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CN-121985766-A - Chip packaging device and chip packaging method

CN121985766ACN 121985766 ACN121985766 ACN 121985766ACN-121985766-A

Abstract

The invention relates to the technical field of chip packaging, and provides a chip packaging device and a chip packaging method, wherein the chip packaging device comprises a base and a bonding machine, wherein the outer surface of the base is connected with a three-dimensional moving module, a conveying object of the three-dimensional moving module is a dispensing module, the outer surface of the base is connected with a heat control structure, the outer surface of the dispensing module is connected with a wire drawing prevention structure, the output end of the bonding machine is fixedly connected with a bonding head, and the outer surface of the bonding head is connected with a sparking structure; the three-dimensional moving module is used for realizing three-dimensional position adjustment of the dispensing module, the dispensing module is used for performing glue spraying, the heat control structure is used for controlling the temperature of a packaged area, and the wire drawing preventing structure is used for preventing residual colloid wire drawing after glue spraying. Through the technical scheme, the problem that the temperature of the traditional chip packaging device cannot be effectively controlled to be uniform when dispensing is carried out between the chip and the substrate, the final stability of the chip is easily reduced, and the final performance of the chip is uneven is solved.

Inventors

  • LIU CHANG
  • YU HUABO
  • LIU KEHAI

Assignees

  • 宏锐兴(湖北)电子有限责任公司

Dates

Publication Date
20260505
Application Date
20260210

Claims (10)

