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CN-121985760-A - Wafer cleaning manufacturing unit with double-height belt sheets for synchronous transposition and scheduling method

CN121985760ACN 121985760 ACN121985760 ACN 121985760ACN-121985760-A

Abstract

The invention relates to the technical field of semiconductor chips, and particularly discloses a wafer cleaning and manufacturing unit with double-height synchronous transposition and a dispatching method, which comprise an equipment shell, an equipment frame, an electric control device and a motion control device arranged on the equipment frame, wherein the equipment shell is provided with a plurality of wafer cleaning and manufacturing units; the equipment shell is movably connected and fixed with the equipment frame through a plurality of positions, the motion control device comprises a material box lifting table, a UV glue removing bin, a wafer grabbing arm, a pre-alignment Ji Tai, a cleaning bin, a waste water tank and an upper group of conveying arms and a lower group of conveying arms, the UV glue removing bin is fixedly arranged in the middle of the material box lifting table, the wafer grabbing arm is used for transferring wafers among the material box, the UV glue removing bin and the pre-alignment table, the pre-alignment table is of a double-frame opposite motion structure, and the cleaning bin is a main beat bottleneck station of the system so as to solve the technical problems of low beat efficiency, high motion interference risk and poor scheduling coordination of the existing equipment.

Inventors

  • JIANG DAOMING
  • SUN TIEBIN
  • CAI LIRONG
  • LIU XIAO

Assignees

  • 上海倍弗仑半导体设备有限公司

Dates

Publication Date
20260505
Application Date
20260126

Claims (10)

