CN-121985779-A - Vacuum chuck and preparation method thereof

CN121985779ACN 121985779 ACN121985779 ACN 121985779ACN-121985779-A

Abstract

The application discloses a vacuum chuck and a preparation method thereof, and belongs to the technical field of wafer processing. The vacuum chuck includes a first body, a second body, a support structure, and a connection layer. The second main body is arranged opposite to the first main body, at least one of the side surfaces of the first main body and the second main body facing each other is provided with a flow channel concaved along the first direction, and one side of the second main body, which is away from the first main body, is used for bearing a wafer. The support structure is located between the first body and the second body, and the support structure supports the first body and the second body. The connecting layer is located between the first main body and the second main body, the first main body and the second main body are connected through the connecting layer, the connecting layer is located on at least one side of the supporting structure, and the connecting layer, the supporting structure and the runner are adjacently arranged along at least two of projections of the first direction in the same plane. The support structure of the application can improve the tightness of the flow channel and the uniformity of heat exchange and the consistency of adsorption capacity.

Inventors

Jia Huaiming
DUAN HENGSHAN
YANG PENG
HAN YU
GUO HONGFEI
Yuan Hexuan

Assignees

北京华卓精科科技股份有限公司

Dates

Publication Date: 20260505
Application Date: 20251217

Claims (11)

1. A vacuum chuck, comprising: A first body; The second main body is arranged opposite to the first main body, at least one of the side surfaces of the first main body and the second main body facing each other is provided with a flow channel recessed along a first direction, one side of the second main body, which is opposite to the first main body, is used for bearing wafers, and the first direction is the arrangement direction of the first main body and the second main body; A support structure located between the first body and the second body, the support structure supporting the first body and the second body; The connecting layer is positioned between the first main body and the second main body, the first main body and the second main body are connected through the connecting layer, the connecting layer is positioned on at least one side of the supporting structure, and the connecting layer, the supporting structure and the runner are adjacently arranged along at least two of projections of the first direction in the same plane.
2. The vacuum chuck of claim 1, wherein the support structure comprises a plurality of support sections spaced apart in a direction perpendicular to the first direction.
3. The vacuum chuck of claim 2, wherein the plurality of support portions are arranged in an annular array with the vacuum chuck along a geometric center of a plane perpendicular to the first direction.
4. A vacuum chuck according to claim 2 wherein at least some of the plurality of support sections have a decreasing cross-sectional area in a first plane directed by the first body in the direction of the second body and/or, The first main body points to the direction of the second main body, and at least part of the supporting parts in the plurality of supporting parts have the same sectional area on a first plane, wherein the first plane is perpendicular to the first direction.
5. The vacuum chuck of claim 2, wherein the flow channel comprises a first section and a second section, each of the first section and the second section being disposed about a geometric center of the vacuum chuck along a plane perpendicular to the first direction, and the first section and the second section being disposed in sequence away from the geometric center, the plurality of support sections comprising a first support section between the first section and the second section, the distance between the first support section and the first section being equal to the distance between the first support section and the second section along the direction of alignment of the first section and the second section.
6. The vacuum chuck of claim 2, wherein the plurality of support portions includes a second support portion having a projected contour along the first direction that partially coincides with a projected contour of the flow channel along the first direction.
7. The vacuum chuck of claim 1, wherein the support structure comprises a first support section and a second support section, the first support section being disposed in the first body, the second support section being disposed in the second body, the first support section and the second support section being disposed opposite one another along the first direction.
8. The vacuum chuck of claim 1, wherein a dimension of the support structure in the first direction is equal to a dimension of the connection layer in the first direction.
9. A method of manufacturing a vacuum chuck for use in manufacturing a vacuum chuck according to any one of claims 1 to 8, comprising: Carrying out multilayer printing on one side of at least a first main body and a second main body by using a mask plate to form a prefabricated layer, wherein the prefabricated layer is formed in a hollowed-out area of the mask plate, a supporting structure and a runner are both positioned in a mask area of the mask plate, at least one of the mutually facing sides of the first main body and the second main body is provided with the runner concavely formed along a first direction, one side of the second main body, which is opposite to the first main body, is used for bearing a wafer, and the supporting structure supports the first main body and the second main body; Performing first grinding treatment on the surface of the prefabricated layer; Performing a first heating treatment on the preformed layer after the first grinding treatment, wherein the first heating treatment comprises a first heating temperature which is greater than the liquidus temperature of the preformed layer; Performing a second grinding treatment on the surface of the prefabricated layer after the first heating treatment; The first main body and the second main body are oppositely arranged, the prefabricated layer after the second grinding treatment is subjected to second heating treatment to form a connecting layer, the second heating treatment comprises a second heating temperature, the second heating temperature is larger than the liquidus temperature of the prefabricated layer, the connecting layer is located on at least one side of the supporting structure, the connecting layer, the supporting structure and the runner are adjacently arranged along any two of projections of the first direction in the same plane, and the first direction is the arrangement direction of the first main body and the second main body.
10. The method of manufacturing according to claim 9, comprising: the step of sequentially forming the prefabricated layer on at least one side of the first main body and the second main body by using the mask plate comprises the following steps: And printing a composite layer on at least one side of the first main body and the second main body, wherein the material of the composite layer comprises a connecting material for forming the prefabricated layer and spheres for forming a supporting structure, and the melting temperature of the connecting material is smaller than that of the spheres.
11. The method of claim 10, wherein the joining material comprises borosilicate glass.

