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CN-121985765-A - Wafer mapping mechanism and wafer storage system

CN121985765ACN 121985765 ACN121985765 ACN 121985765ACN-121985765-A

Abstract

The application discloses a wafer mapping mechanism and a wafer storage system, which comprise a bottom plate, a top plate, a connecting rod assembly and a driver, wherein the top plate comprises a first connecting part, a transmitting part and a receiving part, the first connecting part is arranged opposite to the bottom plate, the transmitting part and the receiving part are oppositely arranged on the same side of the first connecting part, the transmitter and the receiver are respectively arranged in opposite sides of the transmitting part and the receiving part, the connecting rod assembly comprises a first connecting rod and a second connecting rod, the bottom ends of the first connecting rod and the second connecting rod are respectively and rotatably arranged on two sides of the bottom plate, the top ends of the first connecting rod and the second connecting rod are respectively and fixedly connected with the two ends of the first connecting part, the driver is at least arranged on one side of the top surface of the bottom plate, and a driving shaft of the driver is rotatably connected with the bottom ends of the first connecting rod or the second connecting rod. The transmitting part and the receiving part fixed on the same top plate can always maintain an accurate alignment relationship, so that the problem of difficult alignment caused by that two sensors are respectively arranged on different moving parts is avoided, and the reliability and the accuracy of wafer mapping data are obviously improved.

Inventors

  • LI NINGNING

Assignees

  • 北京京仪自动化装备技术股份有限公司

Dates

Publication Date
20260505
Application Date
20260205

Claims (10)

  1. 1. A wafer mapping mechanism, comprising: A bottom plate; The top plate comprises a first connecting part, a transmitting part and a receiving part, and the first connecting part is arranged opposite to the bottom plate; the transmitting part and the receiving part are oppositely arranged on the same side of the first connecting part, and a transmitter and a receiver are respectively arranged in opposite side surfaces of the transmitting part and the receiving part; The bottom ends of the first connecting rod and the second connecting rod are respectively and rotatably arranged at two sides of the bottom plate, and the top ends of the first connecting rod and the second connecting rod are respectively and fixedly connected with the two ends of the first connecting part; And the drive shaft of the driver is rotationally connected with the bottom end of the first connecting rod or the second connecting rod.
  2. 2. The wafer mapping mechanism of claim 1, wherein the base plate comprises: The mounting part is arranged opposite to the first connecting part, and the driver is arranged on the top surface of the mounting part; the bottom end of the first connecting rod is arranged at the outer side of the second connecting part and is connected with the driving shaft penetrating through the second connecting part; The third connecting part is arranged on the other side of the mounting part and opposite to the second connecting part, and the bottom end of the second connecting rod is rotatably arranged on the outer side of the second connecting part.
  3. 3. The wafer mapping mechanism according to claim 2, wherein first limiting blocks are arranged on the outer sides of the second connecting portions, and the number of the first limiting blocks is at least two and is respectively located on two sides of the bottom of the first connecting rod.
  4. 4. The wafer mapping mechanism according to claim 2, further comprising a rotating assembly including a rotating shaft and a bearing, wherein the rotating shaft is rotatably mounted in the third connecting portion, one end of the rotating shaft penetrates through an outer side surface of the third connecting portion and is connected with the bottom of the second connecting rod, and the bearing is sleeved on the outer side surface of the rotating shaft rotatably connected with the third connecting portion.
  5. 5. The wafer mapping mechanism according to claim 4, wherein the other end of the rotating shaft further penetrates through the inner side surface of the third connecting portion, and a baffle is arranged at the end; the inner side surface of the third connecting part is also provided with a first in-place sensor and a second in-place sensor respectively, and the baffle is also positioned between the first in-place sensor and the second in-place sensor; when the rotating shaft rotates to the maximum angle along the first direction, the blocking piece is blocked by the first in-place sensor, and when the rotating shaft rotates to the maximum angle along the opposite direction of the first direction, the blocking piece is blocked by the second in-place sensor.
  6. 6. The wafer mapping mechanism according to claim 3, wherein the first connecting rod comprises a first upright post and a first connecting rod, the bottom end of the first upright post is inserted into the top end of the first connecting rod, the top end of the first upright post is inserted into one side of the first connecting portion, and the first connecting rod is located between the two first limiting blocks and connected with the driving shaft.
  7. 7. The wafer mapping mechanism of claim 4, wherein the second link comprises a second upright post and a second link, wherein a top end of the second upright post is inserted into a top end of the second link, a top end of the second link is inserted into another side of the first link, and a top end side wall of the first link is connected to the rotating shaft.
  8. 8. A wafer storage system comprising a wafer mapping mechanism as claimed in any one of claims 1 to 7.
  9. 9. The wafer storage system of claim 8, further comprising a wafer cassette, a support frame, and a linear drive assembly, wherein the wafer cassette is disposed on top of the support frame and is configured to stack stored wafers therein, the linear drive assembly is disposed on a side of the support frame and is movable in an up-down direction, the wafer mapping mechanism is disposed on a side of the wafer cassette having an opening and is connected to the linear drive, and when the opening of the wafer cassette is opened, the drive of the wafer mapping mechanism drives the link assembly to rotate such that the transmitting end and the receiving end extend into the interior of the wafer cassette with at least a portion of the wafer therebetween.
  10. 10. The wafer storage system of claim 9, wherein the support frame comprises a horizontal bracket, a vertical bracket and a lateral bracket, the wafer box is arranged at the top of the horizontal bracket, the vertical bracket is arranged at the bottom of the horizontal bracket, the lateral bracket is arranged at one side of the horizontal bracket and the vertical bracket, a window corresponding to the opening is arranged at the top of the lateral bracket, the linear driving assembly comprises a door plate and a linear driver, the door plate is arranged on a vertical sliding rail arranged at the side surface of the lateral bracket, the wafer mapping mechanism is arranged on the door plate, and the linear driver is connected with the door plate to drive the door plate to move along the vertical sliding rail.