  1. 1. The wafer cleaning manufacturing unit with the double-height synchronous transposition is characterized by comprising an equipment shell (1), an equipment frame (22), an electric control device and a motion control device arranged on the equipment frame (22); The motion control device comprises a material box lifting table (13), a UV glue removing bin (14), a wafer grabbing arm (16), a pre-alignment table (15), a cleaning bin (19), a waste water tank (21) and an upper group of carrying arms and a lower group of carrying arms; The middle part of the material box lifting table (13) is fixedly provided with a UV (ultraviolet) glue removing bin (14), and the wafer grabbing arm (16) is used for transferring wafers among the material box, the UV glue removing bin (14) and a pre-alignment table (15), wherein the pre-alignment table (15) is of a double-frame opposite movement structure; The cleaning bin (19) is a main beat bottleneck station of the system, a cleaning bin lifting device (27), a cleaning motor (26), an air slip ring (25), a ceramic vacuum cleaning table (23), a workpiece centrifugal force gripper (24) and a cleaning swing arm (20) are arranged in the cleaning bin (19), the ceramic vacuum cleaning table (23) is provided with capillary holes and is connected with a vacuum system through the air slip ring (25), the cleaning swing arm (20) is driven by a swing arm motion control device and is provided with a two-fluid nozzle, a waste water tank (21) is arranged below the cleaning bin (19), and the waste water tank (21) is communicated with an air draft and drainage interface (12); the upper and lower groups of carrying arms are sequentially arranged on the equipment frame (22) from top to bottom and are of an equivalent parallel transfer structure; The upper carrying arm adopts a single-cylinder vertical driving structure and has a first fixed safe standby height, the lower carrying arm adopts a two-section double-cylinder vertical driving structure and has a second fixed safe standby height, and a fixed height difference exists between the first fixed safe standby height and the second fixed safe standby height to form a three-dimensional geometric avoidance transposition window.
  2. 2. The wafer cleaning and manufacturing unit with the double-height synchronous transposition is characterized in that a universal wheel and a damping foot pad are arranged at the lower end of a device frame (22), a material box taking and placing door (4) is arranged at the front end of a device shell (1), a touch screen industrial personal computer (2) is arranged above the material box taking and placing door (4), a control button panel (3) is arranged on the right side, an alarm lamp (6) is arranged at the top of the device shell (1), an air draft and drainage interface (12) is arranged at the rear end of the device shell, and an electric control box (8), a pressure surface plate (9), an air inlet and water inlet main valve joint (11), a valve island (10) and a liquid flowmeter panel (7) are arranged on the left side.
  3. 3. The wafer cleaning manufacturing unit with the double-height synchronous transposition of the wafer sheets according to claim 1, wherein the electric control device comprises an electric control box (8) and a matched control cable, the electric control box (8) brings a cleaning bin (19), a pre-alignment table (15) and an upper conveying arm and a lower conveying arm into a unified state machine locking control domain, and defines the cleaning bin (19) as a main beat bottleneck resource of a system, so that centralized control and scheduling of actions of all components are realized.
  4. 4. The wafer cleaning manufacturing unit with the double-height synchronous transposition is characterized in that the left end of the material box taking and placing door (4) is movably connected with the inner surface of the equipment shell (1), the right end of the touch screen industrial personal computer (2) is movably connected with the inner surface of the material box taking and placing door (4), the control button panel (3) is fixedly arranged with the inner surface of the material box taking and placing door (4), and the control button panel (3) comprises an on-off button, an emergency stop button, a maintenance mode button and a USB interface.
  5. 5. The wafer cleaning manufacturing unit with the double-height synchronous transposition is characterized in that 2 observation doors (5) are arranged on the right side of the equipment shell (1), the right ends of the observation doors (5) are movably connected with the inner surface of the equipment shell (1), the liquid flowmeter panel (7) is fixedly arranged on the inner surface of the equipment shell (1) and used for displaying various liquid flow data in real time, and the pressure meter panel (9) is used for monitoring system pressure parameters.
  6. 6. The wafer cleaning manufacturing unit with the double-height synchronous transposition of the wafer with the double-height synchronous transposition of the wafer with the wafer cleaning manufacturing unit is characterized in that the cleaning bin lifting device (27) drives the ceramic vacuum cleaning table (23) to lift through an air cylinder and a guide rod, the cleaning motor (26) is connected with a lifting mechanism of the cleaning bin lifting device (27), the pneumatic slip ring (25) and the ceramic vacuum cleaning table (23) are driven to synchronously rotate, and the centrifugal workpiece gripper (24) is arranged around the ceramic vacuum cleaning table (23) and can fasten the wafer under the centrifugal force.
  7. 7. The wafer cleaning and manufacturing unit with the double-height synchronous transposition of the wafer cleaning and manufacturing unit is characterized in that the upper carrying arm comprises an upper carrying arm vacuum chuck arm and an upper carrying arm horizontal movement control device, the upper carrying arm vacuum chuck arm is provided with an upper carrying arm vertical cylinder, the upper carrying arm horizontal movement control device drives horizontal movement through a linear cylinder and a guide rail, the lower carrying arm comprises a lower carrying arm vacuum chuck arm and a lower carrying arm horizontal movement control device, the lower carrying arm vacuum chuck arm is provided with a two-section lower carrying arm vertical cylinder, and the lower carrying arm horizontal movement control device drives horizontal movement through the linear cylinder and the guide rail.
  8. 8. A dual-height tape tab synchronous transposition scheduling method based on the wafer cleaning manufacturing unit as claimed in any one of claims 1-7, characterized by comprising the following steps: Firstly, judging transposition triggering conditions, namely opening a transposition window when the system simultaneously meets the following three conditions, namely stopping working of a cleaning motor (26) in a cleaning bin (19), completely stopping rotation of a ceramic vacuum cleaning table (23), opening a double frame of a pre-alignment table (15) in an unclamped state without wafer occupation, lifting an upper conveying arm to a first fixed safe standby height, and lifting a lower conveying arm to a second fixed safe standby height; The method comprises the steps of performing synchronous transposition of double-height belt sheets, namely performing a LIFT stage according to three stages of LIFT-SWAP-PLACE after a transposition window is opened, wherein an upper carrying arm and a lower carrying arm are respectively kept at a first fixed safe standby height and a second fixed safe standby height and are in a wafer clamping state; After initialization, a wafer grabbing arm (16) transfers the wafer in the material box to a pre-alignment table (15) for positioning, after the transposition condition is met, the positioned wafer is transferred to a cleaning bin (19) through synchronous transposition, the cleaning bin (19) starts a core cleaning process, in the cleaning process of the cleaning bin (19), the wafer grabbing arm (16) synchronously transfers the next wafer to the pre-alignment table (15) for positioning, so that the dual-wafer parallel operation is realized, the cleaned wafer is transferred back to the pre-alignment table (15) through synchronous transposition, and then transferred to a UV glue removing bin (14) for de-colloid by the wafer grabbing arm (16), and finally returned to the material box, so that the circulating flow beat is formed; And step four, system-level interlocking control, namely, the electric control box (8) monitors the transposition triggering condition in real time based on the state machine lock control domain logic, and forbids to execute transposition action when any condition is not met.
  9. 9. The dual-height belt synchronous transposition scheduling method is characterized in that the core cleaning process of the cleaning bin (19) comprises the steps that a cleaning bin lifting device (27) drives a ceramic vacuum cleaning table (23) to descend to a cleaning position, a vacuum system enables the ceramic vacuum cleaning table (23) to adsorb wafers through an air slip ring (25), a cleaning motor (26) drives the ceramic vacuum cleaning table (23) to rotate, a workpiece centrifugal force gripper (24) fastens the wafers, a cleaning swing arm (20) swings and sprays cleaning agents through a two-fluid nozzle, and cleaning wastewater is discharged through a wastewater tank (21) and an air suction and drainage interface (12).
  10. 10. The dual-height tape piece synchronous transposition scheduling method is characterized in that the material box lifting platform (13) drives the material box bearing lifting platform to vertically move through the cooperation of a motor, a screw rod, a guide rail, a belt and a belt pulley to transfer a wafer to a clamping position of a wafer grabbing arm (16), and the pre-alignment platform (15) controls the dual-frame to oppositely move through the motor, the screw rod and the guide rail to realize positioning and clamping of the wafer.

