CN-121985773-A - Processing method, system and equipment for square wafer

CN121985773ACN 121985773 ACN121985773 ACN 121985773ACN-121985773-A

Abstract

The application discloses a processing method, a system and equipment of a square wafer, wherein the processing method comprises the steps of obtaining coordinate data of four straight edges of the square wafer, and performing straight line fitting based on the coordinate data to determine a first straight line analytic type corresponding to the four straight edges; determining four first intersection points of the first straight line analytic formulas intersecting each other based on the first straight line analytic formulas corresponding to the four straight edges; the center of the square wafer is determined based on the four first intersection points. The system and the apparatus are capable of performing the above-described processing method. With the above arrangement, the center of the square wafer can be determined.

Inventors

ZHU LIANG
LI YANGJIAN
ZHAO ZHIPENG
XIAN ZEWEN
GUO XINGLAI

Assignees

浙江晶盛机电股份有限公司

Dates

Publication Date: 20260505
Application Date: 20251229

Claims (10)

1. A method of processing a square wafer, comprising: acquiring coordinate data of four straight edges of a square wafer, and performing linear fitting based on the coordinate data to determine a first linear analysis type corresponding to the four straight edges; determining four first intersection points of the first straight line analytic formulas intersecting each other based on the first straight line analytic formulas corresponding to the four straight edges; And determining the center of the square wafer based on the four first intersection points.
2. The method for processing a square wafer according to claim 1, wherein, The determining the center of the square wafer based on the four first intersection points includes: determining a second straight line analytic expression based on the two opposite first intersection points, and determining a second intersection point based on the second straight line analytic expression, wherein the second intersection point is the center of the square wafer; or, the determining the center of the square wafer based on the four first intersection points includes: determining the center of the square wafer based on the midpoint of the connecting line of the two opposite first intersection points; or, the determining the center of the square wafer based on the four first intersection points includes: Determining the center of the square wafer based on the average value of the coordinates of the four first intersection points; or, the determining the center of the square wafer based on the four first intersection points includes: acquiring the midpoint of the intersection points of two adjacent first intersection points, and connecting the midpoint of two opposite intersection points to form two midpoint connecting lines; And determining the center of the square wafer based on the intersection point of the two midpoint connecting lines.
3. The method for processing a square wafer according to claim 1, wherein, The performing straight line fitting based on the coordinate data to determine a first straight line analytic expression corresponding to the four straight edges includes: Performing straight line fitting based on the coordinate data to determine a first analytic expression corresponding to the four straight edges; Obtaining a first distance from each point in the coordinate data to a straight line based on the coordinate data and the first analytic expression; Based on a preset distance, partial coordinate data, of which the first distance is smaller than the preset distance, in the coordinate data are acquired; and performing linear fitting based on the partial coordinate data to determine a second analytic expression corresponding to the four straight edges, wherein the second analytic expression is the first linear analytic expression.
4. A method for processing a square wafer according to claim 3, wherein, The four first intersection points are four intersection points of the second analytic expression which are intersected in pairs.
5. The method for processing a square wafer according to claim 1, wherein, The acquiring the coordinate data of four straight sides of the square wafer comprises the following steps: Placing the square wafer in a rotating mechanism, and driving the square wafer to rotate through the rotating mechanism; acquiring first data from four straight edges to a detection mechanism when the square wafer rotates, and acquiring second data from the rotation center of the rotation mechanism to the detection mechanism; The coordinate data is determined based on the first data and the second data.
6. The method for processing a square wafer according to claim 5, wherein, The determining the coordinate data based on the first data and the second data includes: Determining first coordinate data of the four straight sides in a polar coordinate system based on the difference between the second data and the first data; And determining the coordinate data under a plane rectangular coordinate system based on the first coordinate data.
7. The method for processing a square wafer according to claim 6, wherein, The performing straight line fitting based on the coordinate data to determine a first straight line analytic expression corresponding to the four straight edges includes: the coordinate data is fitted linearly based on a least square method to determine the first linear resolution.
8. The method for processing a square wafer according to claim 1, wherein, The acquiring the coordinate data of four straight sides of the square wafer comprises the following steps: Scanning the square wafer to obtain position data of four straight edges of the square wafer; And determining the coordinate data of the four straight sides of the square wafer under a plane rectangular coordinate system based on the position data.
9. A system for processing a square wafer, comprising: the acquisition module can acquire coordinate data of four straight edges of the square wafer; The computing module can conduct straight line fitting based on the coordinate data to determine a first straight line analytic expression corresponding to the four straight edges, can determine four first intersection points of the first straight line analytic expression intersecting each other based on the first straight line analytic expression corresponding to the four straight edges, and can determine the center of the square wafer based on the four first intersection points.
10. A computer device, comprising: a memory storing program instructions; a processor which, when executing the program instructions stored on the memory, implements the method of processing a square wafer according to any one of claims 1 to 8.

