CN-121985780-A - Ceramic manipulator jig sheet processing and positioning device for carrying wafers and processing method

Abstract

The invention discloses a processing and positioning device and a processing method for a ceramic manipulator jig slice for carrying wafers, and aims to provide the processing and positioning device and the processing method for the ceramic manipulator jig slice for carrying the wafers, which have good universality and stable positioning, and can effectively control the surface micro-deformation generated in the fixing process of the ceramic manipulator jig slice, so that the processing precision of products is improved, and the processing qualification rate of the products is improved. The ceramic manipulator jig piece processing and positioning device for carrying wafers comprises a porous ceramic vacuum chuck, a UV adhesive tape, a pressing piece, a jig piece abdicating port, a pressing piece, a ceramic manipulator jig piece and a ceramic manipulator jig piece, wherein the porous ceramic vacuum chuck is provided with an adsorption plane, one surface of the UV adhesive tape is an adhesive surface, the other surface of the UV adhesive tape is a non-adhesive surface, the UV adhesive tape is adsorbed and fixed on the adsorption plane of the porous ceramic vacuum chuck through the non-adhesive surface, the pressing piece is provided with the jig piece abdicating port, the pressing piece is attached to the adhesive surface of the UV adhesive tape and covers the edge of the UV adhesive tape, and the ceramic manipulator jig piece is attached to the adhesive surface of the UV adhesive tape and is positioned in the jig piece abdicating port.

Inventors

• LIU YUPENG
• CAI DEQI
• SHI QINGWANG

Assignees

• 杭州大和江东新材料科技有限公司

Dates

Publication Date

20260505

Application Date

20251218

Claims (10)

1. 1. Ceramic manipulator jig piece processing positioner of transport wafer, characterized by includes: the porous ceramic vacuum chuck is provided with an adsorption plane; the UV adhesive tape is fixedly adsorbed on the adsorption plane of the porous ceramic vacuum chuck through the non-adhesive surface; The preforming is provided with the fixture piece mouth of stepping down on the preforming, and the preforming laminating is on the stickness face of UV sticky tape, and the edge of preforming cover UV sticky tape, and ceramic manipulator fixture piece laminating is on the stickness face of UV sticky tape and be located the fixture piece mouth of stepping down, and ceramic manipulator fixture piece wait to process the face and be carried back to the stickness face.
2. 2. The ceramic robot tool chip processing and positioning device for handling wafers according to claim 1, wherein the shape of the UV tape is matched with the adsorption plane, and the UV tape just covers the adsorption plane.
3. 3. The wafer handling ceramic robot tool tile processing fixture of claim 2, wherein the shape of the tile matches the UV tape and the edge of the tile is aligned with the edge of the UV tape.
4. 4. The wafer handling ceramic robot tool tile processing fixture of claim 2, wherein the shape of the tile matches the UV tape, the edge of the tile extends beyond the edge of the UV tape, and the edge of the tile is adjacent to the edge of the UV tape.
5. 5. The positioning device for processing the ceramic manipulator jig sheet for carrying the wafer according to claim 1,2,3 or 4, wherein the thickness of the pressing sheet is smaller than the interval between the surface to be processed of the ceramic manipulator jig sheet and the adhesive surface of the UV tape.
6. 6. The ceramic manipulator jig slice processing and positioning device for carrying wafers according to claim 1,2, 3 or 4, wherein the jig slice yielding openings are one or more, and one ceramic manipulator jig slice is arranged in each jig slice yielding opening.
7. 7. The ceramic manipulator jig sheet processing and positioning device for carrying wafers according to claim 1 or 2 or 3 or 4, wherein the thickness of the UV tape is 0.1 mm or less.
8. 8. The ceramic manipulator jig sheet processing and positioning device for carrying wafers according to claim 1,2, 3 or 4, wherein the jig sheet yielding port is matched with the ceramic manipulator jig sheet in shape.
9. 9. A method for processing a ceramic manipulator jig sheet by using the ceramic manipulator jig sheet processing and positioning device for carrying wafers according to any one of claims 1 to 8, comprising the steps of: Attaching a pressing sheet to the adhesive surface of the UV adhesive tape, wherein the pressing sheet covers the edge of the UV adhesive tape; Attaching the ceramic manipulator jig piece to the adhesive surface of the UV adhesive tape and positioning the ceramic manipulator jig piece in the jig piece abdication port; The UV adhesive tape is laid on an adsorption plane through a non-sticky surface, the porous ceramic vacuum chuck is fixed on a processing platform of a machine tool, then a vacuum gas path of the porous ceramic vacuum chuck is opened, and the UV adhesive tape is adsorbed and fixed on the adsorption plane of the porous ceramic vacuum chuck; and then, processing the surface to be processed of the ceramic manipulator jig sheet.
10. 10. The method for processing the ceramic manipulator jig sheet according to claim 9, further comprising the steps of: And closing a vacuum gas path of the porous ceramic vacuum chuck, taking down the ceramic manipulator jig sheet, the pressing sheet and the UV adhesive tape which are processed, putting the ceramic manipulator jig sheet, the pressing sheet and the UV adhesive tape into a UV adhesive remover together for adhesive removal, taking out the ceramic manipulator jig sheet, the pressing sheet and the UV adhesive tape, and separating the ceramic manipulator jig sheet from the UV adhesive tape.

