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CN-121985774-A - Semiconductor centering device and method

CN121985774ACN 121985774 ACN121985774 ACN 121985774ACN-121985774-A

Abstract

The invention provides a semiconductor centering device and a method, wherein the semiconductor centering device comprises a positioning mechanism and an aligning mechanism, the positioning mechanism comprises a fixed seat, a plurality of guide rods which are slidably arranged on the fixed seat in a penetrating manner, a correcting piece which is fixedly arranged at one end of the guide rods towards the center of a carrying disc, a groove which is arranged on the fixed seat and used for accommodating the correcting piece, and a first elastic piece which is abutted between the fixed seat and the correcting piece, wherein the first elastic piece is used for exerting pretightening force on the correcting piece, and the positioning mechanism and the aligning mechanism are driven by a driving mechanism to do radial translation motion relative to the center of the carrying disc so as to enable the two positioning posts to abut against the edges of a wafer and a carrying disc, and the correcting piece is clamped into a unfilled corner of the wafer and the carrying disc or abuts against the edges of the wafer and the carrying disc in the groove. The semiconductor centering device and the method solve the technical problems that the unfilled corner and concentric circle alignment of the wafer and the slide glass cannot be realized in the prior art, and the unfilled corner and edge breakage of the wafer or the slide glass are easy to cause.

Inventors

  • YU QI
  • Yang Maoshuai
  • Xin Xuanba

Assignees

  • 苏州芯睿科技有限公司

Dates

Publication Date
20260505
Application Date
20260407

Claims (10)