Description

Processing method, system and equipment for square wafer Technical Field The present application relates to the field of semiconductor manufacturing technology, and in particular, to a method and a system for processing a square wafer, and a computer device. Background Wafers are important materials in semiconductor fabrication, which are carrier substrates for the fabrication of integrated circuit chips. In the related art, square chips are used instead of wafers, and square chips have a higher utilization ratio than wafers. However, existing wafer centering methods are not compatible with die, so that there is no semiconductor processing equipment suitable for square die. Therefore, how to determine the center of a square wafer is a technical problem that needs to be solved by those skilled in the art. Disclosure of Invention In order to solve the defects in the prior art, the application aims to provide a processing method, a processing system and processing equipment for square wafers, which can determine the center of the square wafers. In a first aspect, an embodiment of the present application provides a method for processing a square wafer, including: Acquiring coordinate data of four straight edges of a square wafer, and performing straight line fitting based on the coordinate data to determine a first straight line analytic formula corresponding to the four straight edges; determining four first intersection points of the first straight line analytic formulas intersecting each other based on the first straight line analytic formulas corresponding to the four straight edges; The center of the square wafer is determined based on the four first intersection points. In one possible implementation, determining the center of the square wafer based on the four first intersections includes: determining a second straight line analytic expression based on the two opposite first intersection points, and determining a second intersection point based on the second straight line analytic expression, wherein the second intersection point is the center of the square wafer; or, based on the four first intersection points, determining the center of the square wafer includes: Determining the center of the square wafer based on the midpoint of the connecting line of the two opposite first intersection points; or, based on the four first intersection points, determining the center of the square wafer includes: determining the center of the square wafer based on the average value of the coordinates of the four first intersection points; or, based on the four first intersection points, determining the center of the square wafer includes: Acquiring the midpoint of the intersection point of two adjacent first intersection points, and connecting the midpoint of two opposite intersection points to form two midpoint connecting lines; the center of the square wafer is determined based on the intersection of the two midpoint lines. In a possible implementation manner, performing straight line fitting based on the coordinate data to determine a first straight line analytic expression corresponding to the four straight sides includes: Performing straight line fitting based on the coordinate data to determine a first analytic expression corresponding to the four straight edges; Obtaining a first distance from each point in the coordinate data to a straight line based on the coordinate data and the first analytic expression; Based on the preset distance, partial coordinate data of which the first distance is smaller than the preset distance in the coordinate data are acquired; and performing linear fitting based on the partial coordinate data to determine a second analytic expression corresponding to the four straight edges, wherein the second analytic expression is the first linear analytic expression. In one possible implementation, the four first intersections are four intersections of the second analytical formula that intersect two by two. In one possible implementation, acquiring coordinate data of four straight sides of a square wafer includes: Placing the square wafer in a rotating mechanism, and driving the square wafer to rotate through the rotating mechanism; acquiring first data from four straight edges to the detection mechanism when the square wafer rotates, and acquiring second data from the rotation center of the rotation mechanism to the detection mechanism; Coordinate data is determined based on the first data and the second data. In one possible implementation, determining the coordinate data based on the first data and the second data includes: determining first coordinate data of four straight sides in a polar coordinate system based on the difference between the second data and the first data; And determining coordinate data under the plane rectangular coordinate system based on the first coordinate data. In a possible implementation manner, performing straight line fitting based on the coordinate data to det