  1. 1. The chip packaging device is characterized by comprising a base (1) and a bonding machine (2), wherein the outer surface of the base (1) is connected with a three-dimensional moving module (3), a conveying object of the three-dimensional moving module (3) is a dispensing module (4), the outer surface of the base (1) is connected with a heat control structure (5), the outer surface of the dispensing module (4) is connected with a wire drawing prevention structure (6), the output end of the bonding machine (2) is fixedly connected with a bonding head (7), and the outer surface of the bonding head (7) is connected with a sparking structure (8); The three-dimensional moving module (3) is used for realizing three-dimensional position adjustment of the dispensing module (4), the dispensing module (4) is used for performing dispensing, the heat control structure (5) is used for controlling the temperature of a packaged area, the wire drawing preventing structure (6) is used for preventing residual colloid wire drawing after dispensing, and the firing structure (8) is used for precisely firing the head position of the metal wire; The heat control structure (5) comprises a sliding rail (51) fixedly connected to the outer surface of a base (1), a sliding plate (52) is connected to the outer surface of the sliding rail (51) in a sliding mode, a multistage electric cylinder (53) is fixedly connected to the inner side of the base (1), an underframe (54) is fixedly connected between the output end of the multistage electric cylinder (53) and the sliding plate (52), a movable box (55) is fixedly connected to the lower end of the sliding plate (52) through a support, a cylindrical fan (56) is rotatably connected to the inner portion of the movable box (55), a fan motor (57) is fixedly connected to the outer surface of the movable box (55) corresponding to one end of the cylindrical fan (56), a wind pipe (58) is fixedly connected to the upper end of the movable box (55), a concave groove (511) is formed in the outer surface of the sliding plate (52), a base plate (512) is arranged on the inner side of the sliding plate (52) corresponding to the concave groove (511), and a chip (513) is to be packaged on the surface of the base plate (512).
  2. 2. The chip packaging device according to claim 1, wherein a partition plate (59) and a heating pipe (510) are fixedly connected to the inside of the movable case (55), a vent hole (50) is formed in the outer surface of the sliding plate (52), and a metal wire (514) is fixedly connected between the chip (513) to be packaged and the substrate (512).
  3. 3. The chip packaging device according to claim 1, wherein the three-dimensional moving module (3) moves the subassembly, moves subassembly (36) and moves the subassembly perpendicularly, wherein, moves the subassembly including fixed connection in cross axle support (31) of base (1) surface, the surface swivelling joint of cross axle support (31) has cross axle lead screw (32), the surface of cross axle lead screw (32) has cup jointed cross movable frame (33), the surface fixedly connected with of cross movable frame (33) moves subassembly (36) longitudinally, be connected with drag chain (35) between the surface of cross axle support (31) and cross movable frame (33), the surface of cross axle support (31) is close to cross axle lead screw (32) end department fixedly connected with cross servo motor (34), drives cross axle lead screw (32) forward and reverse rotation through cross servo motor (34) and realizes that cross movable frame (33) slides along cross axle lead screw (32) length direction.
  4. 4. A chip packaging device according to claim 3, wherein the principle of the longitudinal moving assembly (36) and the principle of the vertical moving assembly for moving the dispensing module (4) are the same as the principle of the lateral moving assembly, the longitudinal moving assembly (36) is perpendicular to the moving direction of the lateral moving assembly, the lateral moving assembly is used for driving the longitudinal moving assembly (36) and the vertical moving assembly to move transversely, the longitudinal moving assembly (36) is used for driving the vertical moving assembly to move longitudinally, and the vertical moving assembly is used for driving the dispensing module (4) to move vertically.
  5. 5. The chip packaging device according to claim 3, wherein the dispensing module (4) comprises a glue dispensing bracket (41) fixedly connected to the surface of a vertical movable frame corresponding to the vertical moving component, the outer surface of the glue dispensing bracket (41) is fixedly connected with a glue dispensing machine (42), one end of the glue dispensing machine (42) is fixedly connected with a glue supply pipe (43), one end of the glue supply pipe (43) is fixedly connected with a glue outlet pipe (44), the outer surface of the glue supply pipe (43) is fixedly connected with a group of electromagnetic valves for controlling the inside of the glue supply pipe (43) to form a passage or a closed state, the wire drawing preventing structure (6) comprises a connecting pipe (61) fixedly connected to the outer surface of the glue supply pipe (43), one end of the connecting pipe (61) is fixedly connected with a recovery box (62), a fixing rod (63) is fixedly connected between the recovery box (62) and the glue dispensing bracket (41), the outer surface of the connecting pipe (61) is fixedly connected with a negative pressure generator (64) and a vacuum pump (65) respectively, and the top end of the recovery box (62) is fixedly connected with an exhaust valve (66).
  6. 6. The chip packaging device according to claim 1, wherein the sparking structure (8) comprises a collar (82) fixedly connected to the root surface of the bonding head (7), a miniature electric cylinder (83) is fixedly connected to the outer surface of the collar (82), a connecting support (84) is fixedly connected to the output end of the miniature electric cylinder (83), a sparking head (81) is fixedly connected to the outer surface of the connecting support (84), a wire is fixedly connected to the sparking head (81) and the top end of the bonding machine (2), and the sparking position is adjusted through extension and contraction of the miniature electric cylinder (83).
