CN-121985768-A - Wafer frame jig and wafer surface detection method

CN121985768ACN 121985768 ACN121985768 ACN 121985768ACN-121985768-A

Abstract

The application provides a wafer frame jig and a wafer surface detection method. The wafer frame jig is used for bearing and fixing a wafer and comprises a rigid frame and a flexible sheet. The rigid frame includes an outer frame portion and a central portion. The outer frame portion surrounds the central portion. The outer frame part is of a solid structure, and the central part is of a hollow structure. The flexible sheet is connected to the rigid frame and covers the central portion of the rigid frame. The flexible sheet includes a wafer contact surface. The wafer contact surface is for direct contact with a wafer and is non-tacky. The wafer is placed in the region of the central portion of the rigid frame.

Inventors

WU ZONGEN
CHEN JIANSHENG

Assignees

弘塑科技股份有限公司

Dates

Publication Date: 20260505
Application Date: 20241030

Claims (10)

1. The utility model provides a wafer frame tool for bear and fix the wafer, its characterized in that includes: a rigid frame including an outer frame and a central part, wherein the outer frame surrounds the central part, the outer frame has a solid structure, the central part has a hollow structure, and A flexible sheet connected to and covering the central portion of the rigid frame, wherein the flexible sheet includes a wafer contact surface for direct contact with a wafer and is non-tacky, and the wafer is placed in the region of the central portion of the rigid frame.
2. The wafer frame jig of claim 1, wherein the material of the flexible sheet comprises silicone.
3. The wafer frame jig of claim 1, wherein the flexible sheet comprises a plurality of first openings, the wafer frame jig and the wafer are stacked on a vacuum chuck, and the wafer is vacuum-adsorbed on the wafer frame jig through the plurality of first openings.
4. The wafer frame jig of claim 3, wherein the flexible sheet includes a plurality of second openings, the plurality of first openings and the plurality of second openings are each disposed in a region in contact with the wafer, the second openings are sized larger than the first openings, and the second openings allow pins to pass through to separate the wafer from the wafer frame jig.
5. The wafer frame jig of claim 1, wherein the wafer contact surface has a plurality of radially arranged bosses formed thereon, and the wafer is in contact with top surfaces of the plurality of bosses.
6. A method for inspecting a surface of a wafer, comprising: providing a wafer frame jig according to any one of claims 1 to 5; stacking the wafer frame jig and a wafer on a vacuum chuck of a single wafer processing apparatus, wherein the wafer frame jig is placed between the wafer and the vacuum chuck; performing wet processing on the wafer by the single wafer processing device; Separating the wafer frame jig from the wafer, and The wafer is placed on a detection device to detect a surface property of the wafer after wet processing.
7. The wafer surface inspection method of claim 6, further comprising, prior to stacking the wafer frame jig and the wafer on the vacuum chuck of the single wafer processing apparatus: placing the wafer frame jig on a positioning device; and placing the wafer on the flexible sheet of the wafer frame jig through the positioning device.
8. The wafer surface inspection method of claim 7, wherein the flexible sheet of the wafer frame jig includes a wafer contact surface on which a plurality of bosses are formed in a radial arrangement, and wherein in the step of placing the wafer on the flexible sheet of the wafer frame jig by the positioning device, further comprising: And placing the wafer on the wafer contact surface of the flexible sheet of the wafer frame jig through the positioning device.
9. The wafer surface inspection method of claim 6, wherein the wafer frame jig includes a plurality of first openings, and further comprising, after stacking the wafer frame jig and the wafer on the vacuum chuck of the single wafer processing apparatus: And applying vacuum adsorption force through the vacuum chuck to fix the wafer frame jig, and enabling the wafer to be adsorbed on the wafer frame jig in vacuum by utilizing the plurality of first holes.
10. The method of claim 6, wherein the wafer frame jig includes a plurality of second openings, and the step of separating the wafer frame jig from the wafer further comprises: placing the wet processed wafer frame jig and the wafer together on a separation device, wherein the separation device comprises a plurality of ejector pins capable of moving longitudinally; and controlling the plurality of ejector pins to move upwards and touch the wafer through the plurality of second openings so as to separate the wafer from the wafer frame jig.