  1. 1. A semiconductor centering device performs corner-missing and concentric alignment of a wafer and a carrier, The device is characterized by comprising a carrying disc, two groups of positioning mechanisms and one group of alignment mechanisms, wherein the two groups of positioning mechanisms and the one group of alignment mechanisms are annularly arranged on the outer side of the carrying disc and distributed around the axis of the carrying disc at equal angles, and a driving mechanism; The positioning mechanism comprises a positioning column; The aligning mechanism comprises a fixed seat, a plurality of guide rods, a correcting piece and a first elastic piece, wherein the guide rods are slidably arranged in the fixed seat in a penetrating manner, the correcting piece is fixedly arranged at one end of the guide rods, which faces the center of the carrying disc, the groove is formed in the fixed seat to accommodate the correcting piece, the first elastic piece is abutted between the fixed seat and the correcting piece, and the first elastic piece is used for applying pretightening force to the correcting piece; The positioning mechanism and the alignment mechanism are driven by the driving mechanism to do radial translation motion relative to the center of the carrier disc so as to be propped against the edges of the wafer and the carrier sheet by the two positioning columns, and the correction piece is clamped into the unfilled corner of the wafer and the carrier sheet or is propped against the edges of the wafer and the carrier sheet in the groove.
  2. 2. The semiconductor centering device of claim 1, wherein, An end of the guide rod, which is far away from the correcting piece, is provided with external threads; the alignment mechanism further comprises an adjusting piece with internal threads, and the adjusting piece is arranged at one end of the guide rod, which is far away from the correcting piece, and is propped against the fixing seat; The internal thread of the adjusting piece is meshed with the external thread of the guide rod, the adjusting piece is rotated to change the axial position of the adjusting piece on the guide rod, so that the distance between the correcting piece and the fixing seat is adjusted, and the pretightening force of the first elastic piece is set.
  3. 3. The semiconductor centering device of claim 1, wherein, The fixing seat comprises a supporting part penetrated by the guide rod and an accommodating part which is arranged on the supporting part and forms the groove; The correcting piece comprises a connecting part and a correcting column, wherein the connecting part is fixedly arranged at one end of the guide rod and connected with the first elastic piece, and the correcting column is vertically arranged at the connecting part and can be accommodated in the groove; the two positioning columns and the correction column are distributed around the axis of the carrier plate at equal angles.
  4. 4. The semiconductor centering device of claim 2, wherein, The pretightening force of the first elastic piece is configured to be contained in the groove by resistance generated by the abutting when the correcting piece abuts against the edge of the wafer or the slide, and can drive the correcting piece to be clamped into the unfilled corner when the correcting piece moves to a position corresponding to the unfilled corner of the wafer or the slide.
  5. 5. The semiconductor centering device of claim 1, wherein, The semiconductor centering device also comprises a base arranged below the carrier plate along the axial direction and a fixing ring coaxially arranged below the carrier plate and fixedly arranged on the base; The alignment mechanism and each positioning mechanism comprise a transmission assembly; the positioning mechanism further comprises a bearing block, and the positioning column is vertically arranged on the bearing block; The transmission assembly comprises a guide rail which is arranged on the outer side of the fixed ring and extends along the radial direction, a sliding block which is guided on the guide rail to move along the radial direction, and a connecting rod which is vertically arranged on the sliding block to connect the fixed seat or the bearing block.
  6. 6. The semiconductor centering device of claim 5, The semiconductor centering device also comprises a driving rotating wheel coaxially arranged below the fixed ring, wherein the driving rotating wheel is controlled by the driving mechanism to rotate relative to the base; The driving rotating wheel is configured into three arc-shaped guide grooves which are distributed around the axis of the carrying disc at equal angles, the sliding block penetrates through the lower surface of one end of the fixed ring to vertically arrange guide rods, and the guide rods penetrate through the arc-shaped guide grooves; the driving mechanism drives the driving rotating wheel to rotate, the arc-shaped guide groove pushes the guide rod to enable the sliding block to approach or depart from the center of the carrying disc, and the positioning column and the correcting piece move along with the sliding block.
  7. 7. The semiconductor centering device of claim 6, wherein, The semiconductor centering device also comprises a driving wheel coaxially arranged below the driving rotating wheel and rotating relative to the base, a first driving rod vertically arranged on the upper surface of the driving wheel, a second driving rod vertically arranged on the lower surface of the driving rotating wheel, and a second elastic piece with two ends respectively connected with the first driving rod and the second driving rod; The driving mechanism comprises a driving unit, a third transmission rod eccentrically arranged with an output shaft of the driving unit, a fourth transmission rod vertically arranged on the lower surface of the transmission wheel, and a push rod, wherein two ends of the push rod are respectively and rotatably connected with the third transmission rod and the fourth transmission rod; The driving wheel is driven by the driving mechanism, and the first transmission rod applies elastic driving force to the second transmission rod through the second elastic piece so as to drive the driving rotating wheel to rotate and drive the sliding block to move along the radial direction.
  8. 8. A semiconductor centering method for performing unfilled corner and concentric alignment of a wafer with a carrier using the semiconductor centering device according to any one of claims 1 to 7, comprising: S1, placing a slide on a carrying disc; s2, starting a driving mechanism, driving an aligning mechanism and two groups of positioning mechanisms to move towards the center of the carrying disc, enabling a positioning column to prop against the first edge of the slide, enabling a correcting piece to be clamped into a first unfilled corner of the slide, and aligning the first unfilled corner of the slide; S3, after the first unfilled corner of the slide is aligned, starting a driving mechanism, and driving the aligning mechanism and the two groups of positioning mechanisms to move in a direction away from the center of the carrier disc so as to enable the correcting piece to withdraw from the first unfilled corner of the slide; s4, stacking the wafer on the aligned slide glass; S5, starting the driving mechanism, driving the aligning mechanism and the two groups of positioning mechanisms to move towards the center of the carrying disc, enabling the two positioning columns to simultaneously support the second edge of the wafer and the first edge of the carrying disc, enabling the correcting piece to be clamped into the second unfilled corner of the wafer and the first unfilled corner of the carrying disc, aligning the second unfilled corner of the wafer and the first unfilled corner of the carrying disc, and centering concentric circles of the wafer and the carrying disc.
  9. 9. The method of semiconductor centering as claimed in claim 8, wherein, The aligning the first unfilled corner of the slide comprises: s21, when a first unfilled corner of the slide and the position of the correcting piece are partially offset, the correcting piece can be clamped into the first unfilled corner of the slide under the action of the pretightening force of the first elastic piece so as to execute alignment; s22, when the first unfilled corner of the slide and the position of the correcting piece are completely offset to abut against the first edge of the slide, the first elastic piece is compressed, so that the correcting piece is accommodated in the groove; the aligning the second unfilled corner of the wafer with the first unfilled corner of the slide comprises: s51, when the second unfilled corner of the wafer and the position of the correcting piece are partially offset, the correcting piece can be clamped into the second unfilled corner of the wafer and the first unfilled corner of the slide under the action of the pretightening force of the first elastic piece so as to execute contraposition; S52, when the second unfilled corner of the wafer and the position of the correcting piece are completely offset to abut against the second edge of the wafer, the first elastic piece is compressed, so that the correcting piece is accommodated in the groove.
  10. 10. The method of semiconductor centering as claimed in claim 9, wherein, In the step S22, when the first unfilled corner of the slide and the position of the correcting element are completely offset to abut against the first edge of the slide, the first elastic element is compressed to enable the correcting element to be accommodated in the groove, and the step further includes: S221, starting the driving mechanism, and driving the aligning mechanism and the two groups of positioning mechanisms to move in a direction away from the center of the carrier disc so as to reset the aligning mechanism and the two groups of positioning mechanisms to an initial avoiding position; s222, readjusting the circumferential position of the slide on the carrier plate; s223, re-executing the step S2; in the step S52, when there is a complete deviation between the second unfilled corner of the wafer and the position of the correction member to abut against the second edge of the wafer, the first elastic member is compressed to enable the correction member to be accommodated in the groove, and the step further includes: s521, starting the driving mechanism, driving the aligning mechanism and the two groups of positioning mechanisms to move in a direction away from the center of the carrier disc so as to reset the aligning mechanism and the two groups of positioning mechanisms to an initial avoiding position; S522, readjusting the circumferential position of the wafer on the carrier sheet; s523, re-executing step S5.

