CN-121985777-A - Support structure for bonding device and bonding device

Abstract

The application provides a support structure for a bonding device and the bonding device. The supporting structure comprises a supporting surface, wherein the supporting surface is used for supporting a structure to be bonded, an air passage is arranged in the supporting structure, the supporting structure is further provided with a plurality of channels which are arranged in a dispersed mode and are positioned on one side of the air passage, facing the supporting surface of the supporting structure, each channel is respectively communicated with the air passage and extends to the supporting surface, and the supporting structure is further provided with an air suction hole communicated with the air passage. The bonding equipment comprises a supporting structure, a crimping structure, a first base, a second base and a driving part, wherein the supporting structure is arranged on the first base, the crimping structure is arranged on the second base, and the driving part is used for driving the first base and/or the second base to move so that the crimping structure is in abutting connection with the top of the structure to be bonded.

Inventors

• LIU YU
• ZHANG XIAODONG
• ZHANG JIANNING
• CHEN BIN
• PAN XIAOFEI

Assignees

• 华润润安科技(重庆)有限公司
• 华润微电子控股有限公司

Dates

Publication Date

20260505

Application Date

20241030

Claims (10)

1. 1. A support structure for a bonding apparatus, the support structure comprising a support surface for supporting a structure to be bonded; The support structure is internally provided with an air passage, the support structure is also provided with a plurality of channels which are arranged in a dispersed way and are positioned on one side of the air passage, which faces to the support surface of the support structure, each channel is respectively communicated with the air passage and extends to the support surface, and the support structure is also provided with an air suction hole communicated with the air passage.
2. 2. The support structure for a bonding apparatus according to claim 1, wherein the support structure comprises a first support block and a second support block, wherein a receiving groove is formed in the top of the first support block, the second support block is arranged in the receiving groove of the first support block, the top surface of the second support block is the support surface, the material of the first support block is metal or metal alloy, and the material of the second support block is organic material.
3. 3. The support structure for a bonding apparatus according to claim 2, wherein each of the channels is provided in and penetrates the second support block, the air passage is located between the second support block and the bottom surface of the accommodation groove, and side surfaces of the second support block are fitted to side surfaces of the accommodation groove everywhere.
4. 4. The supporting structure for a bonding apparatus according to claim 3, wherein the bottom surface of the accommodation groove is provided with a plurality of projections arranged at intervals, the bottom surface of the second supporting block abuts against each of the projections, a space between the second supporting block and the bottom surface of the accommodation groove and between adjacent projections is the air passage, and an orthographic projection of each of the passages on the bottom surface of the accommodation groove at least partially falls outside an orthographic projection of each of the projections on the bottom surface of the accommodation groove.
5. 5. The support structure for a bonding apparatus according to claim 4, wherein an orthographic projection of each of the channels on a bottom surface of the receiving groove does not overlap with an orthographic projection of each of the projections on the bottom surface of the receiving groove.
6. 6. A support structure for a bonding apparatus according to claim 3, wherein the material of the second support block is an elastic material, and the side of the second support block is interference fit with the side of the receiving groove.
7. 7. The support structure for a bonding apparatus according to claim 1, further comprising a one-way flow element within the gas extraction aperture, the one-way flow element configured such that gas of the gas channel may flow out through the one-way flow element.
8. 8. The support structure for a bonding apparatus of claim 2, wherein a top surface of the second support block exceeds a top surface of the first support block.
9. 9. The support structure for a bonding apparatus according to claim 2, wherein the second support block is detachably disposed in the accommodation groove, and/or, The thickness range of the second supporting block is 3 mm-7 mm.
10. 10. A bonding device, characterized in that the bonding device comprises the support structure for the bonding device, a crimping structure, a first base, a second base and a driving part, wherein the support structure is arranged on the first base, the crimping structure is arranged on the second base, and the driving part is used for driving the first base and/or the second base to move so that the crimping structure is abutted against the top of a structure to be bonded.

Description

Support structure for bonding device and bonding device Technical Field The present application relates to the field of semiconductor technologies, and in particular, to a supporting structure for a bonding device and a bonding device. Background In a conventional semiconductor packaging technology, for example, in a chip packaging process, a chip is first mounted on a DBC (Direct Bond Copper, copper-clad) substrate, wherein the DBC substrate and a lead frame are soldered together, and then two ends of a bonding wire are soldered to the chip and pins of the lead frame respectively by using a bonding device. The bonding apparatus includes a metal support structure on which the DBC substrate is placed during the bonding process, and a crimp structure that abuts the leadframe to prevent movement of the DBC substrate and the leadframe relative to the bonding apparatus. When bonding is performed by using the existing bonding equipment, the bonding wire has poor welding effect with the chip and the lead frame, and the quality of products is affected. Disclosure of Invention The embodiment of the application provides a supporting structure for bonding equipment and the bonding equipment. A first aspect of an embodiment of the present application provides a support structure for a bonding apparatus. The support structure comprises a support surface, wherein the support surface is used for supporting a structure to be bonded; The support structure is internally provided with an air passage, the support structure is also provided with a plurality of channels which are arranged in a dispersed way and are positioned on one side of the air passage, which faces to the support surface of the support structure, each channel is respectively communicated with the air passage and extends to the support surface, and the support structure is also provided with an air suction hole communicated with the air passage. In one embodiment of the application, the supporting structure comprises a first supporting block and a second supporting block, wherein an accommodating groove is formed in the top of the first supporting block, the second supporting block is arranged in the accommodating groove of the first supporting block, the top surface of the second supporting block is the supporting surface, the first supporting block is made of metal or metal alloy, and the second supporting block is made of organic material. In one embodiment of the application, each channel is arranged on the second supporting block and penetrates through the second supporting block, the air channel is positioned between the second supporting block and the bottom surface of the accommodating groove, and the side surface of the second supporting block is attached to the side surface of the accommodating groove everywhere. In one embodiment of the application, the bottom surface of the accommodating groove is provided with a plurality of convex blocks which are arranged at intervals, the bottom surface of the second supporting block is abutted against each convex block, the space between the second supporting block and the bottom surface of the accommodating groove and between the adjacent convex blocks is the air passage, and the orthographic projection of each passage on the bottom surface of the accommodating groove at least partially falls outside the orthographic projection of each convex block on the bottom surface of the accommodating groove. In one embodiment of the present application, the orthographic projection of each channel on the bottom surface of the receiving groove is not overlapped with the orthographic projection of each bump on the bottom surface of the receiving groove. In one embodiment of the present application, the material of the second supporting block is an elastic material, and the side surface of the second supporting block is in interference fit with the side surface of the receiving groove. In one embodiment of the application, the support structure further comprises a unidirectional flow element within the suction aperture, the unidirectional flow element being configured such that gas of the airway can flow out through the unidirectional flow element. In one embodiment of the application, the top surface of the second support block exceeds the top surface of the first support block. In one embodiment of the application, the second support block is removably disposed within the receiving slot, and/or, The thickness range of the second supporting block is 3 mm-7 mm. The second aspect of the embodiment of the application provides bonding equipment, which comprises the supporting structure for the bonding equipment, a crimping structure, a first base, a second base and a driving part, wherein the supporting structure is arranged on the first base, the crimping structure is arranged on the second base, and the driving part is used for driving the first base and/or the second base to move so that the crimping structure is abutted