposing and developing the photosensitive adhesive; S3, depositing a first dielectric film on the surface of the product by using an atomic deposition device with high filling capacity, and filling all grooves among photosensitive adhesives in the basic pattern; S4, removing the first dielectric film with the raised surface by a chemical mechanical polishing mode, and polishing the first dielectric film until the surface of the photosensitive adhesive is exposed; s5, ashing the exposed photosensitive adhesive by using a high-temperature ashing process to obtain a columnar pattern of the first dielectric film; S6, depositing a second dielectric film on the surface of the product by using an atomic deposition device with high filling capacity, and filling all grooves between the first dielectric films; and S7, removing the second dielectric film with the raised surface by a chemical mechanical polishing mode, polishing the second dielectric film until the surface of the first dielectric film is exposed, and finally polishing the surface of the product to obtain a columnar pattern with the alternately staggered two dielectric films.
  2. 2. The method for producing a dielectric film columnar pattern according to claim 1, wherein in the step S1, the thickness of the photosensitive paste is 360-400nm.
  3. 3. The method of claim 1, wherein in the step S2, the critical dimension of the basic pattern is 180nm, and the sidewall angle of the photosensitive paste in the basic pattern is 85 ° -95 °.
  4. 4. The method of fabricating a dielectric film columnar pattern according to claim 1, wherein in the step S3, the film thickness of the first dielectric film is 800-1000nm.
  5. 5. The method of claim 1, wherein in the step S4, after chemical mechanical polishing, the thickness of the first dielectric film is the same as the thickness of the photosensitive paste.
  6. 6. The method of fabricating a dielectric film pattern according to claim 1, wherein in the step S6, the thickness of the second dielectric film is 800-1000nm.
  7. 7. The method of fabricating a dielectric film columnar pattern according to claim 1, wherein in the step S7, the final thickness of each of the first dielectric film and the second dielectric film is 350nm.

Description

Method for manufacturing dielectric film columnar graph Technical Field The invention relates to the technical field of semiconductor manufacturing processes, in particular to the technical field of plasma membrane columnar graph processing processes, and particularly relates to a method for manufacturing a dielectric membrane columnar graph. Background The semiconductor industry is currently rapidly developing, the product types are more and more diversified, the requirements on the size and the precision of the patterned products are higher and higher, and the requirements on the processing technology are also more and more severe. There is a product demand in the semiconductor field for producing a columnar pattern of alternating dielectric films on a wafer that has been previously subjected to a foundation lamination. For the products, there are two general processes, one is to deposit a dielectric film first and then etch it by dry etching and then fill the second dielectric film, but the dry etching method has the problem of over etching and is easy to damage the already made lamination of the wafer, and the other is to use the stripping (liftoff) process to make the first dielectric film pattern, but the process is limited by a film plating mode and a photoresist removing mode, which can cause the abnormal angle of the columnar pattern to become a round table pattern finally, and the product requirement can not be met. The processing of the two kinds of dielectric film alternate staggered columnar patterns cannot meet the product requirement no matter whether a dry etching process or a liftoff process is used, so that in order to solve the problems, a target columnar pattern is made, and a photosensitive adhesive sacrificial method is needed to manufacture the dielectric film columnar pattern, so that the original lamination of the product is not damaged while the columnar pattern meets the product requirement. Disclosure of Invention The invention aims to provide a method for manufacturing a dielectric film columnar graph, aiming at the defects of the prior art. The invention aims at realizing the following technical scheme that the manufacturing method of the dielectric film columnar graph comprises the following steps: s1, coating a layer of photosensitive adhesive on the surface of a substrate in a gluing mode; S2, making a basic pattern by exposing and developing the photosensitive adhesive; S3, depositing a first dielectric film on the surface of the product by using an atomic deposition device with high filling capacity, and filling all grooves among photosensitive adhesives in the basic pattern; S4, removing the first dielectric film with the raised surface by a chemical mechanical polishing mode, and polishing the first dielectric film until the surface of the photosensitive adhesive is exposed; s5, ashing the exposed photosensitive adhesive by using a high-temperature ashing process to obtain a columnar pattern of the first dielectric film; S6, depositing a second dielectric film on the surface of the product by using an atomic deposition device with high filling capacity, and filling all grooves between the first dielectric films; and S7, removing the second dielectric film with the raised surface by a chemical mechanical polishing mode, polishing the second dielectric film until the surface of the first dielectric film is exposed, and finally polishing the surface of the product to obtain a columnar pattern with the alternately staggered two dielectric films. Preferably, in the step S1, the thickness of the photosensitive paste is 360-400nm. Preferably, in the step S2, the critical dimension of the basic pattern is 180nm, and the sidewall angle of the photosensitive paste in the basic pattern is 85 ° -95 °. Preferably, in the step S3, the film thickness of the first dielectric film is 800-1000nm. Preferably, in the step S4, after the chemical mechanical polishing, the thickness of the first dielectric film is the same as the thickness of the photosensitive paste. Preferably, in the step S6, the film thickness of the second dielectric film is 800-1000nm. Preferably, in the step S7, the final thickness of the first dielectric film and the second dielectric film is 350nm. The invention has the advantages that the photosensitive adhesive is adopted as the sacrificial layer to manufacture the columnar graph of the first dielectric film, the substrate damage caused by the use of the dry etching process is avoided, the possible graph deformation or residual problem in the stripping process is also overcome, the zero damage to the substrate lamination is realized while the critical dimension and the side wall sharpness of the columnar graph are ensured, the integral columnar graph is effectively ensured to be close to a columnar shape by ensuring the angle of the photosensitive adhesive to be close to 90 degrees, in addition, in the aspect of cost, the cost required by ashing the photosensitive a