Description

Ceramic manipulator jig sheet processing and positioning device for carrying wafers and processing method Technical Field The invention relates to the technical field of semiconductor processing equipment, in particular to a ceramic manipulator jig piece processing and positioning device for carrying wafers and a processing method. Background In the processing process of the wafer, if the wafer is manually conveyed, the processing efficiency is low, the accuracy of the wafer reaching the designated processing position cannot be ensured, and the negative influence on the granularity in the environment is large. Therefore, at present, a ceramic machine manipulator with higher automation degree is mostly adopted to carry the wafer. When the ceramic machine manipulator conveys the wafer, the wafer is adsorbed through the ceramic manipulator jig sheet (the wafer is adsorbed on the surface of the ceramic manipulator jig sheet through vacuum), and then the wafer is conveyed. The ceramic manipulator has wide market prospect in the semiconductor industry, but the carrying robot has low load and high speed, so the requirements on the lightening of the ceramic manipulator and the flatness accuracy of the jig sheet are very high. For processing of thin ceramic plates such as ceramic manipulator jig plates, the main current processing modes in the market at present are wax-sticking processing and vacuum jig direct adsorption processing, wherein the positioning flatness and stability of the ceramic manipulator jig plates in the wax-sticking processing are poor, and the vacuum jig direct adsorption processing often has uneven adsorption force, so that the ceramic manipulator jig plates are adsorbed and deformed, the ceramic manipulator jig plates with higher flatness are difficult to obtain in the two processing positioning schemes at present, the ceramic manipulator jig plates are required to be repeatedly corrected frequently, and the productivity efficiency and the processing precision of the products are greatly influenced. For example, chinese patent publication No. CN103286275A, entitled single crystal guide vane ceramic core positioning method, the specific positioning method is that in the overname of wax mould combination, the large end of the core is square, after wax brushing, conical positioning points with bottom diameter of 3mm are made on four surfaces, the conical positioning points contact the core, the shape is formed by using conical drill, the rotation of the core is limited after shell making, at the same time, 1-2mm thick wax is brushed in length direction, the wax is uniformly brushed at the exhaust side of the rear cavity core, and the paint is brushed at the square position formed. This application uses a wax-sticking process which also suffers from the problems described above. Disclosure of Invention The invention aims to provide the processing and positioning device and the processing method for the ceramic manipulator jig sheet for carrying wafers, which have the advantages of good universality and stable positioning, and can effectively control the surface micro-deformation generated in the fixing process of the ceramic manipulator jig sheet, so that the processing precision of products is improved, and the processing qualification rate of the products is improved. The technical scheme of the invention is as follows: a ceramic manipulator jig piece processing positioning device for carrying wafers, comprising: the porous ceramic vacuum chuck is provided with an adsorption plane; the UV adhesive tape is fixedly adsorbed on the adsorption plane of the porous ceramic vacuum chuck through the non-adhesive surface; The preforming is provided with the fixture piece mouth of stepping down on the preforming, and the preforming laminating is on the stickness face of UV sticky tape, and the edge of preforming cover UV sticky tape, and ceramic manipulator fixture piece laminating is on the stickness face of UV sticky tape and be located the fixture piece mouth of stepping down, and ceramic manipulator fixture piece wait to process the face and be carried back to the stickness face. The ceramic manipulator jig sheet processing and positioning device for carrying wafers is specifically used as follows, The porous ceramic vacuum chuck is fixed on a processing platform of a machine tool, the adsorption plane of the porous ceramic vacuum chuck faces upwards, and the adsorption plane has higher planeness (the planeness of the adsorption plane is within 0.005 mm). The adhesive surface of the UV adhesive tape is used for strong adhesion, so that the pressing sheet and the ceramic manipulator jig piece can be firmly adhered to the adhesive surface of the UV adhesive tape; The UV adhesive tape is fixedly adsorbed on an adsorption plane of the porous ceramic vacuum chuck through an non-adhesive surface, the strength, the physical and chemical properties and the porosity of the porous ceramic vacuum chuck are high,