Description

Semiconductor centering device and method Technical Field The present invention relates to the field of semiconductor technologies, and in particular, to a semiconductor centering device and method. Background In ultra-thin wafer processing, small arcuate notches (Notch) in the wafer edge are a critical structural feature. The Notch angle position corresponds to the crystal orientation of the wafer strictly, and is a standard positioning Notch for ensuring accurate matching of patterns and crystal orientations in the processes of photoetching, etching, ion implantation and the like. In the processes of wafer thinning, temporary bonding-unbinding, wafer transferring and the like, because the ultra-thin wafer is extremely low in self rigidity and cannot be directly transmitted and processed, the ultra-thin wafer is attached to a glass carrier through temporary bonding glue, the glass is used as a rigid support to complete the subsequent processes, unbinding and separating are carried out after the processes are completed, and an alignment mark is prefabricated on the glass carrier, so that double alignment is realized with the Notch angle of the wafer and the center of the wafer. However, in the prior art, when the wafer or the carrier is subjected to unfilled corner (i.e. Notch angle) alignment, when the unfilled corner of the wafer or the carrier is partially offset from the alignment member, the alignment member cannot correct the unfilled corner of the wafer or the carrier and is easy to generate rigid contact to cause unfilled corner edge breakage of the wafer or the carrier, and when the unfilled corner of the wafer or the carrier is completely offset from the alignment member and the alignment member directly abuts against the edge of the wafer or the carrier, the alignment member is easy to rigidly collide with the edge of the wafer or the carrier to cause edge breakage, so that the unfilled corner and concentric circle alignment of the wafer and the carrier cannot be realized. It should be noted that the foregoing description of the background art is only for the purpose of providing a clear and complete description of the technical solution of the present invention and is presented for the convenience of understanding by those skilled in the art. The above-described solutions are not considered to be known to the person skilled in the art simply because they are set forth in the background of the invention section. Disclosure of Invention The invention aims to disclose a semiconductor centering device and a method, which are used for solving the technical problems that the prior art cannot realize unfilled corner and concentric circle alignment on a wafer and a slide and the unfilled corner and edge of the wafer or the slide are easy to collapse. In order to achieve the above object, in a first aspect, the present invention provides a semiconductor centering device for performing unfilled corner and concentric circle alignment on a wafer and a carrier, comprising a carrier, two sets of positioning mechanisms and a set of alignment mechanisms, wherein the two sets of positioning mechanisms and the set of alignment mechanisms are annularly arranged outside the carrier and distributed around the axis of the carrier at equal angles, and a driving mechanism; The positioning mechanism comprises a positioning column; The aligning mechanism comprises a fixed seat, a plurality of guide rods, a correcting piece and a first elastic piece, wherein the guide rods are slidably arranged in the fixed seat in a penetrating manner, the correcting piece is fixedly arranged at one end of the guide rods, which faces the center of the carrying disc, the groove is formed in the fixed seat to accommodate the correcting piece, the first elastic piece is abutted between the fixed seat and the correcting piece, and the first elastic piece is used for applying pretightening force to the correcting piece; The positioning mechanism and the alignment mechanism are driven by the driving mechanism to do radial translation motion relative to the center of the carrier disc so as to be propped against the edges of the wafer and the carrier sheet by the two positioning columns, and the correction piece is clamped into the unfilled corner of the wafer and the carrier sheet or is propped against the edges of the wafer and the carrier sheet in the groove. As a further improvement of the invention, the end of the guide rod remote from the correcting element is constructed with an external thread; the alignment mechanism further comprises an adjusting piece with internal threads, and the adjusting piece is arranged at one end of the guide rod, which is far away from the correcting piece, and is propped against the fixing seat; The internal thread of the adjusting piece is meshed with the external thread of the guide rod, the adjusting piece is rotated to change the axial position of the adjusting piece on the guide rod, so that the distance