Description

Wafer cleaning manufacturing unit with double-height belt sheets for synchronous transposition and scheduling method Technical Field The invention relates to the technical field of semiconductor chips, in particular to a wafer cleaning and manufacturing unit with double height belt sheets for synchronous transposition and a scheduling method. Background In the manufacturing process of semiconductor chips, wafer cleaning is an important intermediate process link, and the purpose of the wafer cleaning is to remove residual photoresist, particle impurities, metal ions and organic pollutants on the surface of the wafer, so that the precision and yield of subsequent processes such as photoetching, etching, deposition and the like are directly affected. With the development of semiconductor technology toward 12-inch and smaller-sized wafers and high-density integration, higher requirements are being placed on the degree of automation, operating efficiency, operation stability and safety of wafer cleaning equipment. At present, the existing full-automatic wafer cleaning equipment mostly adopts a single-handling arm transfer structure, namely, the transfer operation of the wafer among work stations such as a material box, a pre-alignment table, a cleaning bin and the like is completed through the single-handling arm. The equipment has obvious bottleneck that a cleaning bin is used as a core process station, a certain cleaning time (such as 30 seconds and more) is usually needed, and a single carrying arm needs to return to take the next wafer in an idle load after the cleaning and transferring of one wafer are completed, so that the time for replacing the wafer is too long, the overall beat efficiency is low, and the requirement of large-scale mass production on throughput capacity is difficult to meet. For improving efficiency, partial equipment tries to adopt a double-handling-arm parallel transfer scheme, but the existing double-handling-arm structure is mostly arranged at the same height, and an effective motion interference avoidance design is lacked. In the synchronous transposition process of the belt sheets, the horizontal movement tracks of the two conveying arms are easy to overlap, interference is avoided through complex time sequence control, the complexity of a control system is increased, the risk of equipment collision and wafer damage caused by time sequence matching errors exists, and safety and reliability are insufficient. Meanwhile, the dispatching logic of the existing double-handling-arm equipment is mostly in decentralized control, a unified state machine locking control mechanism is not established by taking a cleaning bin as a core bottleneck resource, the action coordination of each station is poor, the problems of station conflict, beat disorder and the like are easy to occur, and the exertion of the advantage of parallel operation is further restricted. In addition, there is also room for optimization of structural integrity and functionality of existing wafer cleaning equipment. The distribution of parts such as the material box taking and placing, the operation control, the parameter monitoring and the like of partial equipment is not beneficial to the convenient operation and equipment maintenance of operators, the wafer clamping stability and the cleaning liquid spraying and covering uniformity in the cleaning bin, the waste water and waste gas discharging efficiency are also directly influenced, and the cleaning effect and the equipment operation environment are also directly influenced. Meanwhile, the state monitoring and alarming mechanism in the running process of the equipment is not perfect enough, the faults are difficult to respond quickly, and the risk of production interruption is increased. Therefore, a wafer cleaning manufacturing unit and a scheduling method for synchronous transposition of double-height band sheets are provided, so that the technical problems of low beat efficiency, high risk of motion interference and poor scheduling cooperativity of the conventional equipment are solved. Disclosure of Invention The invention aims to provide a wafer cleaning manufacturing unit with double height belt sheets for synchronous transposition and a scheduling method thereof, so as to solve the problems in the prior art. In order to achieve the above purpose, the present invention adopts the following technical scheme: A wafer cleaning manufacturing unit with double height belt sheets for synchronous transposition and a dispatching method thereof comprise an equipment shell, an equipment frame, an electric control device and a motion control device arranged on the equipment frame; The motion control device comprises a material box lifting table, a UV glue removing bin, a wafer grabbing arm, a pre-couple Ji Tai, a cleaning bin, a waste water tank and an upper group of carrying arms and a lower group of carrying arms; the middle part of the material box lifting table is fixedly