  7. 7. The chip packaging device according to claim 2, wherein the sliding plate (52) slides along the length direction of the sliding rail (51), one end of the multi-stage electric cylinder (53) far away from the output is fixedly connected with the base (1), the sliding plate (52) and the movement of the upper member thereof are regulated by the extension and contraction of the multi-stage electric cylinder (53), the cylindrical fan (56) is rotatably connected with the movable box (55) through a bearing, the output end of the fan motor (57) is fixedly connected with one end of the cylindrical fan (56), the fan motor (57) is used for driving the cylindrical fan (56) to rotate, and the air pipe (58) is communicated with the inside of the movable box (55).
  8. 8. The chip packaging device according to claim 7, wherein the number of the air pipes (58) is a plurality of groups and the air pipes are distributed in a linear array, the plurality of groups of air pipes (58) in a linear shape are used for air inlet, the air pipes (58) on the other side are used for air outlet, the heating pipe (510) is used for emitting proper heat, the heat sensor is arranged in the sliding plate (52), the amount of the heat emitted by the heating pipe (510) is determined according to the heat of the heat sensor, the substrate (512) is matched with the concave groove (511), the chip (513) to be packaged is in adhesion connection with the substrate (512), and a metal wire (514) is arranged at the connection point of the chip (513) to be packaged and the substrate (512).
  9. 9. Chip packaging device according to claim 5, characterized in that the glue dispenser (42) is adapted to supply a suitable amount of glue to the glue supply tube (43), the connection tube (61) is in communication with the interior of the glue supply tube (43), the recovery tank (62) is in communication with the other end of the connection tube (61), the fixing rod (63) is adapted to keep the position of the recovery tank (62) stable, the negative pressure generator (64) is adapted to realize a negative pressure in the tube of the connection tube (61), the vacuum pump (65) is adapted to pump the glue remaining in the glue supply tube (43) through the connection tube (61) to the interior of the recovery tank (62), the recovery tank (62) is adapted to store glue, and the exhaust valve (66) is adapted to balance the internal and external pressure of the recovery tank (62).
  10. 10. A chip packaging method, dispensing and bonding using the chip packaging device according to any one of claims 1 to 9, characterized in that the packaging method comprises the steps of: S1, wafer thinning and chip prefabrication, namely providing a wafer with the front end manufactured, and thinning the wafer to 50 by adopting a method combining mechanical grinding and chemical mechanical polishing Preparing a vertically interconnected Through Silicon Via (TSV) structure in a non-critical area of a chip functional area through laser ablation and wet etching process; S2, wafer cutting and chip sorting, namely, adopting an invisible cutting technology, focusing laser in the wafer to form a modified layer, realizing accurate separation of chips through stress expansion, avoiding damage of cutting lines, and carrying out electrical test and three-dimensional morphology scanning on the sorted bare chips; S3, chip mounting and interconnection, namely performing high-precision alignment mounting on the qualified bare chip and the transfer chip or the packaging substrate in a face-to-face manner by adopting a hot-press bonding and laser auxiliary positioning technology, realizing mechanical fixing and thermal management through a die bonding material, and completing primary electric connection of TSVs and substrate bonding pads; The transfer chip comprises a plurality of rewiring layers, wherein the linewidth/space of the rewiring layers is smaller than 2 mu m, and the rewiring layers are used for realizing high-density interconnection between chips with different sizes and different process nodes and supporting Chiplet heterogeneous integrated architecture; S4, high-density wire bonding and interface strengthening, namely, using copper-copper thermocompression bonding or gold-gold thermosonic bonding technology to realize high-density electrical interconnection between the chip and the substrate, and introducing anisotropic conductive adhesive or nano metal paste at the bonding interface to enhance the connection reliability and reduce the contact resistance; The key step S3 is that the chip mounting and the S4 wire bonding are completed in a hundred-grade clean workbench; The high-density wire bonding process introduces an online detection and correction system based on machine vision, monitors bonding morphology in real time, repairs bad welding spots by utilizing a laser fine tuning technology, and ensures that the bonding yield is more than 99.9%; S5, plastic package forming and structure reinforcement, namely adopting a transfer forming method, using epoxy resin molding compound filled with high heat conduction filler such as aluminum nitride or boron oxide to encapsulate the chip, presetting a micro-channel heat dissipation structure in the plastic package body, and optimizing stress distribution in the plastic package body through pressure and temperature control in the molding process; s6, thinning and rewiring, namely mechanically grinding and chemically and mechanically polishing the surface of the plastic package, thinning to a preset thickness and exposing TSV bumps, and then manufacturing a rewiring layer containing micron-sized line width/space on the surface of the plastic package through a semiconductor photoetching and electroplating process to realize high-density I/O fan-out; S7, ball placement and reflow soldering, wherein a solder ball array is formed on the surface of the rewiring layer through an electroplating or ball placement process, the forming and connection of the solder balls are completed through a multi-temperature-zone reflow soldering process, and the solder ball comprises low-melting-point Sn-Ag-Cu lead-free solder; s8, testing and screening, namely testing functions, performances and reliability of the packaged chips by adopting a non-contact probe card and a thermal resistance testing system, and grading and screening products according to test results; s9, laser marking and information tracing, namely etching permanent marks on the surface of the plastic package by using an ultraviolet laser marking system, wherein the mark content comprises product model, production batch number and traceable two-dimensional code information; S10, packaging and warehousing, namely placing the qualified product in an antistatic and dampproof special carrier tape, performing vacuum sealing, and finally warehousing and storing in a low-temperature drying environment.