Description

Wafer frame jig and wafer surface detection method Technical Field The present application relates to the field of semiconductor manufacturing, and in particular, to a wafer frame jig and a wafer surface detection method. Background In the semiconductor manufacturing process, since some apparatuses cannot directly adsorb a wafer on a vacuum chuck, a film frame (film-frame) must be used to fix the wafer. Specifically, the conventional method is to place a wafer on a vacuum chuck of an apparatus for metal etching after bonding the wafer to a film frame. However, the conventional inspection apparatus cannot directly measure the metal film thickness of the wafer attached to the thin film frame. In order to obtain accurate measurement results, the wafer must be separated from the film frame prior to measurement. This separation step not only increases the burden and complexity of the manufacturing process, but may also lead to wafer damage, thereby affecting wafer performance and yield. Therefore, there is an urgent need to develop new methods to simplify the operational flow, improve measurement accuracy, and reduce the risk of potential damage. In view of the foregoing, it is desirable to provide a wafer frame fixture and a wafer surface inspection method for solving the above-mentioned problems. Disclosure of Invention In order to solve the above-mentioned problems in the prior art, an object of the present application is to provide a wafer frame fixture and a wafer surface inspection method, which can effectively avoid the risk of wafer damage caused by separating wafers and film frames adhered together. The application provides a wafer frame jig which is used for bearing and fixing a wafer and comprises a rigid frame and a flexible sheet, wherein the rigid frame comprises an outer frame part and a central part, the outer frame part surrounds the central part, the outer frame part is of a solid structure, the central part is of a hollowed-out structure, the flexible sheet is connected with the rigid frame and covers the central part of the rigid frame, the flexible sheet comprises a wafer contact surface, the wafer contact surface is used for being in direct contact with the wafer and is not sticky, and the wafer is placed in the area of the central part of the rigid frame. In some embodiments, the material of the flexible sheet comprises silicone. In some embodiments, the flexible sheet includes a plurality of first openings, the wafer frame jig and the wafer are stacked on a vacuum chuck, and the wafer is vacuum-adsorbed on the wafer frame jig through the plurality of first openings. In some embodiments, the flexible sheet includes a plurality of second openings, the plurality of first openings and the plurality of second openings are each disposed in a region in contact with the wafer, the second openings are sized larger than the first openings, and the second openings allow a thimble to pass therethrough to separate the wafer from the wafer frame jig. In some embodiments, the wafer contact surface has a plurality of radially arranged bosses formed thereon, and the wafer is in contact with top surfaces of the plurality of bosses. In a second aspect, the application provides a wafer surface inspection method comprising providing a wafer frame jig as described above, stacking the wafer frame jig and a wafer on a vacuum chuck of a single wafer processing apparatus, wherein the wafer frame jig is placed between the wafer and the vacuum chuck, performing wet processing on the wafer by the single wafer processing apparatus, separating the wafer frame jig and the wafer, and placing the wafer on an inspection apparatus to inspect surface characteristics of the wafer after the wet processing. In some embodiments, before stacking the wafer frame jig and the wafer on the vacuum chuck of the single wafer processing apparatus, the method further comprises placing the wafer frame jig on a positioning device and placing the wafer on a flexible sheet of the wafer frame jig by the positioning device. In some embodiments, the flexible sheet of the wafer frame jig includes a wafer contact surface having a plurality of radially arranged bosses formed thereon, and in the step of placing the wafer on the flexible sheet of the wafer frame jig by the positioning device, the method further includes placing the wafer on the wafer contact surface of the flexible sheet of the wafer frame jig by the positioning device. In some embodiments, the wafer frame jig includes a plurality of first openings, and after stacking the wafer frame jig and the wafer on the vacuum chuck of the single wafer processing apparatus, further includes applying a vacuum suction force through the vacuum chuck to secure the wafer frame jig, and vacuum-sucking the wafer on the wafer frame jig using the plurality of first openings. In some embodiments, the wafer frame jig comprises a plurality of second holes, and the step of separating the wafer frame jig from