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CN-121985758-A - Bonding glue conveying control system

CN121985758ACN 121985758 ACN121985758 ACN 121985758ACN-121985758-A

Abstract

The application relates to a bonding glue conveying control system which comprises a glue tank, a buffer tank, a glue coating module, a vacuum module, a glue outlet module and a pressure stabilizing module, wherein the buffer tank can be selectively communicated with at least one of the glue tank, the glue coating module, the vacuum module, the glue outlet module and the pressure stabilizing module to have a first state, a second state and a third state, when the buffer tank is in the first state, a liquid inlet of the buffer tank is communicated with a conveying port of the glue tank, a second air inlet of the buffer tank is communicated with a negative pressure source, the first air inlet of the glue tank is communicated with a nitrogen source through the vacuum module, when the buffer tank is in the second state, a liquid outlet of the buffer tank is communicated with the glue coating module, and the second air inlet of the buffer tank is communicated with the nitrogen source through the pressure stabilizing module, so that the conveying process of glue solution is optimized, bubbles in the glue solution are effectively removed, and purity and uniformity of the glue solution are improved.

Inventors

  • WAN SHIYUAN
  • QIAN BIAO
  • HE YUSEN
  • SHEN DA

Assignees

  • 吾拾微电子(苏州)有限公司

Dates

Publication Date
20260505
Application Date
20251021

Claims (10)

  1. 1. A bond paste delivery control system, comprising: the adhesive tank is used for storing bonding adhesive and comprises a first air inlet and a conveying port, wherein the first air inlet is used for being connected with a nitrogen source; the buffer tank comprises a liquid inlet, a liquid outlet and a second air inlet, and the liquid inlet is connected with the conveying port; the gluing module is connected with the liquid outlet; One end of the vacuum module is connected with a vacuum source, and the other end of the vacuum module is connected with the cache tank through a second air inlet; one end of the glue outlet module is connected with a nitrogen source, and the other end of the glue outlet module is connected with the cache tank through a second air inlet; One end of the pressure stabilizing module is connected with a nitrogen source, the other end is connected with the cache tank through a second air inlet; the buffer tank is selectively communicated with at least one of the glue tank, the glue spreading module, the vacuum module, the glue discharging module and the voltage stabilizing module, so that the buffer tank has a first state, a second state and a third state; when the device is in the first state, a liquid inlet of the buffer tank is communicated with a conveying port of the glue tank, a second air inlet of the buffer tank is communicated with a negative pressure source, and a first air inlet of the glue tank is communicated with a nitrogen source through the vacuum module; when the glue dispenser is in the second state, a liquid outlet of the cache tank is communicated with the glue spreading module, and a second air inlet of the cache tank is communicated with a nitrogen source through the glue outlet module; and when the second air inlet of the buffer tank is in the third state, the second air inlet of the buffer tank is communicated with the nitrogen source through a voltage stabilizing module.
  2. 2. The bonding adhesive delivery control system of claim 1, further comprising a pneumatic valve connected between the buffer tank and the adhesive application module and a first switching valve connected to the pneumatic valve for controlling the on or off of the pneumatic valve.
  3. 3. The bond paste delivery control system of claim 2, further comprising a first bi-directional flow valve connecting the first switch valve with the pneumatic valve via a first line and a second bi-directional flow valve connecting the first switch valve with the pneumatic valve via a second line, the first bi-directional flow valve configured to shut off the pneumatic valve, the second bi-directional flow valve configured to suck back after the pneumatic valve is shut off.
  4. 4. The bond paste delivery control system according to claim 3, wherein said pneumatic valve comprises an inlet and an outlet, a first spool disposed within a first chamber and a second spool disposed within a second chamber, and a first opening in communication with the first chamber and a second opening in communication with the second chamber, said first bi-directional flow valve in communication with said first opening and said second bi-directional flow valve in communication with said second opening, said first spool and second spool being movable relative to said inlet under an external force such that said inlet is in communication with or is blocked from said outlet.
  5. 5. The bond paste delivery control system of claim 4, further comprising a source of cleaning gas coupled to the first on-off valve.
  6. 6. The bonding adhesive delivery control system according to claim 1, wherein the vacuum module comprises a vacuum connection pipe, a first electromagnetic valve and a total connection pipe, wherein the first electromagnetic valve and the total connection pipe are arranged on the vacuum connection pipe, one end of the vacuum connection pipe is connected with a vacuum source, the other end of the vacuum connection pipe is connected with the total connection pipe, the other end of the total connection pipe is connected with a second air inlet of a buffer tank, and the first electromagnetic valve is used for enabling the buffer tank to be connected with or disconnected from the vacuum source.
  7. 7. The bonding adhesive delivery control system according to claim 6, wherein the adhesive outlet module comprises an adhesive outlet connecting pipe, a second electromagnetic valve, a pressure regulating valve belt meter and a first branch pipe, wherein the second electromagnetic valve, the pressure regulating valve belt meter and the first branch pipe are arranged on the adhesive outlet connecting pipe, one end of the adhesive outlet connecting pipe is connected with the nitrogen source, the other end of the adhesive outlet connecting pipe is connected with the first branch pipe, the other end of the first branch pipe is connected with the total connecting pipe, and the second electromagnetic valve is used for enabling the nitrogen source to be communicated with or disconnected from the cache tank.
  8. 8. The bonding adhesive delivery control system according to claim 7, wherein the pressure stabilizing module comprises a pressure stabilizing connecting pipe, a third electromagnetic valve, a pressure regulating valve and a speed regulating valve, wherein the third electromagnetic valve is arranged on the pressure stabilizing connecting pipe, one end of the pressure stabilizing connecting pipe is connected with the nitrogen source, and the other end of the pressure stabilizing connecting pipe is connected with the first branch pipe.
  9. 9. The bonding adhesive delivery control system of any of claims 1-8, wherein the adhesive canister further comprises an air vent and a ball valve disposed on the air vent.
  10. 10. The bonding adhesive delivery control system of any one of claims 1-8, further comprising a liquid level detection module comprising a first liquid level detection member, a second liquid level detection member, a third liquid level detection member, and a fourth liquid level detection member sequentially disposed on the buffer tank from top to bottom.