Description

Vacuum chuck and preparation method thereof Technical Field The application relates to the technical field of wafer processing, in particular to a vacuum chuck and a preparation method thereof. Background This section provides merely background information related to the invention, which is not necessarily prior art. At present, in semiconductor manufacturing, a semiconductor chip needs to be processed, and a wafer to be processed needs to be fixed, supported and moved through a sucker in a related process, so that high-precision positioning is ensured, and smooth processing is ensured. In order to keep the wafer in a high-precision surface shape and improve the processing quality and efficiency, the sucker needs to have the functions of adsorption and heat exchange, namely an air passage (realizing vacuum adsorption) and a water passage (namely a heat exchange passage, collectively called a runner) which are processed in the sucker are key to realizing the functions, and the processing precision of the runner directly influences the adsorption stability and the heat exchange efficiency. At present, the built-in runner of the sucker mostly adopts the scheme of split processing of upper and lower discs and precise sealing, namely, firstly, the upper and lower discs are respectively processed into an air passage, a water passage and a sealing groove through milling and other processes, and then the upper and lower discs are welded and sealed into a whole to form a complete runner. However, during welding, solder easily flows into the inner walls of the air passage and the water channel to form an uneven film layer, so that the cross section of the channel is irregularly changed, the heat is prevented from being uniformly transferred, the heat exchange effect is greatly reduced, the temperature cannot be accurately controlled, the stability of the adsorbed air flow is destroyed, the adsorption effect is reduced, the positioning accuracy of the wafer is affected, and the processing quality is reduced. Disclosure of Invention The application aims to at least solve the problem that solder flows into the inner walls of an air passage and a water channel to form an uneven film layer. This object is achieved by: a first aspect of the present application proposes a vacuum chuck comprising: A first body; the second main body is arranged opposite to the first main body, at least one of the side surfaces of the first main body and the second main body facing each other is provided with a flow channel concaved along a first direction, and one side of the second main body, which is away from the first main body, is used for bearing a wafer; the first direction is the arrangement direction of the first main body and the second main body; A support structure located between the first body and the second body, the support structure supporting the first body and the second body; the connecting layer is located between the first main body and the second main body, the first main body and the second main body are connected through the connecting layer, the connecting layer is located on at least one side of the supporting structure, and the connecting layer, the supporting structure and the runner are adjacently arranged along at least two of projections of the first direction in the same plane. According to the vacuum chuck, the supporting structure is arranged between the first main body and the second main body, the supporting structure, the connecting layer and the runner are adjacently arranged, so that the supporting structure and the connecting layer are positioned in the connecting area between the first main body and the second main body, the supporting structure can support the first main body and the second main body, the possibility that the connecting layer is extruded by the second main body in the preparation process is reduced, the possibility that the connecting layer is extruded into the runner in the preparation process is reduced, the connecting layer is kept in the connecting area under the action of self surface tension in the preparation process, the connection reliability of the connecting layer is improved, the sealing performance of the runner is improved, the uniformity of heat exchange and the consistency of adsorption capacity are improved, and the processing quality of wafers is improved. In some embodiments, the support structure includes a plurality of support portions spaced apart along a direction perpendicular to the first direction. In some embodiments, the plurality of support portions are arranged in an annular array with the vacuum chuck along a geometric center of a plane perpendicular to the first direction. In some embodiments, at least some of the plurality of support portions have a cross-sectional area that gradually decreases in a first plane from the first body toward the second body, and/or at least some of the plurality of support portions have a cross-sectional area that is the