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CN-121985752-A - Method for forming electronic device with reduced warpage

CN121985752ACN 121985752 ACN121985752 ACN 121985752ACN-121985752-A

Abstract

The present application provides a method for forming an electronic device. The method includes placing a substrate within a molding cavity of a molding die, the substrate having at least one electronic component mounted thereon, placing a molding material within the molding die, melting the molding material by microwave radiation and applying pressure to the molding material, filling the molding cavity with the molten molding material and encapsulating the substrate and the at least one electronic component with the molten molding material, and curing the molding material by microwave radiation to solidify it into a molded cap.

Inventors

  • YIN RUJUN
  • LI CHENGXUAN
  • LI XIXIU

Assignees

  • JCET星科金朋韩国有限公司

Dates

Publication Date
20260505
Application Date
20241029

Claims (13)

  1. 1. A method for forming an electronic device, the method comprising: placing a substrate in a molding cavity of a molding die, the substrate having at least one electronic component mounted thereon; placing a molding material within the molding die; melting the molding material by microwave radiation and applying pressure to the molding material, thereby filling the molding cavity with the molten molding material and encapsulating the substrate and the at least one electronic component with the molten molding material, and The molding material is cured by microwave radiation to solidify it into a mold cap.
  2. 2. The method of claim 1, wherein the molding die further comprises a loading chamber for containing the molding material prior to the molding material being melted and filled into the molding cavity, wherein the loading chamber is fluidly connected to the molding cavity through a fluid interface and a piston is contained in the loading chamber, the piston moving in response to an external pressing action.
  3. 3. The method of claim 2, wherein the step of placing molding material within the molding die comprises placing the molding material within the loading chamber, and wherein the step of melting the molding material and applying pressure to the molding material by microwave radiation comprises: Applying the microwave radiation to the molding material in the loading chamber, and When the microwave radiation is applied to the molding material, the piston is moved to reduce the volume of the loading chamber, thereby applying the pressure to melt the molding material, and the molten molding material is injected from the loading chamber into the molding cavity through the fluid interface.
  4. 4. The method of claim 1, wherein the molding die comprises an upper die portion and a lower die portion movable relative to one another and collectively defining the molding cavity.
  5. 5. The method of claim 4, wherein the step of placing molding material within the molding die comprises placing the molding material within the molding cavity, and wherein the step of melting the molding material and applying pressure to the molding material by microwave radiation comprises: applying the microwave radiation to the molding material within the molding cavity, and When the microwave radiation is applied to the molding material, the upper mold portion is moved toward the lower mold portion to reduce the volume of the molding cavity, thereby applying pressure to melt the molding material to fill the molding cavity with the molten molding material.
  6. 6. The method of claim 1, wherein the step of melting the molding material by microwave radiation is performed simultaneously with the step of applying pressure to the molding material.
  7. 7. The method of claim 1, wherein the microwave radiation is continuously applied during the steps of melting the molding material and solidifying the molding material.
  8. 8. The method of claim 1, wherein the molding material comprises a polar material.
  9. 9. The method of claim 1, wherein the step of melting the molding material by microwave radiation comprises applying the microwave radiation at a variable frequency.
  10. 10. The method of claim 1, wherein the step of curing the molding material by microwave radiation comprises applying the microwave radiation at a variable frequency.
  11. 11. The method of claim 1, wherein the step of curing the molding material by microwave radiation comprises applying the microwave radiation to heat the molding material to a temperature between 140 ℃ and 180 ℃.
  12. 12. The method of claim 1, wherein curing the molding material by microwave radiation comprises applying the microwave radiation for a duration of between 20 minutes and 2 hours.
  13. 13. An electronic device, characterized in that it is formed using the method according to any one of claims 1 to 12.

Description

Method for forming electronic device with reduced warpage Technical Field The present application relates generally to semiconductor technology, and more particularly, to a method for forming an electronic device with reduced warpage. Background The semiconductor industry has been faced with complex integration challenges as consumers desire their electronic devices to be smaller, faster, and more capable, and to package more and more functionality into a single device. In general, a semiconductor package may be formed by first mounting an electronic component onto a substrate via solder bumps, and then forming a mold cap on the substrate to encapsulate the electronic component. The forming of the mold cover may include a melting process for melting the molding material, and a solidifying process for solidifying the molten molding material into the mold cover. Both the melting process and the curing process may be performed by applying a heating process to the entire device. However, due to the mismatch in Coefficient of Thermal Expansion (CTE) between the different materials within the device, the process may cause warpage problems for the substrate and the mold lid, which may adversely affect device performance and subsequent manufacturing processes. Accordingly, a method for forming an electronic device with reduced warpage is needed. Disclosure of Invention It is an object of the present application to provide a method for forming an electronic device with reduced warpage. According to one aspect of the application, a method for forming an electronic device is provided. The method includes placing a substrate within a molding cavity of a molding die, the substrate having at least one electronic component mounted thereon, placing a molding material within the molding die, melting the molding material by microwave radiation and applying pressure to the molding material, filling the molding cavity with the molten molding material and encapsulating the substrate and the at least one electronic component with the molten molding material, and curing the molding material by microwave radiation to solidify it into a molded cap. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention. Furthermore, the accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention. Drawings The accompanying drawings, which are incorporated in and constitute a part of this specification. The features shown in the drawings illustrate only some embodiments of the application, but not all embodiments of the application, and should not be used to the contrary by the reader of the specification unless explicitly indicated otherwise. Fig. 1A to 1F show respective steps of a method for forming an electronic device according to a first embodiment of the present application. Fig. 2A to 2E show respective steps of a molding process of a method for forming an electronic device according to a second embodiment of the present application. Fig. 3 shows the steps of a method for forming an electronic device according to a third embodiment of the application. The same reference numbers will be used throughout the drawings to refer to the same or like parts. Detailed Description The following detailed description of exemplary embodiments of the application refers to the accompanying drawings, which form a part hereof. The drawings illustrate specific exemplary embodiments in which the application may be practiced. The detailed description, including the drawings, describes these embodiments in sufficient detail to enable those skilled in the art to practice the application. Those skilled in the art may further utilize other embodiments of the present application and with logic, mechanical, and other changes without departing from the spirit or scope of the application. The reader of the following detailed description is, therefore, not to be taken in a limiting sense, and only the appended claims define the scope of embodiments of the application. In the present application, the use of the singular includes the plural unless specifically stated otherwise. In the present application, the use of "or" means "and/or" unless stated otherwise. Furthermore, the use of the term "include" is not limiting. In addition, unless explicitly stated otherwise, terms such as "element" or "component" encompass both elements and components comprising one unit and elements and components comprising more than one subunit. In addition, the section headings used herein are for organizational purposes only and are not to be construed as limiting the subject matter described. As used herein, for ease of description, spatially relative terms, such as "under", "below", "above", "upper", "lower", "l