Description

Wafer mapping mechanism and wafer storage system Technical Field The invention relates to the field of wafer quality detection, in particular to a wafer mapping mechanism and a wafer storage system. Background In the field of semiconductor fabrication, wafers are typically stored in open front universal cassettes and transferred between different process modules. Before a wafer is accessed by a robot, it is necessary to detect the state of the wafer in the cassette, such as whether a wafer is present, whether a lamination or a bevel is occurring, etc., in a non-contact manner by a mapping operation. Accurate mapping is a key link for ensuring the safety of the process and improving the production efficiency and yield. At present, two types of technical schemes mainly exist for a mapping mechanism applied to a wafer loader. The first type of solution connects the mapping mechanism to the upper part of the door panel assembly of the load port, with its transmitting and receiving sensors fixed to two independent brackets, respectively. The structure has the defects that when the mapping mechanism moves along with the door plate or scans and swings by itself, the transmitting end and the receiving end positioned on the two independent brackets are difficult to maintain an accurate alignment relationship, and poor signal coupling is easily caused, so that the reliability of mapping data is affected. The second type of solution connects the mapping mechanism to the bottom of the door panel assembly. Although this structure alleviates the sensor alignment problem to some extent, the rigidity of the overall structure is insufficient due to the longer support frame supporting the mapping mechanism. In the motion process of the mapping mechanism, particularly when high-speed or high-precision scanning is performed, obvious shaking is easy to generate, so that the sensor beam path is unstable, and finally, the mapping result is inaccurate. Disclosure of Invention The invention aims to provide a wafer mapping mechanism and a wafer storage system, which can ensure accurate and stable alignment of sensors. Embodiments of the present invention are implemented as follows: In a first aspect, a wafer mapping mechanism of the present embodiment includes: A bottom plate; The top plate comprises a first connecting part, a transmitting part and a receiving part, and the first connecting part is arranged opposite to the bottom plate; the transmitting part and the receiving part are oppositely arranged on the same side of the first connecting part, and a transmitter and a receiver are respectively arranged in opposite side surfaces of the transmitting part and the receiving part; The bottom ends of the first connecting rod and the second connecting rod are respectively and rotatably arranged at two sides of the bottom plate, and the top ends of the first connecting rod and the second connecting rod are respectively and fixedly connected with the two ends of the first connecting part; And the drive shaft of the driver is rotationally connected with the bottom end of the first connecting rod or the second connecting rod. In a possible embodiment, the base plate includes: The mounting part is arranged opposite to the first connecting part, and the driver is arranged on the top surface of the mounting part; the bottom end of the first connecting rod is arranged at the outer side of the second connecting part and is connected with the driving shaft penetrating through the second connecting part; The third connecting part is arranged on the other side of the mounting part and opposite to the second connecting part, and the bottom end of the second connecting rod is rotatably arranged on the outer side of the second connecting part. In a possible implementation manner, the outer side of the second connecting portion is provided with first limiting blocks, and the number of the first limiting blocks is at least two and is respectively located at two sides of the bottom of the first connecting rod. In a possible implementation mode, the device further comprises a rotating assembly, wherein the rotating assembly comprises a rotating shaft and a bearing, the rotating shaft is rotatably arranged in the third connecting portion, one end of the rotating shaft penetrates through the outer side face of the third connecting portion and is connected with the bottom of the second connecting rod, and the bearing is sleeved on the outer side face of the rotating shaft, which is rotatably connected with the third connecting portion. In a possible implementation manner, the other end of the rotating shaft also penetrates through the inner side surface of the third connecting part, and a baffle is arranged at the end; the inner side surface of the third connecting part is also provided with a first in-place sensor and a second in-place sensor respectively, and the baffle is also positioned between the first in-place sensor and the second in-place sensor;