CN-121985776-A - Wafer processing machine with positioning structure
Abstract
The application relates to the field of semiconductor processing, and discloses a wafer processing machine with a positioning structure, which comprises a machine case, wherein storage boxes are arranged in the machine case, are arranged in two groups and are symmetrically distributed on the left side and the right side of an inner cavity of the machine case, a plurality of groups of supports II and a plurality of groups of supports I with the same number are respectively fixedly connected on the upper side and the lower side of the inner wall of the storage boxes, a rotating shaft I and a conveying roller I are rotatably arranged in the supports I, and a rotating shaft II and a conveying roller II are rotatably arranged in the supports II. The material loading strip of this device sets up to the multiunit and encircle in the outside of belt, and when the pivot was first through belt drive transport roller one rotated, the material loading strip can carry out the centre gripping and upwards drive through cyclic motion to the wafer body that is located a conveyer belt upper surface to realize the continuous feed supplement function of wafer body, saved the step that the storage box changed the cloth, made the work efficiency of device obtain showing and promote.
Inventors
- DING JIAN
- HOU KAIYAO
- ZHANG SHICHENG
- DING MENG
- GAO FENG
Assignees
- 苏州冠礼科技股份有限公司
- 冠礼控制科技(上海)有限公司
Dates
- Publication Date
- 20260505
- Application Date
- 20260209
Claims (8)
- 1. The wafer processing machine with the positioning structure comprises a machine case (1), and is characterized in that the interior of the machine case (1) is respectively provided with A processing area (2) positioned at the rear side of the interior of the cabinet (1); The mechanical arm (3) is positioned in front of the processing area (2), and a sucker (4) is fixedly arranged at the tail end of the mechanical arm (3); The storage box (8) is arranged into two groups, the storage box is symmetrically distributed on the left side and the right side of the inner cavity of the machine case (1), the upper side and the lower side of the inner wall of the storage box (8) are fixedly connected with a plurality of groups of supports II (19) and a plurality of groups of supports I (12) respectively, a rotating shaft I (13) and a transporting roller I (14) are installed in the inner rotation of the support I (12), a rotating shaft II (20) and a transporting roller II (21) are installed in the inner rotation of the support II (19), a belt (23) is connected to the outer surface transmission of the transporting roller I (14) and the transporting roller II (21), a plurality of groups of feeding strips (24) which are distributed at equal intervals are fixedly connected to the outer surface of the belt (23), a wafer body (11) is placed at the top of the feeding strips (24), a group of motors (18) are installed on the side surfaces of the support I (12), and the motors (18) are connected to the rotating shaft I (13) in a transmission mode.
- 2. The wafer processing machine with the positioning structure according to claim 1, wherein the left side and the right side of the machine case (1) are provided with material openings, two groups of material openings are internally provided with a first conveyor belt (5) and a second conveyor belt (6) which are positioned under the material storage box (8) respectively, the transportation directions of the first conveyor belt (5) of the left group and the right group are consistent, and the transportation directions of the belt (23) and the feeding strip (24) of the left group and the right group are opposite.
- 3. The wafer processing machine with the positioning structure according to claim 2, wherein the first transporting roller (14) is fixedly sleeved on the outer surface of the first rotating shaft (13), two ends of the first rotating shaft (13) are fixedly connected with universal joints (25), one group of the universal joints (25) is fixedly connected with a first transmission shaft (16), the other group of the universal joints (25) is fixedly connected with a second transmission shaft (17), and the first transmission shaft (16) and the second transmission shaft (17) are in sliding connection through splines.
- 4. A wafer processing machine with positioning structure according to claim 3, characterized in that the loading bar (24) is made of rubber blocks and is adapted to abut against the outer surface of the wafer body (11).
- 5. The wafer processing machine with the positioning structure according to claim 4, wherein the feeding strip (24) comprises a support plate (241) fixedly connected to the outer side of the belt (23), a limit strip (242) is fixedly connected to the top of the support plate (241), the inner side of the limit strip (242) is fixedly connected to the outer side of the belt (23), and a hollow groove (243) is formed between the support plate (241) and the limit strip (242).
- 6. The wafer processing machine with the positioning structure according to claim 5, wherein an arc matched with the wafer body (11) is formed on one side, close to the wafer body (11), of the limiting strip (242), and an arc chamfer is formed at the top of the limiting strip (242).
