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CN-121985757-A - Control method for wafer bonding machine and wafer bonding machine

CN121985757ACN 121985757 ACN121985757 ACN 121985757ACN-121985757-A

Abstract

The invention discloses a control method for a wafer bonding machine and the wafer bonding machine, and relates to the technical field of wafer bonding processes. The wafer bonding machine comprises a vacuum conveying arm for conveying wafers and an adsorption mechanism for adsorbing the wafers, and is characterized in that the control method comprises the steps of obtaining the offset height of the wafers at the vacuum conveying arm at the transfer position, controlling the vacuum conveying arm to move upwards by the offset height, obtaining the vacuum degree of the adsorption mechanism, judging whether the vacuum degree is smaller than a standard value, and if so, controlling the vacuum conveying arm to move upwards continuously until the vacuum degree is larger than or equal to the standard value. The invention compensates the offset height of the wafer by controlling the rising height of the vacuum conveying arm, so that the adsorption mechanism can completely adsorb the wafer and improve the adsorption stability.

Inventors

  • Xia Zhengyin

Assignees

  • 上海新微技术研发中心有限公司

Dates

Publication Date
20260505
Application Date
20241029

Claims (10)

  1. 1. A control method for a wafer bonding machine including a vacuum transfer arm for transferring a wafer and an adsorption mechanism for adsorbing the wafer, the control method comprising the steps of: acquiring the offset height of the wafer at the vacuum transfer arm at the transfer position; controlling the vacuum transfer arm to move upwards by the offset height; Obtaining the vacuum degree of the adsorption mechanism; judging whether the vacuum degree is smaller than a standard value; If yes, the vacuum conveying arm is controlled to continue to move upwards until the vacuum degree is greater than or equal to the standard value.
  2. 2. The control method according to claim 1, wherein the step of determining that the suction mechanism and the wafer are not completely sucked, and controlling the vacuum transfer arm to continue the upward movement until the vacuum degree is equal to the standard value comprises: Controlling the vacuum conveying arm to move according to a preset unit upward movement amount; and detecting the vacuum degree every time the preset unit upward movement amount is moved until the vacuum degree is greater than or equal to the standard value.
  3. 3. The control method according to claim 2, wherein the step of controlling the movement of the vacuum transfer arm by a preset unit up-shift amount further comprises: judging whether the difference value between the vacuum degree and the standard value is larger than a first threshold value or not; If yes, setting the preset unit upward movement amount as a first unit upward movement amount; if not, setting the preset unit upward movement amount as a second unit upward movement amount, wherein the first unit upward movement amount is larger than the second unit upward movement amount.
  4. 4. A control method according to claim 3, wherein the step of controlling the vacuum transfer arm to continue to move upward until the vacuum degree is greater than or equal to the standard value further comprises: and storing the actual moving amount of the vacuum conveying arm when the vacuum degree is larger than or equal to the standard value, and taking the actual moving amount as the next upward moving amount of the vacuum conveying arm at the switching position.
  5. 5. The control method according to any one of claims 1 to 4, characterized in that the step of judging whether the vacuum degree is smaller than a standard value further comprises: if not, reducing the offset height to a corrected downward movement amount, storing the corrected downward movement amount, and taking the corrected downward movement amount as the next upward movement amount of the vacuum conveying arm at the switching position.
  6. 6. The control method according to claim 5, wherein, The amount of decrease in the offset height is determined based on the difference between the vacuum degree and the standard value.
  7. 7. The control method according to claim 6, wherein, The offset heights are predetermined according to experiments, and wafers with different specifications correspond to different offset heights.
  8. 8. The control method according to claim 1, wherein the step of controlling the vacuum transfer arm to continue the upward movement until the vacuum degree is equal to the standard value comprises: Judging whether the difference value between the vacuum degree and the standard value is larger than a second threshold value or not; If yes, controlling the vacuum conveying arm to move upwards at a first upward moving speed and monitoring the vacuum degree in real time; if not, controlling the vacuum conveying arm to move upwards at a second upward movement speed, and monitoring the vacuum degree in real time, wherein the first upward movement speed is greater than the second upward movement speed.
  9. 9. A wafer bonding machine for performing the control method of any one of claims 1-8, the wafer bonding machine comprising: A vacuum transfer arm for transferring a wafer to a loading zone, the vacuum transfer arm being configured to move in a first horizontal direction; The adsorption mechanism comprises a plurality of corrugated vacuum adsorption pipelines which are arranged at intervals along the first horizontal direction, the bottom surfaces of the vacuum adsorption pipelines are the same in height, and the adsorption mechanism is arranged in such a way that the vacuum conveying arm conveys the wafer to the loading area to adsorb the wafer.
  10. 10. The wafer bonding machine of claim 9, wherein the vacuum transfer arm comprises: And the adsorption end is positioned at the end part of the vacuum conveying arm and comprises a plurality of adsorption holes, and the adsorption holes are arranged at intervals relative to the peripheral edge of the wafer.