Description

Chip packaging device and chip packaging method Technical Field The invention relates to the technical field of chip packaging, in particular to a chip packaging device and a chip packaging method. Background The chip packaging device is special equipment for protecting, connecting and packaging the manufactured semiconductor bare chip, and has the core effects of converting the fragile bare chip into a finished chip which can be mounted on a circuit board, and generally, the whole chip packaging process comprises wafer thinning, wafer cutting, chip mounting, wire bonding, plastic package molding, rib cutting molding, electroplating, testing, marking and packaging and warehousing. The chip packaging device and the chip packaging method with the authorized bulletin number of CN118213302B are specially suitable for manufacturing a semiconductor device, the chip packaging device comprises a bottom plate, one end of the bottom plate is provided with a positioning mechanism, the other end of the bottom plate is provided with a placing table, a transfer mechanism is arranged between the positioning mechanism and the placing table, the bottom plate is provided with a packaging mechanism, the positioning mechanism can position a packaging substrate, the chip packaging method adopts the chip packaging device to package a chip, packaging operation can be completed efficiently through the device and the method, and meanwhile, the connection effect between a packaging shell and the packaging substrate can be ensured after packaging; However, when dispensing is performed between a chip and a substrate, the existing chip packaging device cannot effectively control the temperature uniformity, and the final stability of the chip is easily reduced, so that the final performance of the chip is uneven. Disclosure of Invention The invention provides a chip packaging device and a chip packaging method, which solve the problems that the temperature of the traditional chip packaging device cannot be effectively controlled to be uniform when the traditional chip packaging device is used for dispensing between a chip and a substrate, the final stability of the chip is easily reduced, and the final performance of the chip is uneven. The technical scheme of the invention is as follows: The chip packaging device comprises a base and a bonding machine, wherein the outer surface of the base is connected with a three-dimensional moving module, a conveying object of the three-dimensional moving module is a dispensing module, the outer surface of the base is connected with a heat control structure, the outer surface of the dispensing module is connected with a wire drawing prevention structure, the output end of the bonding machine is fixedly connected with a bonding head, and the outer surface of the bonding head is connected with a sparking structure; The three-dimensional moving module is used for realizing three-dimensional position adjustment of the dispensing module, the dispensing module is used for performing dispensing, the heat control structure is used for controlling the temperature of a packaged area, the wire drawing preventing structure is used for preventing residual colloid wire drawing after dispensing, and the sparking structure is used for precisely sparking the head position of a metal wire; The heat control structure comprises a sliding rail fixedly connected to the outer surface of a base, a sliding plate is slidably connected to the outer surface of the sliding rail, a multistage electric cylinder is fixedly connected to the inner side of the base, an underframe is fixedly connected between the output end of the multistage electric cylinder and the sliding plate, a movable box is fixedly connected to the lower end of the sliding plate through a support, a cylindrical fan is rotatably connected to the inner part of the movable box, a fan motor is fixedly connected to one end of the outer surface of the movable box corresponding to the cylindrical fan, an air pipe is fixedly connected to the upper end of the movable box, a concave groove is formed in the outer surface of the sliding plate, a base plate is arranged at the inner side of the sliding plate corresponding to the concave groove, and a chip to be packaged is connected to the surface of the base plate. As a further technical scheme of the invention, the inside of the movable box is fixedly connected with a partition plate and a heating pipe respectively, the outer surface of the sliding plate is provided with a vent hole, and a metal wire is fixedly connected between the chip to be packaged and the substrate. According to the technical scheme, the three-dimensional moving module comprises a transverse moving assembly, a longitudinal moving assembly and a vertical moving assembly, wherein the transverse moving assembly comprises a transverse shaft support fixedly connected to the outer surface of a base, a transverse shaft screw rod is rotatably connected to th