- 7. The wafer processing machine with the positioning structure according to claim 6, wherein a protective shell (10) is fixedly connected to the top of the storage box (8), the protective shell (10) covers the outer sides of the second bracket (19), the second rotating shaft (20), the second conveying roller (21) and the second limiting ring (22), an outer cylinder (9) is fixedly connected to the outer surface of the storage box (8), a support column (7) is fixedly connected to the inner top of the case (1), and the outer cylinder (9) is inserted into the top end of the support column (7) in an adapting mode.
- 8. The wafer processing machine with the positioning structure according to claim 7, wherein the second conveying roller (21) is fixedly sleeved on the outer surface of the second rotating shaft (20), the first bracket (12) and the second bracket (19) are longitudinally and oppositely distributed, the first limiting rings (15) are fixedly connected to two sides of the outer surface of the first conveying roller (14), the second limiting rings (22) are fixedly connected to two sides of the outer surface of the second conveying roller (21), and the belt (23) is limited between the first limiting rings (15) and the second limiting rings (22).
Description
Wafer processing machine with positioning structure Technical Field The application relates to the technical field of semiconductor processing, in particular to a wafer processing machine with a positioning structure. Background In the wet processing process of the wafer, a transfer mechanism of the wafer is often required to be arranged, the wafer is required to be transported to each processing unit for corresponding processing, the wafer to be processed is required to be placed in the wafer box, multiple layers of wafers are required to be stacked in the wafer box so as to be subjected to pre-feeding before processing and storage work after processing, in the wet processing machine, a first layer of wafer positioned at the top of the wafer box can be sucked by a manipulator under the action of a tail end sucker and brought into a processing position, then the wafer is placed in another group of storage boxes after processing is finished, the integrated functions of taking, processing and blanking of the wafer are realized, in the prior art, the wafer box is lack of effective positioning and transporting modes, because the wafer is very fragile, a traditional rigid limiting structure damages the periphery of the wafer, and stores and places the wafer in an internal slotting mode in the right technology, but the mode not only limits the blanking efficiency (the manipulator needs to control the wafer to be in different positions), but also needs to repeatedly change the storage boxes and replace the wafer, the wafer is greatly reduced in the processing efficiency, and the new processing structure is required to be designed. Disclosure of Invention The application provides a wafer processing machine with a positioning structure, which has the advantage of high working efficiency and is used for solving the problem of low working efficiency in the prior art. The wafer processing machine with the positioning structure comprises a machine case, wherein the interior of the machine case is respectively provided with A processing area located at the rear side of the interior of the cabinet; the mechanical arm is positioned in front of the processing area, and the tail end of the mechanical arm is fixedly provided with a sucker; The storage boxes are arranged in two groups and symmetrically distributed on the left side and the right side of the inner cavity of the case, a plurality of groups of supports II and a plurality of groups of supports I with the same number are fixedly connected to the upper side and the lower side of the inner wall of the storage boxes respectively, a rotating shaft I and a conveying roller I are rotatably arranged in the supports I, a rotating shaft II and a conveying roller II are rotatably arranged in the supports II, belts are connected to the outer surfaces of the conveying roller I and the conveying roller II in a transmission manner, a plurality of groups of feeding strips which are distributed at equal intervals are fixedly connected to the outer surfaces of the belts, a wafer body is placed at the top of each feeding strip, a motor is arranged on the side face of each support I, and the motor is in transmission connection with the rotating shaft I; The device is redesigned, the high-efficient transfer function of wafer body has been realized, for this purpose, this device has set up four sets of support first and support second in the inside of storage box, the internally mounted of support first is by pivot first and transport roller first, the internally mounted of support second has pivot second and transport roller second, and be connected with the belt of going up and down between transport roller first and transport roller second, the multiunit material loading strip that utilizes fixed connection in the belt outside reciprocates along with the belt simultaneously, realize the wafer body and reciprocate the function at the storage box inner chamber, the material loading strip sets up to the multiunit and encircle in the outside of belt, when the pivot first passes through the belt and drives transport roller first and rotate, the material loading strip can carry out the centre gripping and upwards drive by the wafer body that is located a conveyer belt upper surface, thereby realize the continuous feed function of wafer body, the step of storage box change cloth has been saved, the work efficiency of device obtains showing and promotes. Then, this device utilizes the material loading strip equidistance to distribute in the surface of belt, the material loading strip passes through injection molding integrated into one piece, and the material loading strip comprises extension board and spacing, the interior step through the extension board forms supports the wafer body, simultaneously, utilize the inboard circular arc of spacing to fix a position the surface of wafer body and protect, utilize the circular arc chamfer at spacing top to guide the wafer body to place its top, t