Description

Control method for wafer bonding machine and wafer bonding machine Technical Field The invention relates to the technical field of wafer bonding processes, in particular to a control method for a wafer bonding machine and the wafer bonding machine. Background The wafer bonding technology refers to that two wafers which are mirror polished and are homogeneous or heterogeneous are tightly combined through chemical and physical actions, and atoms of an interface react to form covalent bonds to be combined into a whole under the action of external force after the wafers are combined, so that the bonding interface reaches specific bonding strength. The bonding process used in the wafer bonding technology is of a plurality of types, and the specifications of the raw material wafers used in different bonding processes are different, for example, the specifications of the wafers include the weight, thickness, material and surface characteristics of the wafers. In the prior art, the adsorption area of the vacuum conveying arm of the wafer bonding machine is determined, and the conveying path of the vacuum conveying arm is fixed, namely, when the traditional vacuum conveying arm is used for receiving thicker wafers, the vacuum arm cannot be kept horizontal due to the influence of the weight of the wafers due to the increase of the weight of the wafers, the wafers are inclined at a certain angle, the adsorption mechanism which is vertically lowered in the subsequent conveying and receiving process cannot be tightly attached to the wafers, the adsorption force of the adsorption mechanism for adsorbing the wafers is lowered, so that vacuum faults are generated, and the process cannot be continued. Disclosure of Invention An object of the first aspect of the present invention is to provide a control method for a wafer bonding machine, which solves the technical problem of unstable adsorption when a single machine is used for transferring or transferring wafers with different specifications in the prior art. Another object of the first aspect of the present invention is to improve the control accuracy of the control method. An object of a second aspect of the present invention is to provide a wafer bonding machine for performing the above-mentioned control method. According to an object of a first aspect of the present invention, there is provided a control method for a wafer bonding machine including a vacuum transfer arm for transferring a wafer and an adsorption mechanism for adsorbing the wafer, the control method comprising the steps of: acquiring the offset height of the wafer at the vacuum transfer arm at the transfer position; controlling the vacuum transfer arm to move upwards by the offset height; Obtaining the vacuum degree of the adsorption mechanism; judging whether the vacuum degree is smaller than a standard value; If yes, the vacuum conveying arm is controlled to continue to move upwards until the vacuum degree is greater than or equal to the standard value. Optionally, the step of determining that the adsorption mechanism and the wafer are not completely adsorbed, and controlling the vacuum transfer arm to continue to move upwards until the vacuum degree is equal to the standard value includes: Controlling the vacuum conveying arm to move according to a preset unit upward movement amount; and detecting the vacuum degree every time the preset unit upward movement amount is moved until the vacuum degree is greater than or equal to the standard value. Optionally, before the step of controlling the movement of the vacuum transfer arm by a preset unit up-shift amount, the method further comprises: judging whether the difference value between the vacuum degree and the standard value is larger than a first threshold value or not; If yes, setting the preset unit upward movement amount as a first unit upward movement amount; if not, setting the preset unit upward movement amount as a second unit upward movement amount, wherein the first unit upward movement amount is larger than the second unit upward movement amount. Optionally, the step of controlling the vacuum transfer arm to move upwards until the vacuum degree is greater than or equal to the standard value further includes: and storing the actual moving amount of the vacuum conveying arm when the vacuum degree is larger than or equal to the standard value, and taking the actual moving amount as the next upward moving amount of the vacuum conveying arm at the switching position. Optionally, the step of determining whether the vacuum degree is smaller than a standard value further includes: if not, reducing the offset height to a corrected downward movement amount, storing the corrected downward movement amount, and taking the corrected downward movement amount as the next upward movement amount of the vacuum conveying arm at the switching position. Alternatively, the amount of decrease in the offset height is determined based on a difference between the vacuu