CN-121985770-A - Wafer receiving mechanism and wafer processing equipment

CN121985770ACN 121985770 ACN121985770 ACN 121985770ACN-121985770-A

Abstract

The invention provides a wafer receiving mechanism and wafer processing equipment, the wafer receiving mechanism comprises a sealing cavity, a receiving assembly, a lifting assembly, an adjusting assembly and a welding corrugated pipe. According to the wafer receiving mechanism, the adjusting assembly which is arranged outside the sealing cavity and consists of the first adjusting seat and the second adjusting seat is arranged and connected with the connecting piece penetrating through the bottom of the sealing cavity, so that the horizontal positions of all PIN receiving needles can be integrally adjusted, the same receiving mechanism can adapt to the supporting requirements of a plurality of wafers with different sizes, and the technical problems of poor equipment compatibility, complicated mold changing and positioning deviation risks caused by the fact that the positions of the PIN receiving needles in the horizontal direction are fixed in the prior art are effectively solved.

Inventors

LU CHAO
XIE JIAJIAN
LIN ZHENZHANG
LIU LIN

Assignees

环诚智能装备(成都)有限公司

Dates

Publication Date: 20260505
Application Date: 20260129

Claims (10)

1. The utility model provides a wafer receiving mechanism which characterized in that includes: the bottom of the sealing cavity is provided with a mounting channel; the material receiving assembly is arranged in the sealing cavity, and comprises a bearing plate, a connecting piece and a plurality of PIN material receiving needles arranged on the upper surface of the bearing plate, wherein the upper end of the connecting piece is connected with the lower surface of the bearing plate; the lifting assembly is arranged outside the sealing cavity and is used for outputting vertical reciprocating motion; The adjusting assembly is arranged outside the sealing cavity and connected to the output end of the lifting assembly so as to be driven to reciprocate vertically, and comprises a first adjusting seat and a second adjusting seat, wherein the first adjusting seat is configured to be operated to move along a first horizontal direction, the second adjusting seat is connected to the first adjusting seat and configured to be operated to move along a second horizontal direction, and the lower end of the connecting piece penetrates through the mounting channel and is provided with a fixing part connected to the second adjusting seat; The upper end of the welding corrugated pipe is connected with the outer surface of the sealing cavity in a sealing mode, the lower end of the welding corrugated pipe is connected with the fixing portion in a sealing mode, and the connecting piece penetrates through the welding corrugated pipe.
2. The wafer receiving mechanism of claim 1, further comprising a leveling mechanism, the leveling mechanism comprising: The leveling plate is arranged at the outer bottom of the sealing cavity; the lifting component is arranged on the leveling plate; The end parts of the fixing screws penetrate through the leveling plate and are connected with the bottom wall of the sealing cavity, and the fixing screws are used for fixing the leveling plate and the sealing cavity when in locking; The leveling screws are connected to the leveling plate along vertical threads, and the end parts of the leveling screws are propped against the bottom wall of the sealing cavity; The upper end of the pre-tightening spring is connected with the lower surface of the leveling plate, and the lower end of the pre-tightening spring is connected with the head of the corresponding leveling screw.
3. The wafer receiving mechanism according to claim 2, wherein the leveling screws are in one-to-one correspondence with the PIN receiving needles, and the setting positions of the leveling screws on the leveling plates are corresponding to the projection positions of the corresponding PIN receiving needles on a horizontal plane.
4. The wafer receiving mechanism of claim 2, wherein the lifting assembly comprises: A motor; The transmission screw rod is in transmission connection with the motor through a synchronous belt transmission assembly so as to be driven to rotate; the movable seat can slide vertically and is in threaded fit with the transmission screw rod, and the adjusting assembly is connected to the movable seat.
5. The wafer receiving mechanism of claim 4, wherein the lifting assembly further comprises a connecting frame connected to the leveling plate, and the motor, the transmission screw and the synchronous belt transmission assembly are all arranged on the connecting frame.
6. The wafer receiving mechanism of claim 5, wherein the connecting frame comprises a vertical extension and a horizontal extension; The upper end of the vertical extension part is connected to the leveling plate, and the lower end of the vertical extension part is connected to the horizontal extension part; The motor and the transmission screw rod are both arranged at the top of the horizontal extension part and are respectively positioned at two sides of the vertical extension part in the horizontal direction; the synchronous belt transmission assembly is arranged at the bottom of the horizontal extension part.
7. The wafer stocker according to claim 1, wherein said carrier plate is rotatably connected to said connector such that said carrier plate is operable to rotate in a horizontal plane.
8. The wafer receiving mechanism according to claim 1 or 7, wherein the carrier plate includes connection portions and mounting portions in one-to-one correspondence with the PIN receiving PINs; The connecting part is connected to the connecting piece, the mounting part extends outwards from the side wall of the connecting part along the horizontal direction, and the PIN receiving needle is arranged at the tail end of the corresponding mounting part.
9. The wafer receiving mechanism of claim 1, wherein the top of the PIN receiving needle is a flat bottom structure.
10. A wafer processing apparatus comprising a wafer receiving mechanism according to any one of claims 1 to 9.