Description

Bonding glue conveying control system Technical Field The application relates to the technical field of wafer bonding treatment, in particular to a bonding adhesive conveying control system. Background In the fields of electronic packaging, chip manufacturing and the like, the conveying and control of bonding glue have important influences on product quality and production efficiency. However, the conventional bonding adhesive conveying system lacks control of adhesive supplementing, adhesive coating and pressure stabilizing of bonding adhesive, limits the improvement of the production efficiency of the wafer and the optimization of the product quality, Accordingly, there is a need for an improvement over the prior art to overcome the deficiencies described in the prior art. Disclosure of Invention Accordingly, in order to solve at least one of the problems in the prior art, an embodiment of the present application provides a bonding adhesive delivery control system, comprising: the adhesive tank is used for storing bonding adhesive and comprises a first air inlet and a conveying port, wherein the first air inlet is used for being connected with a nitrogen source; the buffer tank comprises a liquid inlet, a liquid outlet and a second air inlet, and the liquid inlet is connected with the conveying port; the gluing module is connected with the liquid outlet; One end of the vacuum module is connected with a vacuum source, and the other end of the vacuum module is connected with the cache tank through a second air inlet; one end of the glue outlet module is connected with a nitrogen source, and the other end of the glue outlet module is connected with the cache tank through a second air inlet; One end of the pressure stabilizing module is connected with a nitrogen source, the other end is connected with the cache tank through a second air inlet; the buffer tank is selectively communicated with at least one of the glue tank, the glue spreading module, the vacuum module, the glue discharging module and the voltage stabilizing module, so that the buffer tank has a first state, a second state and a third state; when the device is in the first state, a liquid inlet of the buffer tank is communicated with a conveying port of the glue tank, a second air inlet of the buffer tank is communicated with a negative pressure source, and a first air inlet of the glue tank is communicated with a nitrogen source through the vacuum module; when the glue dispenser is in the second state, a liquid outlet of the cache tank is communicated with the glue spreading module, and a second air inlet of the cache tank is communicated with a nitrogen source through the glue outlet module; and when the second air inlet of the buffer tank is in the third state, the second air inlet of the buffer tank is communicated with the nitrogen source through a voltage stabilizing module. Optionally, the above bonding adhesive conveying control system further includes a pneumatic valve connected between the buffer tank and the adhesive coating module, and a first switching valve connected to the pneumatic valve, where the first switching valve is used to control on or off of the pneumatic valve. Optionally, in the above bonding adhesive delivery control system, the control system further includes a first bidirectional flow valve and a second bidirectional flow valve, the first bidirectional flow valve connects the first switch valve and the pneumatic valve through a first pipeline, the second bidirectional flow valve connects the first switch valve and the pneumatic valve through a second pipeline, the first bidirectional flow valve is configured to stop the pneumatic valve, and the second bidirectional flow valve is configured to suck back after the pneumatic valve is stopped. Optionally, in the bonding adhesive conveying control system, the pneumatic valve includes an inlet, an outlet, a first valve core disposed in the first chamber, a second valve core disposed in the second chamber, a first opening communicated with the first chamber, and a second opening communicated with the second chamber, the first bidirectional flow valve is communicated with the first opening, the second bidirectional flow valve is communicated with the second opening, and the first valve core and the second valve core can move relative to the inlet under the action of external force so that the inlet is communicated with or blocked from the outlet. Optionally, the bonding adhesive conveying control system further comprises a cleaning gas source connected with the first switch valve. Optionally, the above-mentioned bonding is glued and is carried control system, the vacuum module includes vacuum connecting pipe and sets up first solenoid valve and the total connecting pipe on the vacuum connecting pipe, and the vacuum source is connected to the one end of vacuum connecting pipe, the other end with the total connecting pipe is connected, the total connecting pipe other end is