Description

Wafer receiving mechanism and wafer processing equipment Technical Field The invention relates to the technical field of semiconductor processing equipment, in particular to a wafer receiving mechanism and wafer processing equipment. Background The statements in this section merely provide background information related to the present disclosure and may not constitute prior art. In semiconductor manufacturing processes, wafers require various processing treatments within a vacuum chamber, such as thin film deposition, etching, bonding, and the like. The wafer receiving mechanism is used as a key component of partial wafer processing equipment, and is used for receiving wafers in a vacuum environment and accurately conveying the wafers to a processing station, and the performance of the wafer receiving mechanism directly influences the positioning accuracy, the process stability and the product yield of the wafer receiving mechanism. At present, a common wafer receiving mechanism generally adopts a fixed PIN receiving needle array design, a plurality of PIN receiving needles are fixedly installed on a bearing plate, and the taking and the placing of wafers are realized through integral lifting. This design has a fundamental limitation in that since the carrier plate and PIN receiving PINs are fixed in position in the horizontal direction, the positions of the contact points for supporting wafers are fixed, and the optimal support point positions required for wafers of different sizes are different. For example, for an 8 inch wafer, a set of specifically distributed support points is required to ensure stable loading and uniform force, while for a 12 inch wafer, the absolute position of the support points will be offset outward as a whole. When a fixed-position receiving mechanism of a PIN receiving needle in the horizontal direction tries to adapt to wafers of different sizes, the situation that the positions of supporting points are not matched with the required supporting areas of the wafers often occurs, so that the wafers are concentrated in stress and unstable in placement, and even offset or damage occurs in the lifting process. Under the condition, if wafers with various sizes are required to be processed, only different material receiving mechanisms can be replaced, so that the equipment utilization rate is reduced, the mold changing time is prolonged, and the equipment cost and the maintenance complexity are also improved. In addition, in a vacuum environment, the stability and position accuracy requirements of the wafer support are higher, the fixed support mode is difficult to adapt to the dimensional tolerance and the installation deviation of the wafer, and the process consistency is easy to reduce and the yield is easy to lose. Disclosure of Invention Accordingly, a first objective of the present invention is to provide a wafer receiving mechanism, which at least overcomes the above-mentioned problems of the conventional receiving mechanism with PIN receiving PINs fixed in position in the horizontal direction. The second object of the present invention is to provide a wafer processing apparatus using the wafer receiving mechanism. The aim of the invention is achieved by the following technical scheme: In a first aspect, the present invention provides a wafer receiving mechanism, comprising: the bottom of the sealing cavity is provided with a mounting channel; the material receiving assembly is arranged in the sealing cavity, and comprises a bearing plate, a connecting piece and a plurality of PIN material receiving needles arranged on the upper surface of the bearing plate, wherein the upper end of the connecting piece is connected with the lower surface of the bearing plate; the lifting assembly is arranged outside the sealing cavity and is used for outputting vertical reciprocating motion; The adjusting assembly is arranged outside the sealing cavity and connected to the output end of the lifting assembly so as to be driven to reciprocate vertically, and comprises a first adjusting seat and a second adjusting seat, wherein the first adjusting seat is configured to be operated to move along a first horizontal direction, the second adjusting seat is connected to the first adjusting seat and configured to be operated to move along a second horizontal direction, and the lower end of the connecting piece penetrates through the mounting channel and is provided with a fixing part connected to the second adjusting seat; The upper end of the welding corrugated pipe is connected with the outer surface of the sealing cavity in a sealing mode, the lower end of the welding corrugated pipe is connected with the fixing portion in a sealing mode, and the connecting piece penetrates through the welding corrugated pipe. Optionally, the wafer receiving mechanism further includes a leveling mechanism, and the leveling mechanism includes: The leveling plate is arranged at the outer bottom of the sealing cavity; t